JPS58223310A - Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal - Google Patents

Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal

Info

Publication number
JPS58223310A
JPS58223310A JP57107145A JP10714582A JPS58223310A JP S58223310 A JPS58223310 A JP S58223310A JP 57107145 A JP57107145 A JP 57107145A JP 10714582 A JP10714582 A JP 10714582A JP S58223310 A JPS58223310 A JP S58223310A
Authority
JP
Japan
Prior art keywords
tab terminal
mounting plate
tab
jig
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57107145A
Other languages
Japanese (ja)
Other versions
JPS6259885B2 (en
Inventor
光弘 山崎
弘 谷中
英夫 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Elna Co Ltd
Original Assignee
Elna Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elna Co Ltd filed Critical Elna Co Ltd
Priority to JP57107145A priority Critical patent/JPS58223310A/en
Publication of JPS58223310A publication Critical patent/JPS58223310A/en
Publication of JPS6259885B2 publication Critical patent/JPS6259885B2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本弁明1;L 、 7ft ’fN =Iンデンリに使
用されるタブ端子を複数本個別に[1して配列づるよう
にしIこ取イ(」冶具、およびイの取ト1冶具を使用し
て配列された複数本のタブ端子に一敗に酸化皮膜を形成
する方θ、IV till FJるムのである。
DETAILED DESCRIPTION OF THE INVENTION This defense 1; L, 7ft 'fN = I A plurality of tab terminals used for installation are arranged individually [1] and arranged in a jig, and This is a method of instantly forming an oxide film on a plurality of tab terminals arranged using a jig.

電解コンデンリ−の特性の1つである漏れ電流は陽極に
形成さ1する酸化皮膜の欠陥や質に関係している。アル
ミ電解コンデンサの場合、陽極箔には酸化皮膜が形成さ
れ、コンデンリとしての機能を果1が、陽極的に接合さ
れるタブ端子の圧延部に酸化皮膜が形成されていイ1い
と、圧延部に人なる漏れ電流が生じ、アルミ電解コンデ
ンサの特性を悪化し−Cしまう1.シたがって、タブ端
子の圧延部、ざらに必要に応じて丸棒部を化成して、酸
化皮膜を形成したタブ端子を使用づれば漏れ電流の餡を
低く抑えることができる。
Leakage current, which is one of the characteristics of electrolytic condenser, is related to the defects and quality of the oxide film formed on the anode. In the case of aluminum electrolytic capacitors, an oxide film is formed on the anode foil and functions as a condenser.However, if an oxide film is formed on the rolled part of the tab terminal that is anodically connected, the rolled part 1. A leakage current occurs, deteriorating the characteristics of the aluminum electrolytic capacitor and causing -C. Therefore, if a tab terminal is used in which an oxide film is formed by chemically treating the rolled portion and the round bar portion of the tab terminal as necessary, the leakage current can be suppressed.

