JPS58206128A - Etching device - Google Patents

Abstract

PURPOSE:To equalize the hydraulic pressure of an etching liquid applied to a material to be etched by moving the positions of openings of a plurality of nozzles st up to each manifold in a zigzag direction in a sine-curve form along the direction of movement of the material to be etched. CONSTITUTION:An iron plate 12 as the material to be etched is moved in an etching tank 11 at constant speed, the etching liquid 18 is ejected from a plurality of the manifolds 16 installed to an upper section and a lower section in the etching tank 11 and the nozzles 17 directly coupled with the manifolds, and the nozzles 17 are amplitude-operated within a prescribed range in the direction orthogonal to the direction of movement of the iron plate 12. Each manifold 16 itself is formed curvedly in the sine wave form. When the iron plate 12 is moved and the nozzles 17 are amplitude-operated in the direction orthogonal to the direction of movement of the iron plate, the value of hydraulic pressure applied to the iron plate 12 can be equalized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an etching apparatus used for manufacturing shadow masks for color cathode ray tubes.

[Technical background of the invention]

As is well known, the shadow mask for color cathode ray tubes is
A large number of small holes of a certain shape are regularly arranged on the surface of an iron plate, and the small holes are formed by etching. In other words, an iron plate with a predetermined pattern baked on both sides is continuously moved into an etching tank, and an etching liquid, such as a dichloride solution, is spouted from a nozzle provided in the etching tank, and etching is performed according to the pattern. The large number of small holes mentioned above are formed.These small holes are generally round or rectangular, and their diameter and size regulate the passage of the Naruko beam emitted from the electron gun. This is extremely important as it determines the launching of the luminescent surface formed in the phosphor onto the phosphor.Therefore, when manufacturing a shadow mask, it is important to determine how to form the small holes in a predetermined manner without causing size irregularities. The important point is the shape.

Here, the conventional etching IT will be explained. In Figure 1, 1υ is etching acid, and inside it there are two iron plates 112, which are etching materials, and each pair of rollers α.
3 (61G, which is arranged so as to move continuously in the direction of the arrow 141, is a manifold for night supply of etching. As shown in Figure 2, this manifold 1e is arranged at a constant pitch (F
'm) K are arranged side by side.

aη is a nozzle for discharging the etching liquid, and a constant pitch (P,
), the opening of which faces the iron plate u3, and 1.
Spout etching liquid +, 181 on both sides of sheet pile α4.

Place 2 pieces of iron plate, which is an etching material, into the above-mentioned structure.
It is moved at a constant speed by a pair of rollers 1I3H41, and etching! (IS) is sprayed onto both sides of the iron plate 2 from a nozzle αη provided in the etching tank (111) to perform etching according to the pattern burned onto the iron plate circle. .in this case,
The nozzle η thrown on each manifold is operated with amplitude within a predetermined range in the direction orthogonal to the moving direction of the iron plate, as shown by the arrow in Figure 3, so that one shelf of etching liquid is applied to the iron plate U7J.
The etched surface is made to contact evenly.

In addition, nozzle CI? A well-known mechanism is used for the amplitude operation of l, and illustration is omitted.
Although the manifold tilt and nozzle αη located below the iron plate (1:) are not shown in the figure, they are of course arranged as shown in Figure 1, and similarly to the nozzle αη installed above, the manifold tilts and the nozzle αη operates in a predetermined range. do.

[Problems with background technology]

The above configuration causes the following problems. In other words, even if the etching liquid u81 is ejected at a constant pressure from the nozzle η, the nozzle fin moves in an oscillating manner, so that the etching liquid CI applied to the iron plate α3 is
A difference occurs in the pressure of 8. This is because the distance between the nozzle αη and the iron plate 14 is the smallest when the nozzle σ゛n turns straight down, so the hydraulic pressure applied to the iron plate U3 is also high, but in both images, the distance between the nozzle q1 and the iron plate 0 is the genius. This is because the temporary pressure applied to the iron plate 113 also decreases accordingly. In this way, since the etching solution is not applied with uniform pressure, there will be variations in the size of the holes formed by etching. A flat mask 12G produced by the above method is shown. This flat mask/sword has many small holes 2υ regularly formed.
The iron plate (12) is made one after another along the length.

