JPS58210690A - Thin film copper-lined laminated board - Google Patents
Thin film copper-lined laminated boardInfo
- Publication number
- JPS58210690A JPS58210690A JP9384682A JP9384682A JPS58210690A JP S58210690 A JPS58210690 A JP S58210690A JP 9384682 A JP9384682 A JP 9384682A JP 9384682 A JP9384682 A JP 9384682A JP S58210690 A JPS58210690 A JP S58210690A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- laminated board
- film copper
- diameter
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は、多層用銅張積層板(薄物マルチ材)などと
して用いられる薄物銅張積層板に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin copper-clad laminate used as a multilayer copper-clad laminate (thin mulch material) or the like.
多層用鋼張積層板として、厚み100μ(ミクロン)以
下の薄物鋼張積層板を製造する場合、従来、基材として
はガラスクロスを用いるようにし、その単重を少くする
ために、径が5〜7μと小さなモノフィラメントを用い
、かつ打ち込み本数も少なくしていた。しかし、このも
のは、織り方が粗になるため、樹脂の含浸乾燥時や成形
時に目的りを起しやすく、寸法変化が大きくなるほか、
寸法にバラツキを生じやすかった。また、モノフィラメ
ント径が小さすぎるため、補強効果も小さかった。When manufacturing thin steel-clad laminates with a thickness of 100 microns or less as multilayer steel laminates, conventionally, glass cloth has been used as the base material, and in order to reduce the unit weight, glass cloth with a diameter of 5. A monofilament as small as ~7μ was used, and the number of implants was also reduced. However, since this material has a coarse weave, it tends to become uneven during resin impregnation and drying and molding, and dimensional changes are large.
It was easy to cause variations in dimensions. Furthermore, since the monofilament diameter was too small, the reinforcing effect was also small.
この発明は、このような問題を解決することを目的とす
る。This invention aims to solve such problems.
このような目的は、ガラスモノフィラメントとして径9
μのものを用い、かつ打ち込み本数をタテ、ヨコ55〜
65本/in (1インチあたり55〜65本)に増す
ことによって達成される。For this purpose, glass monofilaments with a diameter of 9
Use μ, and the number of drives is 55-55 vertically and horizontally.
This is achieved by increasing the number of lines to 65 lines/in (55-65 lines per inch).
したがって、この発明にかかる薄物鋼張積層板は、径が
9μのモノフィラメントを用い、タテ。Therefore, the thin steel clad laminate according to the present invention uses monofilament having a diameter of 9 μm and has a vertical shape.
ヨコの打ち込み本数が55〜65本/inとなるように
して織ったガラスクロスを基材として用いたことを特徴
とする。以下にこれを詳しく述べる。It is characterized in that a glass cloth woven in such a manner that the number of horizontal strands is 55 to 65 strands/in is used as the base material. This will be explained in detail below.
この発明において、基材としては、径9μのモノフィラ
メントを用い、タテ、ヨコの打ち込み本数を55〜65
本/inにして平織などに織り込んでなるガラスクロス
が用いられる。集束数を減らした糸を使うのがよい。In this invention, a monofilament with a diameter of 9μ is used as the base material, and the number of vertical and horizontal implants is 55 to 65.
A glass cloth woven into a plain weave or the like is used. It is better to use thread with a reduced number of bundles.
積層板用樹脂としては、エポキシ樹脂、フェノール樹脂
、ポリエステル樹脂、メラミン樹脂、ボリイミド樹脂な
どの熱硬化性樹脂がm−られる。As the resin for the laminate, thermosetting resins such as epoxy resins, phenol resins, polyester resins, melamine resins, and polyimide resins are used.
銅箔は一般の積層板用がそのまま用いられてよいO
基材に合成樹脂を含浸させ、乾燥させたのち、銅箔と重
ね合わせ、加熱加圧成形するなどして銅張積層板とする
点は、従来と同様である。Copper foil for general laminates may be used as is.O Points in which the base material is impregnated with synthetic resin, dried, overlapped with copper foil, and molded under heat and pressure to form a copper-clad laminate. is the same as before.