ここで第1図にタブ端子を図示する。タブ端r1はツノ
ルミニウム祠にJ、る丸棒部1aど、でれを/1M’、
a し/、=ff1gli 1 b 、!:、丸棒部1
 a lJ7′Ff73されたリード部1Gとか1うな
る。リードICは錫メッキ銅覆鋼線、半[11メツキ銅
覆鋼線、錫メツ1−−ツケル線4:たは半[■1メッキ
ニッケル線−(゛ある1゜このようなタブ端子1の圧延
部11)ざらに必要に応じて丸棒部1aに酸化皮膜を形
成Jる方法どして従来は、クリップでリード部1cをつ
かみ、化成液に浸漬して酸化皮膜を形成する方法(従来
法1)またはタブ端子1を複数本束1Jて化成液に浸漬
して酸化皮膜を形成する方法(従来法2)があった。し
かし、従来法1にあっ−U 1.Lクリップでリード部
1Gを挾み込むどきにリード部1cに傷がイ・1き、イ
の部分のメッキが剥れ、自然腐蝕が促進3れることによ
り、リード部1Gの半I’ll (ql性を悪化させる
という欠点がある。さらに、リード部3− 1Gに変形を生じ、その後の工程のゴム封[]t4にl
Φ通せず、KItr−て不11ヒとなるという欠点があ
る。
Here, a tab terminal is illustrated in FIG. The tab end r1 is J, the round bar part 1a, etc. is /1M',
a shi/,=ff1gli 1 b,! :, round bar part 1
a lJ7'Ff73 lead part 1G or 1 buzz. The lead IC is made of tin-plated copper-clad steel wire, half-[11-plated copper-clad steel wire, tin 1--thickel wire 4: or half [■1 plated nickel wire-(゛1゜Such tab terminal 1). Rolling section 11) Method of roughly forming an oxide film on the round bar section 1a as needed. Conventionally, the method of gripping the lead section 1c with a clip and immersing it in a chemical solution to form an oxide film (conventional method) Method 1) or a method (conventional method 2) in which a plurality of tab terminals 1 are immersed in a chemical solution to form an oxide film (conventional method 2). However, conventional method 1 has problems. When the lead part 1G is held between the L clips, the lead part 1c is scratched (1), the plating on the part (A) is peeled off, and natural corrosion is accelerated (3). This has the disadvantage of deteriorating the quality of the lead part 3-1G, and the rubber seal []t4 in the subsequent process is damaged.
It has the disadvantage that it does not pass through Φ, resulting in a failure in KItr-.

J、た、iH未来法にJうって(ユ束ねた複数本のタブ
端子1量隔が狭1ぎることにより、化成液が溶接部1(
1お五〇リード部ICに這−1−リ、化成時に無効電流
が生じて化成し、つまり圧延部i bに良質な酸化皮膜
を形成Jることができないという欠点がある。さらに、
溶接部1dとリード部1Gに電気化学的な溶解が生ずる
という欠点がある。
According to the iH Mirai method, the chemical solution may leak into the welded area 1 (due to the distance between multiple tab terminals bundled together being too narrow).
1.50 Lead portion IC has a drawback in that reactive current is generated during formation and formation occurs, that is, a good quality oxide film cannot be formed on the rolled portion ib. moreover,
There is a drawback that electrochemical dissolution occurs in the welded portion 1d and the lead portion 1G.

しかるに、本発明は土)ホのような従来法1.2による
各欠点を改善するために、複数本のタブ端rを個別に隔
離して配列しjq、かつタブ端子の取イ」()および取
外しが容易であるような(M造の取付治具を提供すると
共に、この取付治具を使用し、取イ・1冶具ど化成液と
の間に化成電源を接続して取イ(1泊具からタブ端子を
介した化成液への電流路を構成し、タブ端子の圧延部さ
らに必要に応じて丸棒部を化成し、良質な酸化皮膜を形
成M−るようにした方法を提供するものである。
However, in order to improve each of the drawbacks of the conventional method 1.2 such as (e), the present invention arranges a plurality of tab ends r individually and separately, jq, and removes the tab terminals. We provide a mounting jig (made of M construction) that is easy to remove, and use this mounting jig to connect a chemical power supply between the chemical liquid in the jig and the chemical solution. Provided is a method in which a current path is formed from the anchor to the chemical liquid via the tab terminal, and the rolled part of the tab terminal and, if necessary, the round bar part are chemically formed to form a high-quality oxide film. It is something to do.

先ず、第2図に本発明に係る基本的な取付治具4− を示J−0取付冶具2は長尺状で、タブ端子1のリード
部1Cを取着し、か゛つ電流路を構成するための取着板
2aど、リード部1Cの先端を当接Jるために取@m2
aの長手方向の一側部に固着された係11−板2bと、
リード部1Cを個別に隔1111 ?lるために取着板
2aの短手方向に係止板2 +1と接i〕で複数個並列
に固着された区隔板2Cとからなる。
First, FIG. 2 shows a basic mounting jig 4 according to the present invention. The J-0 mounting jig 2 has a long shape and attaches the lead portion 1C of the tab terminal 1 to form a current path. Mounting plate 2a etc. for contacting the tip of lead part 1C @m2
a connecting plate 2b fixed to one side in the longitudinal direction of a;
Lead portion 1C is individually spaced 1111? It consists of a plurality of partition plates 2C fixed in parallel to the locking plate 2+1 in the lateral direction of the mounting plate 2a to provide a secure fit.

