JPS5821195Y2 - Slit structure for dividing sheet-like alumina substrates - Google Patents
Slit structure for dividing sheet-like alumina substratesInfo
- Publication number
- JPS5821195Y2 JPS5821195Y2 JP714080U JP714080U JPS5821195Y2 JP S5821195 Y2 JPS5821195 Y2 JP S5821195Y2 JP 714080 U JP714080 U JP 714080U JP 714080 U JP714080 U JP 714080U JP S5821195 Y2 JPS5821195 Y2 JP S5821195Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- groove
- slit
- sheet
- dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
一般に基板厚の薄いシート状アルミナ基板は、基板の片
面に線状スリット溝を設りす、個片状に分割することが
よく知られている。[Detailed Description of the Invention] Generally, it is well known that a thin sheet-like alumina substrate is divided into individual pieces by providing a linear slit groove on one side of the substrate.
しかし、基板厚の厚い(l、Qmm以上)シート状アル
ミナ基板を分割する場合、片面にスリット溝を設けて分
割すると分割面の基板側面において突起状のパリが発生
し、かつ直線状に分割できな□いという問題が生じる。However, when dividing a sheet-like alumina substrate with a thick substrate (1, Q mm or more), if a slit groove is provided on one side, protrusions will occur on the side of the substrate at the dividing surface, and it will not be possible to divide it into straight lines. The problem arises that it is not □.
一方、分割を容易ならしめるためにスリット溝を深くす
ると、該基板の印刷作業や焼成作業時に、ランダムな形
で個片状に分割されてしまい、次作業が不可能なこ・と
になる。On the other hand, if the slit grooves are made deep to facilitate division, the substrate will be randomly divided into individual pieces during printing or firing operations, making subsequent operations impossible.
; 、本考案は、このような基板厚の厚いシート状ア
ルミナ基板を所望の個片状に分割作業時に容易に分割せ
しめ、かつフラットな分割面を得んとするために、基板
の表面および裏面に溝巾寸法が同じで深さのみを基板厚
に応じて表面および裏面でそれぞれ異ならせた直線状の
スリット溝をもつシート状アルミナ基板の分割用スリッ
ト構造を提供せんとするものである。The present invention aims to easily divide such a thick sheet-like alumina substrate into desired individual pieces during the dividing operation, and to obtain a flat dividing surface. It is an object of the present invention to provide a slit structure for dividing a sheet-like alumina substrate, which has linear slit grooves having the same groove width and different depths on the front and back surfaces depending on the thickness of the substrate.
従来、基板厚が厚いシート状アルミナ基板に対しては、
基板の表面および裏面の両面に分割用スリット溝を設け
る構成としては、第1図イに示すようにシート状アルミ
ナ基板1両面のスリット溝2のテーパ角度を同じにし、
そのスリット溝2の深さを同じにしたもの、または第2
図イに示すようにテーパ角度が同じでスリット溝2,2
′の深さを異ならせたものがある。Conventionally, for thick sheet-like alumina substrates,
The configuration in which dividing slit grooves are provided on both the front and back surfaces of the substrate is as shown in FIG.
The slit groove 2 has the same depth, or the second
As shown in Figure A, the slit grooves 2 and 2 have the same taper angle.
′ with different depths.
しかし、これらの構成では基板分割時に第1図口および
第2図口に示すように分割面に突起部が発生しやすい。However, in these configurations, when the substrate is divided, protrusions are likely to occur on the dividing surface, as shown in FIG. 1 and FIG. 2.
また、この場合スリット溝を広くすると基板表面の有効
面積が小さくなり、かつ印刷時に印刷用ペーストがスリ
ット溝へ流れ込む危険性がある。Furthermore, in this case, if the slit grooves are widened, the effective area of the substrate surface becomes smaller, and there is a risk that the printing paste will flow into the slit grooves during printing.
本考案はこのような従来における問題点に鑑みて創案さ
れたものであり、以下その一実施例について第3図とと
もに説明する。The present invention has been devised in view of these conventional problems, and one embodiment thereof will be described below with reference to FIG. 3.
第3図に示すように、本考案は基板厚りが1.0mm以
上と厚いシート状アルミナ基板3の表面および裏面に、
溝巾寸法d1.d2が同じで溝の深さtl、t2が異な
るスリット溝4,5を直線状に連続してそれぞれ設けた
ものであり、かつ溝巾寸法d t 、 d 2をl、9
mm以下としたものである。As shown in FIG. 3, the present invention has a thick sheet-like alumina substrate 3 with a thickness of 1.0 mm or more.
Groove width dimension d1. The slit grooves 4 and 5 with the same d2 and different groove depths tl and t2 are provided in a straight line, respectively, and the groove width dimensions d t and d 2 are l and 9.
mm or less.
ここで、溝巾寸法d1.d2を1.□mm以下としたの
は、スリット溝4,5を広くすると基板1表面の有効面
積が小さくなり、かつ印刷面6への印刷時に印刷用ペー
ストがスリット溝4へ流れ込む危険性があるためである
。Here, groove width dimension d1. d2 to 1. The reason for setting it below □mm is that if the slit grooves 4 and 5 are widened, the effective area of the surface of the substrate 1 will become smaller, and there is a risk that the printing paste will flow into the slit groove 4 when printing on the printing surface 6. .