この発明にかかる薄物銅張積層板は、このように、径が
9μのモノフィラメントを用い、タテ。As described above, the thin copper-clad laminate according to the present invention uses a monofilament having a diameter of 9 μm, and is made vertically.
ヨコの打ち込み本数が55〜65本/inとなるように
して織ったガラスクロスを基材として用いたため、クロ
ス上の糸の交点が増し、糸の剛性も増して、単重をほと
んど増すことな(、含浸乾燥時や成形時などの0曲りが
防止され、寸法変化やそのバラツキがな(、かつ基材に
よる補強効果が増した。Because we used glass cloth as the base material, which was woven so that the number of horizontal threads was 55 to 65 per inch, the number of intersection points of the threads on the cloth increased, and the rigidity of the threads increased, so the unit weight hardly increased. () Zero bending during impregnation drying and molding was prevented, dimensional changes and variations were prevented (and the reinforcing effect of the base material was increased).
つぎに、実施例について比較例と併せて述べる。Next, examples will be described together with comparative examples.
モノフィラメント径9μ、打ち込み本数タテ59本/i
n、ヨ:y 61 本/ inの平織ガラスクロスにエ
ポキシ樹脂ワニスを含浸、乾燥させて樹脂含有率40重
量係のプリプレグを得、これに銅箔を重ね合わせて、圧
力100 kg/cm2.温度150’Cで60分間積
層成形することによって薄物銅張積層板を得た。Monofilament diameter 9μ, number of vertical implants 59/i
n, y: y 61 pcs/in of plain woven glass cloth was impregnated with epoxy resin varnish and dried to obtain a prepreg with a resin content of 40% by weight, which was then laminated with copper foil and subjected to a pressure of 100 kg/cm2. A thin copper-clad laminate was obtained by lamination molding at a temperature of 150'C for 60 minutes.
基材として、モノフィラメント径5μ、打チ込み本数タ
テ59本/in、ヨコ46本/inの平織ガラスクロス
を用いるようにしたほかは、実施例と同様にして、薄物
鋼張積層板を得た。A thin steel-clad laminate was obtained in the same manner as in the example except that a plain weave glass cloth with a monofilament diameter of 5 μm and a number of implants of 59 vertically/in and horizontally 46/in was used as the base material. .
実施例および比較例の各薄物銅張積層板について寸法変
化をみたところ、実施例は−0,07憾であり、比較例
の−0,141に比しすぐれていた。When the dimensional changes of the thin copper-clad laminates of Examples and Comparative Examples were examined, it was -0.07 points in Examples, which was superior to -0.141 in Comparative Examples.
特許出願人 松下電工株式会社Patent applicant Matsushita Electric Works Co., Ltd.
Claims (1)
して織ったガラスクロスを基材として用いたことを特徴
とする薄物鋼張積層板。(1) Using a monofilament with a diameter of 9μ, vertically. A thin steel-clad laminate, characterized in that a glass cloth woven in such a way that the number of horizontal threads is 55 to 65 per inch is used as a base material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9384682A JPS58210690A (en) | 1982-05-31 | 1982-05-31 | Thin film copper-lined laminated board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9384682A JPS58210690A (en) | 1982-05-31 | 1982-05-31 | Thin film copper-lined laminated board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58210690A true JPS58210690A (en) | 1983-12-07 |
Family
ID=14093765
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9384682A Pending JPS58210690A (en) | 1982-05-31 | 1982-05-31 | Thin film copper-lined laminated board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58210690A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07157575A (en) * | 1993-12-06 | 1995-06-20 | Hitachi Chem Co Ltd | Prepreg for printed circuit board and multi-layer printed circuit board |
-
1982
- 1982-05-31 JP JP9384682A patent/JPS58210690A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07157575A (en) * | 1993-12-06 | 1995-06-20 | Hitachi Chem Co Ltd | Prepreg for printed circuit board and multi-layer printed circuit board |
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