ここで、取着板2aは、タブ端子1を吊下げても落下し
ないように導電性の磁性体からなる。係+1板2 +1
と区隔板2Gは合成樹脂、ガラス、金属、[ラミック、
木材またはそれらの複合月利からなる。なお、取着板2
aと、係止板21)と区隔板2Gを導電性の磁性体で一
体に構成しても良い。また、第3図に示すように取付冶
具21の取着板2aの裏部に合成樹脂、ガラス、金属、
セラミック、来月まt、:はそれらの複合材料の補強板
2(1を設(JてもJ、い。
Here, the mounting plate 2a is made of a conductive magnetic material so that the tab terminal 1 will not fall even if it is suspended. Person in charge +1 board 2 +1
and partition plate 2G are made of synthetic resin, glass, metal, [lamic,
Consists of timber or their compound monthly interest. In addition, mounting plate 2
a, the locking plate 21), and the partition plate 2G may be integrally formed of a conductive magnetic material. In addition, as shown in FIG. 3, synthetic resin, glass, metal, etc.
Ceramics will be installed next month with reinforcement plates 2 (1) made of those composite materials.

第2図および第3図に示した取イリ冶具2.21におい
ては取着板2aとして導電性の磁性体を使用した場合に
ついて説明したが、次に第4図a 、 b 。
In the removal jig 2.21 shown in FIGS. 2 and 3, the case where a conductive magnetic material is used as the attachment plate 2a has been described, and next, FIGS. 4a and 4b.

Cにbどづき不導電性の磁性体をも使用した場合の取(
NI冶冶具説明づる。
What to do when a non-conductive magnetic material is also used in addition to C (
NI jig explanation.

第1図aに示した取fζ1冶貝3にJりいて、3aは導
電性また番、未不轡電竹の磁性体h”Bなる取着板、ニ
ー)bは合成樹脂、ガラス、金属、セラミック、木々4
まIこはイれらの複合月利からなる係止板、30は合成
樹脂、力゛ラス、金属、セラミック、木材またはぞれら
の護合祠判からなる区隔板、3(1は必東に応じC取着
板3aの裏部に設(プられる補強板、:3C1よ取着板
3a上に形成された導電体層である。
As shown in Fig. 1a, 3a is a conductive plate, a mounting plate made of a magnetic material made of unrolled electric bamboo, and b) is a synthetic resin, glass, metal. , ceramic, trees 4
Here, 30 is a locking plate made of composite monthly interest, 30 is a partition plate made of synthetic resin, glass, metal, ceramic, wood, or a combination plate of each, 3 (1 is A reinforcing plate, which is installed on the back of the C mounting plate 3a according to the requirements, is a conductive layer formed on the C mounting plate 3a.

i#電体層3eはIIl電性塗利の塗イ5、金属箔の6
1着、ヌツキ処Jjll、蒸@博膜、スパッタ薄膜など
ににって形成される。係止板3 bと補強板3dとは一
体化しIζものであっても良い、、第4図1)に示寸取
イζ1?メ1貝31は第4図aに示した取(4治具3の
変形例で・、導電体@3eを取着板3aと区隔板3Gの
表向に形成したものである。第4図Gに示づ一取トj冶
具32は第4図8に示した取イ」冶具3の変形例であり
、区隔板3Cの配置構造を3通り示1 、これは導電体
層3eを区隔板3Cの裏部には形成しないようにしたち
のぐ、この場合電流路を確保−するために区隔板3Cを
取着板3aの短手方向全幅(こわ1.:っで形成しく、
7いようにしたものである。
i# electric layer 3e is coated with 5 of IIl electric coating and 6 of metal foil.
First, it is formed by a thin film process, vaporization @ Hakumei, sputtering thin film, etc. The locking plate 3b and the reinforcing plate 3d may be integrated into one piece, as shown in FIG. 4 (1). The first shell 31 is a modification of the jig 3 shown in FIG. The jig 32 shown in FIG. 4 is a modification of the jig 3 shown in FIG. In this case, in order to ensure a current path, the partition plate 3C should not be formed on the back side of the partition plate 3C. ,
7.

