JPS58209875A - Reinforced insulating layer forming method for cable connector - Google Patents

Reinforced insulating layer forming method for cable connector

Info

Publication number
JPS58209875A
JPS58209875A JP57091404A JP9140482A JPS58209875A JP S58209875 A JPS58209875 A JP S58209875A JP 57091404 A JP57091404 A JP 57091404A JP 9140482 A JP9140482 A JP 9140482A JP S58209875 A JPS58209875 A JP S58209875A
Authority
JP
Japan
Prior art keywords
insulating layer
mold
resin
forming method
layer forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57091404A
Other languages
Japanese (ja)
Inventor
伸一 入江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP57091404A priority Critical patent/JPS58209875A/en
Publication of JPS58209875A publication Critical patent/JPS58209875A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Processing Of Terminals (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は分割金型を用いてケーブル接続部の補強絶縁層
を形成する方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of forming a reinforcing insulating layer of a cable connection portion using a split mold.

ゴム、プラスチック絶縁ケーブルの接続部は、周知のよ
うに接続部を電気的に絶縁補強するために、ケーブル導
体接続部上に半導電性テープを巻回加熱して導体遮蔽層
を形成した後、その上に補強絶縁層を形成している。従
来はこの補強絶縁層を第1図及び第2図に示すように上
金型11と下金型12とからなる横ニッ割金型を用い、
遮蔽層を施した導体接続部15を上下方向からニラ割金
型11.12で囲み、上金型11に穿設された樹脂注入
口14に接続の樹脂押出機17から金型11.12内に
樹脂を押出注入して補強絶縁層16を形成しているが、
導体接続部15上に上金型11と下金型12とからなる
横二ッ割金型を被せて金型内に樹脂を注入すると、金型
の合せ目13が金型の横側面に位置するために上金型1
1内の空気が外部に逃げられず、また上金型11に複数
の空気抜孔を穿設した金型を用いても注入樹脂の溶融粘
度が高いために空気が充分排出されず、上金型11内に
残留の空気が注入樹脂によって次第に圧縮され、この圧
縮空気が遂には押出注入される樹脂中に巻き込まれて形
成補強絶縁層16の内部に大きな空隙が生成し、接続部
の電気特性が著しく低下するという欠点があった。
As is well known, in order to electrically insulate and reinforce the connection part of a rubber or plastic insulated cable, a semiconductive tape is wrapped around the cable conductor connection part and heated to form a conductor shielding layer. A reinforcing insulating layer is formed thereon. Conventionally, this reinforcing insulating layer was formed using a horizontal split mold consisting of an upper mold 11 and a lower mold 12, as shown in FIGS. 1 and 2.
The conductor connection portion 15 provided with a shielding layer is surrounded from above and below by a chive split mold 11.12, and a resin extruder 17 connected to the resin injection port 14 drilled in the upper mold 11 is injected into the mold 11.12. The reinforcing insulating layer 16 is formed by extruding and injecting resin into the
When a horizontal halved mold consisting of an upper mold 11 and a lower mold 12 is placed over the conductor connection portion 15 and resin is injected into the mold, the seam 13 of the mold is located on the horizontal side of the mold. Upper mold 1 to
The air in the upper mold 11 cannot escape to the outside, and even if a mold with multiple air vent holes is used in the upper mold 11, the molten viscosity of the injected resin is high, so the air cannot be sufficiently exhausted. The air remaining in the insulating layer 11 is gradually compressed by the injected resin, and this compressed air is eventually caught up in the extruded and injected resin, creating a large void inside the formed reinforcing insulating layer 16, which deteriorates the electrical characteristics of the connection part. There was a drawback that it decreased significantly.

本発明は上記欠点を解消する目的でなされたもので、以
下図面によって本発明の一実施例を説明すると、本発明
は接続すべき両ケーブル導体を圧縮スリーブで接続し、
その上に半導1(I性テープを巻回加熱融着して導体遮
蔽層を形成した後、第3図に示すように二個以」二の多
分割金型を用いその合せ[13の少なくとも一つが上方
を向くように合せてケーブル導体接続部5を囲み、金型
内に注入する樹脂の圧力で金型の合1+3に14111
11以下の隙間ができるように金型をボルト締めしてか
ら、金型1に穿設の樹脂性入日4に樹脂押出機7を接続
し分割金型1.2、ピと導体接続部5との間の空防内に
ポリエチレン等の樹脂を押出注入して補強絶縁層6を形
成する。
The present invention has been made for the purpose of solving the above-mentioned drawbacks, and an embodiment of the present invention will be described below with reference to the drawings.The present invention connects both cable conductors to be connected with a compression sleeve,
After forming a conductor shielding layer by winding and heat-sealing semiconductor 1 (I-type tape), as shown in FIG. 14111 to surround the cable conductor connection part 5 so that at least one of them faces upward, and the pressure of the resin injected into the mold is applied to the joint 1+3 of the mold.
After tightening the molds with bolts so that there is a gap of 11 or less, connect the resin extruder 7 to the resin inlet 4 drilled in the mold 1, and then connect the split mold 1.2, pin and conductor connection part 5. A reinforcing insulating layer 6 is formed by extruding and injecting a resin such as polyethylene into the air defense between the two.

