JPS58219726A - Method of producing metallized film condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a metallized film capacitor and to improving its electrical characteristics, and in particular to a process for masking an element when forming a metallized electrode for attaching a lead terminal to an end face of a capacitor element. Regarding.

Generally, metal electrodes are formed on this type of capacitor element by masking the outer periphery of the element with tape or the like, or by flattening multiple elements, stacking them together, and tightening them with a clamping frame to attach a metal such as Zn to the element. Thermal spraying is carried out on the end face. However, this method melts the metal scratches with electricity, gas, etc. and sprays it with high-pressure gas, so the sprayed metal can be sprayed from a small gap in the mask, etc. As shown in an example in FIG. 1, the metal powder 4 not only becomes stuck to the outer circumferential surface of the element 1, contaminating the element, but also short-circuiting the electrodes or causing bonding, especially in small elements. A cleaning process is essential to remove the sprayed metal, but it is difficult to remove metal adhering to the outer surface of the element, which is not only inefficient, but also damages the metallicon electrodes on the end face or disrupts the connection between the element and the metallicon electrodes. There are drawbacks such as damage, deterioration of electrical characteristics such as M, and deterioration of yield.Particularly as the device becomes smaller, masking and cleaning after thermal spraying become troublesome, and the above-mentioned drawbacks are more likely to occur. In the present invention, as masking before the metal spraying process, only both end faces and the surrounding area of the capacitor element are exposed, and the outer periphery of the element is molded and covered with resin.
It is an object of the present invention to provide a method for manufacturing gold film capacitors with stable characteristics, which eliminates the above-mentioned drawbacks, improves yield, makes cleaning simple and easy, and has stable characteristics. A detailed explanation will be given below with reference to the drawings.

FIG. 2 is a perspective view showing a capacitor element at each stage of manufacturing according to an embodiment of the present invention. )
(
C) ←) shows an element in which the element shown in K was subjected to metal spraying to form a metallicon electrode, and d) shows the element in which the metallicon metal adhering to the end face of the mold body was cleaned and removed after metal spraying.

The element 1 is molded with a thermosetting resin such as Evoquin resin as shown in ←) so that the element 1 is exposed, and a mold body 2 is formed to cover the outer periphery of the element 1. After that, as in the reference example shown in FIG. 6, the plurality of elements shown in (b) are
The element groups arranged in rows are tightened and fixed with a fastener 5 via a suitable multi-group partition plate 6, and then metal such as Zn, Sn, etc. is melt-blown on both end surfaces of the elements exposed from the mold body. The element shown in (c) is tightened with a fastener as shown in the figure, and the partition plate 6 blocks the intrusion of metal powder, so it is not contaminated. , the insulation between the two electrodes is maintained perfectly, and the metal powder 4 adhering to the surface of the lead body can be cleaned with a brush, etc., if necessary. I can,
In particular, by cleaning only the surface of the mold body, the mold body is much easier to remove than the outer circumferential surface of the element and can be easily dropped. Due to the drawbacks of conventional methods, cleaning requires a great deal of time and effort, contaminates the element, and at the same time deteriorates the quality of the connection between the metallicon electrode stuck to the end face and the element electrode during the cleaning process.
If the characteristics of the J7J are poor, the yield will be lowered, and if there are any elements that are not cleaned properly, there will be problems such as a short circuit between the two electrodes or a risk of insulation deterioration due to the attached metal powder 4. However, according to the present invention, the cleaning process can be omitted or greatly simplified, which not only improves efficiency but also improves efficiency.
As long as the winding part of the element is sufficiently tightened by the pressure during molding and there is no penetration of metal powder into the core part, it is possible to handle a plurality of elements in one row as shown in Figure 6. It is advantageous for mass production and is easy to automate. After that (see FIG. 2), a lead terminal is attached to the metallicon electrode, and the capacitor is completed by storing it in a case and filling it with resin, or applying an exterior covering such as molding or resin coating. In the above description, the shape of the molded body is a rectangular parallelepiped, which eliminates the risk of explanation, and it goes without saying that the molded body can be molded into any shape.

As explained above, according to the present invention, in the production of a metallized film capacitor, before forming metallicon electrodes on the element, only the end face and the surrounding area of the element are exposed, and the outer peripheral surface of the element is exposed. By coating the molded body with resin and then applying metal spraying to form a metallicon electrode, it is possible to prevent sprayed metal powder from adhering to the outer circumferential surface of the element, and to prevent contamination of the element. Excellent and stable properties that eliminate or simplify the cleaning of elements after thermal spraying, prevent short circuits and insulation deterioration due to adhering thermal sprayed metal powder, and do not deteriorate the connection quality between metallcon electrodes and element electrodes due to cleaning treatment. This method has a great practical effect in that it can efficiently manufacture capacitors of good quality, such as obtaining capacitor elements with high quality.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an example of the state of a capacitor element after metallization electrodes are formed by a conventional method, and FIG. Perspective view. FIG. 6 is an explanatory diagram showing a reference example when performing metal spraying of the capacitor of the present invention. FIG. 4 is a side view of a capacitor element showing another embodiment of the present invention. Horizontal 4 symbols used in the figure 1: Capacitor element 2: Mold body 3: Metallic electrode 4: Adhering metal powder 5: Fastener 6: Partition plate 7: Band-shaped recess A: Ff1 prefecture wholesale patent applicant Nippon Tsushin Kogyo Co., Ltd. Representative Yama 1) Real 1 Figure? 3rd place 3rd place

Claims (2)

[Claims] (1) After winding the metallized film to expose only both end faces and the surrounding area A of the flattened capacitor element 1 and forming a molded body 2 with a resin material on the outer peripheral surface of the element, the molded body 2 is A method for manufacturing a metallized film capacitor, characterized in that metallicon electrodes 5 are formed and fixed on both exposed end faces. (2) A method for manufacturing a metallized film capacitor according to claim 1, characterized in that a band-shaped recess 7 is provided on the outer peripheral surface of the molded body.