次に、第4図1)に示しIこII’7 (Sl治具31
の変形(C1につき説明づる。第5図aに示しIJ取ト
1冶貝4において、4aは取着板、41)は係止板、/
IGは1ヌ隔板、11.dは取着板4aの裏部を補強り
るノ、:めのト部補強板、/Ieは導電体層、 4 r
 f、:を取着板4aの係+tx & =1 bとは反
対側の側部を補強するIcめの第1側部補強板である。
Next, as shown in Fig. 4 (1),
(Description will be given for C1. In the IJ handle 1 mounting shell 4 shown in Fig. 5a, 4a is a mounting plate, 41) is a locking plate, /
IG has 1 septum, 11. d is a reinforcing plate for the back of the mounting plate 4a; /Ie is a conductive layer; 4 r
f, : is the first side reinforcing plate of Ic which reinforces the side opposite to the attachment plate 4a +tx & =1 b.

係止板41)ど補強板4 d、4fを一体化することも
できる。第5図1)に/7< Iノた俄付泊県41にJ
3いて、第2側部?+Ii強板4gは(系]1−板4b
側+: gQ I−J 1= ’b (1) ′c−あ
る3、同様に係+を二& 41〕と補強板4(1,4<
+を一体化づ−ることt)できる。
The locking plate 41) and reinforcing plates 4d and 4f can also be integrated. Figure 5 1) /7
3, second side? +Ii strong board 4g (system) 1-board 4b
side +: gQ I-J 1= 'b (1) 'c-3, similarly the relation + is 2 & 41] and the reinforcing plate 4 (1,4<
It is possible to integrate +.

第5図Cに示す取(1冶具42は取着板4aに対し−C
第1および第2側部補強板/IC,4,aを設+−J 
iこものである。なお、取イ・1冶貝4 、41.42
にJ3いC1導電体層/IQは第4図aに示した取イ」
冶具3のJ、うに形成しても良く、また取着板4 a 
、−1のみあるいは補強板4f、4o、、l−のみ形成
1)でも良いbの7− でdうり、ようJるtこ電流路が構成されれば如何なる
耐層でし良いものである。
The mounting shown in Fig. 5C (1 jig 42 is -C
Install the first and second side reinforcement plates/IC, 4, a +-J
iIt's a small thing. In addition, Torii 1 Yagai 4, 41.42
The C1 conductor layer/IQ is the same as shown in Figure 4a.
J of the jig 3 may be formed in the shape of a sea urchin, and the mounting plate 4 a
, -1 or only the reinforcing plates 4f, 4o, , l- may be formed (1), and any resistive layer may be used as long as the current path is formed in the following manner.

ところで、第5図Cに示した取イ」冶具42にJ:るど
、第6図a 、 iを参照1ノで、タブ端子1の取外1
1時(こ、補強板4t、7Ioの位置にお【)るタブ端
子1のリード部1Gに取着板4aの磁力が及ばないの(
゛、その取外しが容易ひある。
By the way, the tab terminal 1 is removed by using the removal jig 42 shown in FIG.
The magnetic force of the mounting plate 4a does not reach the lead portion 1G of the tab terminal 1 located at the 1 o'clock position (here, the reinforcing plates 4t and 7Io).
゛It is easy to remove.