次に本発明の具体例について説明するに、66に′VO
vケーブルの端宋を鉛筆状に削って内部導体を圧縮スリ
ーブで接続し、その上に半導電性テープを巻回し加熱融
着して遮蔽層を形成した後、該導体接続部上にニラ割金
型をその合せ目が上方を向くように合わせて被せ、金型
内に注入する樹脂の圧力で金型の合せ+13に05開茂
の隙間と、2渭簿の隙間ができるようにボルト締めした
金型内と、比較例とし導体接続部上に横方向に合わされ
たニラ割金型を被せ上述と同じ条件でボルト締めした金
型内に、夫々架橋剤配合のポリエチレン樹脂を押出注入
し補強絶縁層6を形成してから該補強絶縁層6を、その
外部から200°C、10kg/cJ下で3時間加圧加
熱して成型した本発明の実施例による補強絶縁層と比較
例による補強絶縁層の電気特性を測定した結果は次表の
通りであった。
Next, to explain a specific example of the present invention, in 66, 'VO
The end of the V-cable is shaved into a pencil shape, the internal conductor is connected with a compression sleeve, a semiconductive tape is wound on top of it and heat fused to form a shielding layer, and then a chive split is placed on the conductor connection. Align the molds with the seams facing upwards and cover them, and use the pressure of the resin injected into the molds to tighten the bolts so that there is a gap of 05 openings and a gap of 2 holes at the mold alignment +13. A polyethylene resin containing a cross-linking agent was extruded and injected into the mold that was used as a comparative example, and a mold that was made by covering the conductor connection part with a chive split mold that was aligned laterally and tightening the bolts under the same conditions as above. After forming the insulating layer 6, the reinforcing insulating layer 6 was molded by pressurizing and heating it from the outside at 200°C and 10 kg/cJ for 3 hours.The reinforcing insulating layer according to the example of the present invention and the reinforcement according to the comparative example. The results of measuring the electrical properties of the insulating layer are shown in the table below.

本発明によれば、上述のように二個以上の多分割金型を
用いその合せ目3の少なくとも一つが上方を向くように
合せてケーブル導体の接続部5を囲み、金型内に樹脂を
押出注入して補強絶縁層6を形成することにより、金型
内の空気は金型の合せ目3の隙間から外方にオーバーフ
ローする樹脂と一緒に完全に押出されるので、残留空気
によって成型補強絶縁層6内に空隙が生成する恐は全く
なく上記表から明らかなように電気特性の優れた補強絶
縁層が得られる。なお樹脂の注入圧力で金型の合せ目3
に1111m以」―の隙間ができると金型内の樹脂に加
わる圧力が低下し内部にボイドができる恐れがある。従
って充分満足しうる電気特性を得るには金型の合、旧1
に1?#I以下の隙間ができるように金型をボルト締め
することが望ましい。
According to the present invention, as described above, two or more multi-segmented molds are used, and the connecting portions 5 of the cable conductors are surrounded with at least one of the seams 3 facing upward, and the resin is filled in the molds. By forming the reinforcing insulating layer 6 by extrusion injection, the air inside the mold is completely extruded together with the resin that overflows outward from the gap between the joints 3 of the mold, so the remaining air strengthens the molding. There is no possibility that voids will be formed in the insulating layer 6, and as is clear from the above table, a reinforcing insulating layer with excellent electrical properties can be obtained. Note that the mold seam 3 is created by resin injection pressure.
If a gap of 1111 m or more is created, the pressure applied to the resin in the mold will decrease and there is a risk that voids will form inside. Therefore, in order to obtain fully satisfactory electrical characteristics, it is necessary to
1? It is desirable to bolt the mold so that there is a gap of #I or less.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は従来の補強絶縁層の金型形成法を示
す説明図、第3図は本発明補強絶縁層形成法の一実施例
を示す説明図である。 1:金型    2:金型 3:金型の合せ[14:樹脂注入口 5=導体接続部    6:補強絶縁層q:@脂押出機  5−
FIGS. 1 and 2 are explanatory views showing a conventional method for forming a mold for reinforcing insulating layers, and FIG. 3 is an explanatory view showing an embodiment of the reinforcing insulating layer forming method according to the present invention. 1: Mold 2: Mold 3: Mold alignment [14: Resin injection port 5 = conductor connection part 6: Reinforcement insulating layer q: @ fat extruder 5-

Claims (1)

【特許請求の範囲】[Claims] 遮蔽層を施したテーブル導体接続部上に、二個以上の多
分割金型をその合せ目の少なくとも一つが上方を向くよ
うに合わせて被せ、該金型とケーブル導体接続部との間
の空間部に樹脂を注入充填して形成することを特徴とす
るケーブル接続部の補強絶縁層形成方法。
Two or more multi-segmented molds are placed over the table conductor connection portion provided with a shielding layer, with at least one of their joints facing upward, and the space between the mold and the cable conductor connection portion is A method for forming a reinforcing insulating layer for a cable connection part, the method comprising forming the reinforcing insulating layer at a cable connection part by injecting and filling the part with a resin.
JP57091404A 1982-05-31 1982-05-31 Reinforced insulating layer forming method for cable connector Pending JPS58209875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57091404A JPS58209875A (en) 1982-05-31 1982-05-31 Reinforced insulating layer forming method for cable connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57091404A JPS58209875A (en) 1982-05-31 1982-05-31 Reinforced insulating layer forming method for cable connector

Publications (1)

Publication Number Publication Date
JPS58209875A true JPS58209875A (en) 1983-12-06

Family

ID=14025439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57091404A Pending JPS58209875A (en) 1982-05-31 1982-05-31 Reinforced insulating layer forming method for cable connector

Country Status (1)

Country Link
JP (1) JPS58209875A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127262U (en) * 1974-08-15 1976-02-27
JPS5347821A (en) * 1976-10-13 1978-04-28 Hitachi Ltd Microfish locator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127262U (en) * 1974-08-15 1976-02-27
JPS5347821A (en) * 1976-10-13 1978-04-28 Hitachi Ltd Microfish locator

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