本考案の応用例として多数個取りのシート状アルミナ基
板(・基板の厚み1.3mm、取数12個/シ5、−)
)、(’の実施例を第4図イ、aに示す。As an application example of this invention, a multi-piece sheet-like alumina substrate (substrate thickness 1.3 mm, number of pieces 12 pieces/Si5, -)
), (' are shown in FIG. 4, a and a).
以上のように本考案は構成されているものであり、つぎ
の通りの効果を有する。The present invention is constructed as described above, and has the following effects.
(1) スリット溝の巾寸法を基板の表面および裏面
で同寸法にし、片方の溝の深さのみを深くすることによ
り、分割時の基板に対する応力として深い溝の方から浅
い溝の方へ切断力が働き、分割時に分割面に突起状のパ
リができることはなく、フラットな基板の分割側面が得
られる。(1) By making the width of the slit groove the same on the front and back sides of the board, and increasing the depth of only one groove, the stress on the board during splitting is reduced from the deep groove to the shallow groove. Due to the force acting on the substrate, no protrusions are formed on the splitting surface during splitting, and a flat splitting side surface of the substrate is obtained.
(2) スリット溝は溝巾を広くすることなく、基板
へ深くスリット溝を設けることができるため、基板の印
刷面における印刷パターンが広くとれ、かつスリット溝
への印刷用ペーストの流れ込みが少ない。(2) Since the slit grooves can be formed deeply into the substrate without increasing the groove width, the printing pattern on the printing surface of the substrate can be widened, and the printing paste is less likely to flow into the slit grooves.
(3)スリット溝の溝の深さが片面で深くても他方の溝
の深さが浅いため、印刷作業や焼成作業時の基板に対す
る機械的外力に対しても耐えることができ、かつ所望の
分割作業時に突起面が発生することなく容易に分割でき
る。(3) Even if the depth of the slit groove is deep on one side, the depth of the groove on the other side is shallow, so it can withstand external mechanical forces on the substrate during printing and baking operations, and can achieve desired results. It can be easily divided without producing any protruding surfaces during the dividing operation.
第1図イおよび第2図イはそれぞれ従来例におけるスリ
ット溝構造を示す側面図、第1図口および第2図口は第
1図イ、第2図イにおける分割後の状態を示す側面図、
第3図は本考案に係るスリット溝構造の一実施例を示す
側面図、第4図イ2口は本考案スリット溝構造の応用例
を示す側面図と上面図である。
3・・・・・・シート状アルミナ基板、4,5・・・・
・・スリット溝。Figures 1A and 2A are side views showing the slit groove structure in the conventional example, and Figures 1A and 2A are side views showing the state after division in Figures 1A and 2A. ,
FIG. 3 is a side view showing an embodiment of the slit groove structure according to the present invention, and FIG. 4A is a side view and a top view showing an application example of the slit groove structure of the present invention. 3...Sheet-like alumina substrate, 4,5...
...Slit groove.
Claims (1)
の表面および裏面に、溝巾寸法が同じで溝の深さ寸法が
異なる直線状のスリット溝を溝巾l、Qmm以下でもっ
てそれぞれ設けてなるシート状アルミナ基板の分割用ス
リット構造。Linear slit grooves having the same groove width but different groove depths are provided on the front and back surfaces of a sheet-like alumina substrate having a substrate thickness of l, Q mm or more, respectively, with groove widths of l, Q mm or less. Slit structure for dividing sheet-like alumina substrates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP714080U JPS5821195Y2 (en) | 1980-01-23 | 1980-01-23 | Slit structure for dividing sheet-like alumina substrates |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP714080U JPS5821195Y2 (en) | 1980-01-23 | 1980-01-23 | Slit structure for dividing sheet-like alumina substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56110674U JPS56110674U (en) | 1981-08-27 |
JPS5821195Y2 true JPS5821195Y2 (en) | 1983-05-04 |
Family
ID=29603799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP714080U Expired JPS5821195Y2 (en) | 1980-01-23 | 1980-01-23 | Slit structure for dividing sheet-like alumina substrates |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5821195Y2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005123606A (en) * | 2003-09-25 | 2005-05-12 | Sanyo Electric Co Ltd | Hybrid integrated circuit device and manufacturing method therefor |
JP5108496B2 (en) * | 2007-12-26 | 2012-12-26 | 三洋電機株式会社 | Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof |
JP2009212319A (en) * | 2008-03-05 | 2009-09-17 | Ngk Spark Plug Co Ltd | Method of manufacturing multiple patterning wiring board |
JP5567445B2 (en) * | 2010-10-08 | 2014-08-06 | スタンレー電気株式会社 | Manufacturing method of ceramic multilayer wiring board |
-
1980
- 1980-01-23 JP JP714080U patent/JPS5821195Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS56110674U (en) | 1981-08-27 |
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