第7図a 、 l+ 、 c 、 (Iに各取イ1冶具
2,21,3゜31、32.4 、41.42の区隔板
2b 、31)、4bの断面を示すが、4角形状、三角
形状、五角形状、半円状、その他の形状でも良い。
Figure 7 shows the cross sections of the partition plates 2b, 31, and 4b of the jigs 2, 21, 3, 31, 32.4, and 41.42, respectively. The shape may be triangular, pentagonal, semicircular, or other shapes.

1−述した名取イ9冶具のうら代表例として第5図Gに
示した取4=−J冶具42を使用し、タブ端子1のバー
延部11)ざらに必要に応じて丸棒部4a(、:酸化皮
膜を形成する方法を第8図にもとづいて説明する取f+
I冶員42の区隔板4o間にはタブ端子1が1本ずつそ
のリード部1Gの先端を係1に板41)に当接し、取着
板/Iaの磁力によって取着保持された状態で吊下げら
れ、タブ端子10圧延部1bど丸棒部1aの半分程度は
アルミニウムまたはステンレ−8〜 スからなる化成槽5の化成液6中に浸油さねる3、化成
電源7の一1側は取イ・1冶貝42の導電体層4oに、
接続され、−側は化成槽5を介してまIこは図示省略の
電極棒または電極板を介して化成液6に接続される。化
成電流は化成電源7の+側から電極(木屑4e、各タブ
端子1.化成液6を介」)で((1成電諒の一側に至る
。よって、タブ端子1の少なくと6圧延部l l)の表
面には良質イイ酸化皮膜が形成される。・ なお、タブ端子に対づる酸化皮膜の形成にあたっては、
取ドt ?fl與を1本あるいは複数本並べたものを1
単(1’/どしC化成層に吊1・し−0行なうバッチ方
式、あるいは化成液十を吊下移動させるようにしだ半J
、たは連続T(が考えられる1゜以l−にて述べた本発
明において1タブ端rは1本ずつ隔離され、かつその吊
下長さを規制され、磁力を6って取(4治具に取着され
るのでタブ端子のリード部にギズが生ずる虞れがイjく
、J、たタノ端子の酸化皮膜形成時に化成液が溶接部お
よびリード部に這トがることもないので、良質y、:z
H化皮+1Uを形成しIこタブ端子を冑ることができる
。l、た、タブ端子の取イζ1泊具に対する着脱も非常
に簡単である、。
1- Using the Natori A9 jig 42 shown in FIG. (,: An explanation of the method of forming an oxide film based on Fig. 8)
Between the partition plates 4o of the I member 42, one tab terminal 1 is brought into contact with the plate 41) with the tip of its lead portion 1G, and is attached and held by the magnetic force of the mounting plate/Ia. Approximately half of the tab terminal 10, rolled portion 1b, and round bar portion 1a are immersed in oil 3 in a chemical solution 6 in a chemical conversion tank 5 made of aluminum or stainless steel. On the side, the conductor layer 4o of the torii-1 shell 42,
The - side is connected to the chemical conversion liquid 6 via the chemical conversion tank 5 and the other side is connected to the chemical conversion liquid 6 via an electrode rod or an electrode plate (not shown). The chemical current flows from the + side of the chemical power source 7 to one side of the chemical forming power source 7 through the electrode (wood chips 4e, each tab terminal 1. chemical liquid 6). A high-quality oxide film is formed on the surface of part l l).In addition, when forming the oxide film on the tab terminal,
Tori de t? One or more fl 與 lined up is 1.
Single (1'/doshiC) Batch method of suspending 1-0 on the chemical formation layer, or suspending and moving the chemical solution 10 times.
, or a continuous T (is considered 1° or less) In the present invention, one tab end r is isolated one by one, and its hanging length is regulated, and the magnetic force is taken by 6 (4 Since it is attached to a jig, there is a risk of scratches on the lead part of the tab terminal, and chemical liquid may creep into the welded part and lead part when forming the oxide film on the tab terminal. Because there is no, good quality y, :z
It is possible to form an H-type skin +1U and remove the I-shaped tab terminal. It is very easy to attach and detach the tab terminal from the fitting.

4 、 図1frl ノ簡’4ii’z f+’d 明
第1図はタブ端子を示J平百図、第2図、第3図、第4
図a 、 b 、 cおよび第5図a 、 b 、 c
は本発明に係る取(Nl冶具を示す部分斜視図、第6図
a 、 b 、 icU取イ・1泊具に対するタブ端子
の取外しを説明りるための部分断面図、第7図a 、 
II、 c 。
4, Fig. 1 frl Nosimplified '4ii'z f+'d Light Fig. 1 shows the tab terminal
Figures a, b, c and Figure 5 a, b, c
are a partial perspective view showing the Nl jig according to the present invention, FIGS. 6a and 6b, a partial cross-sectional view for explaining the removal of the tab terminal from the icU take-off jig, FIG. 7a,
II, c.

(1は取ト1冶具の区隔板の断面図、第8図はタブ端子
への酸化皮膜の形成方法を説明りるための図である。
(1 is a cross-sectional view of the partition plate of the tray 1 jig, and FIG. 8 is a diagram for explaining the method of forming an oxide film on the tab terminal.

図中、1はタフ端子、2.21.3.31.32.4゜
41、42は取イー1泊(1,5は化成槽、6は化成液
、7(よ化成電源3゜ 特許用に1人  ■ルナー株式会ネ[ 11− 第1図   ユ 第3図 ?J 第5図(a)4 第7図 (a)   (b)   (c)   (d)口  △
  凸  。
In the figure, 1 is a tough terminal, 2.21.3.31.32.4゜41, 42 is a one-night stay (1, 5 is a chemical conversion tank, 6 is a chemical liquid, 7 (Yo chemical power supply 3゜ patented) 1 person ■ Lunar Co., Ltd. [ 11- Figure 1 Yu Figure 3 ?J Figure 5 (a) 4 Figure 7 (a) (b) (c) (d) Mouth △
Convex.

第8図Figure 8

Claims (1)

【特許請求の範囲】 (1) タブ端子のリード部を磁力によって取着する取
着板と、取着板上に設けられ、かつタブ端子を一本ずつ
隔離するための区隔板と、取着板の側部に設けられ、か
つタブ端子のリード部の先端を当接Jるための係止板と
からなる電解コンデンIJ−用タブ端子の取付治具。 (2、特許請求の範囲(1)に(t3いて、取着板は導
電性の磁性体であることを特徴とした電解コンデンサ用
タブ端子の取付治具。 (3) 特許請求の範囲(1)またはく2)において、
取着板子に導電体層を形成したことを特徴どづる電wI
コンデンサ用のタブ端子の取付治具。 (4) 特許請求の範囲(1〉において、取着根土およ
び区隔板子に導電体層を形成したことを特徴とする電v
N]ンデン→」用タブ端子の取付治具。 (5) 特許請求の範囲(1)、(2>、(3)。 または(4)において、取着板の裏部に補強板を設Gノ
でなる電解−1ンデンIす用タブ端子の取イ(1冶具。 (6) 特、iT請求の範囲(1)、(2)、(3)。 (/I)または(5)においC1取看板の側部に補強板
を設けてなる電解コンデンサ用タブ端子のIR付治具。 (7) 特gel請求の範囲(6)において、取着板の
側部の補強板」−に電導体層を形成してなる電解=1ン
デンザ川タブ端子の取イ」冶具。 (8) 特許請求の範囲(3)、(4)または(7)に
a3いで、導電体層は導電↑!1塗111層、金属箔、
メッキ層、蒸着薄膜またはスパッタ簿膜の一員からなる
ことを特徴どした電解]ンfンリ用タブ端子の取付治具
。 (9) タブ端子のリード部を磁力(こよって取着する
取着板と、取着板トに設りられ、かつタブ端子を1木で
J“つ隔園]Lj′るための区隔板ど、取着板の側部に
設()られ、かつタブ端子のリード部の先端を当接する
ための係止板どから<kる電解1ンfンリITIり/端
子の取(jl治具の区隔板間の取着板上にタブ端子を1
本ず“−〕取看し、タブ端rの少なくとbfi延部を化
成液中に浸漬し、取着板と化成液との間に電圧を印加J
ることによりタブ端子の圧延部さらに必要に応じて丸棒
部に酸化皮膜を形成ず′るようにしたタブ端子の酸化皮
膜形成法。
[Claims] (1) A mounting plate that magnetically attaches the lead portions of the tab terminals, a partition plate provided on the mounting plate for separating the tab terminals one by one, and A mounting jig for a tab terminal for electrolytic condenser IJ-, which comprises a locking plate provided on the side of a mounting plate and for abutting the tip of a lead portion of the tab terminal. (2. Claim (1): (t3) A mounting jig for a tab terminal for an electrolytic capacitor, characterized in that the mounting plate is a conductive magnetic material. (3) Claim (1) ) or in 2),
Electrical wI characterized by having a conductive layer formed on the mounting plate.
Mounting jig for tab terminals for capacitors. (4) In claim (1), there is provided an electric v
Mounting jig for tab terminal for "N]". (5) Claims (1), (2>, (3)) or (4), wherein a reinforcing plate is provided on the back side of the mounting plate of the tab terminal for electrolytic-1-dens I, which is made of G. (1 jig. (6) Patent, iT claims (1), (2), (3). IR jig for tab terminals for capacitors. (7) In claim (6), an electrolytic=1 ndenzagawa tab terminal in which a conductor layer is formed on the reinforcing plate on the side of the mounting plate. jig. (8) In claim (3), (4) or (7), in a3, the conductor layer is conductive ↑! 1 coated 111 layers, metal foil,
A mounting jig for a tab terminal for electrolytic contact, characterized in that it consists of a plated layer, a vapor deposited thin film, or a sputtered thin film. (9) A mounting plate that attaches the lead portion of the tab terminal with magnetic force, and a space provided on the mounting plate for attaching the tab terminal with one piece of wood. The plate is installed on the side of the mounting plate and is used to abut the tip of the lead part of the tab terminal. Place one tab terminal on the mounting plate between the partition plates of the tool.
Honzu"-]Inspection, immerse at least the bfi extension of the tab end r in the chemical solution, and apply a voltage between the mounting plate and the chemical solution.
A method for forming an oxide film on a tab terminal by forming an oxide film on the rolled part of the tab terminal and, if necessary, on the round bar part.
JP57107145A 1982-06-22 1982-06-22 Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal Granted JPS58223310A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57107145A JPS58223310A (en) 1982-06-22 1982-06-22 Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57107145A JPS58223310A (en) 1982-06-22 1982-06-22 Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal

Publications (2)

Publication Number Publication Date
JPS58223310A true JPS58223310A (en) 1983-12-24
JPS6259885B2 JPS6259885B2 (en) 1987-12-14

Family

ID=14451649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57107145A Granted JPS58223310A (en) 1982-06-22 1982-06-22 Mounting jig of tab terminal for electrolytic condenser and method of forming oxidized film of tab terminal

Country Status (1)

Country Link
JP (1) JPS58223310A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179308A (en) * 1987-12-29 1989-07-17 Top Parts:Kk Formation of lead wire terminal for electrolytic capacitor
JP2010171207A (en) * 2009-01-22 2010-08-05 Rubycon Corp Capacitor element fixture and method of manufacturing the capacitor element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179308A (en) * 1987-12-29 1989-07-17 Top Parts:Kk Formation of lead wire terminal for electrolytic capacitor
JPH0424852B2 (en) * 1987-12-29 1992-04-28 Totsupu Paatsu Kk
JP2010171207A (en) * 2009-01-22 2010-08-05 Rubycon Corp Capacitor element fixture and method of manufacturing the capacitor element

Also Published As

Publication number Publication date
JPS6259885B2 (en) 1987-12-14

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