Figure 5 (2) takes out the above flat mask (■) and inserts the small hole +211 formed therein in the X direction shown in the figure, that is, the iron plate 1.
This figure shows the case where the pore size distribution in the direction perpendicular to the direction of movement of 121 is measured as transmittance.
As shown in Fig. 2, the pitch (pm) changes to almost match the pitch (pm) between 7, 2, 1, 1, and 9 shown in Fig. 2. That is, since the liquid pressure is high directly below the nozzle 111 (also directly below the manifold), the pore diameter increases and the transmittance increases, making it impossible to obtain a uniform pore diameter distribution.

In the conventional etching equipment and Sumire, the nozzles 1η extending over each manifold (lG) are arranged in a straight line in the initial position (when the silkworm is stopped), and all of these are oriented at right angles to the iron plate. Therefore, even if the etching liquid 111 is ejected while operating the nozzle qη, the pressure of the etching liquid 118 hitting the iron plate α2 will not be uniform, and the hole diameter of the small hole 2υ will be different from the pitch (Pl) of the manifold lle. There was a problem in that the performance of the shadow mask deteriorated because it fluctuated at almost equal intervals.

The above-mentioned problem can be gradually improved by increasing the number of manifold ties, but this results in new problems such as the complexity of the entire device and increased cost.

[Purpose of the invention]

The purpose of the invention is to create an etching device that can apply etching liquid to arc-etched materials with uniform pressure without increasing the cost of the conventional manifold 2 and the number of nozzles. I have a lot to offer.

[Summary of the invention]

Etching apparatus according to the present invention; includes an etching layer in which a destructive etching material moves continuously, and a portion of this etching layer that faces the layer etching material, the length direction of which is the direction of movement of the next etching material K ( A. A plurality of manifolds arranged in parallel at irregular pitches as shown in 5, and a plurality of etching nozzles arranged on this manifold at a constant pitch in the length direction of the manifold, each of which opens toward the etching material. This nozzle is equipped with a number of screwdrivers (one step in the direction of movement of the etching material and the direction of transmission), and the opening position of one or more nozzles thrown into each manifold is set to the etching material. The sine a along the direction of #
By making it meander in a curved manner, the hydraulic pressure of the etching liquid applied to the etching material is made uniform even in the direction perpendicular to the direction of movement of the etching material.

[Embodiments of the invention]

Hereinafter, the central part of the present invention, 5! ! An example will be explained with reference to the drawings. The etching apparatus according to the present invention is also installed in the same chamber as the conventional apparatus shown in FIG. The etching solution is spouted from several manifolds U61 provided at the bottom and nozzles attached directly to these nozzles 1171.
As shown in Figure 3, the moving force of the iron plate α2 causes a certain range of amplitude movement in the direction orthogonal to the main plate. ) is made to meander in the shape of a sinusoidal curve along the wharfing direction of the iron plates f and 17J. In order to achieve such a configuration, in this embodiment, each manifold (le itself) is curved in the shape of a sine wave curve, as shown in Fig. (initial state), they may all be oriented perpendicular to the surface of the iron plate 112.In other words, since the point with the highest hydraulic pressure that is perpendicular to the iron plate 112+ is not in a straight line, the iron plate q By moving the nozzle αη and moving the nozzle αη in a direction perpendicular to the above-mentioned movement direction, it is possible to equalize the height of the hydraulic pressure applied to the iron plate t12.

Off-line diagram (α) shows a flat mask made by etching using the apparatus of the present invention, and diagram (A) shows the X direction of the many small holes Qυ formed therein, that is, the direction of movement of the iron plate σ2. The results of measuring the pore size distribution in the direction orthogonal to the transmittance are shown below. As is clear from this figure, when etching is performed using the device K of the present invention, the pore diameter distribution in the X direction is almost flat, and the pitch ( Pl) A high quality shadow mask can be obtained without periodic changes in the pore size distribution of strawberries.

Figure 8 shows another embodiment of the invention. In this D example,
Manifold 161 The eye body uses I2 urine-like material,
This manifold (nozzle for 18I + 1 of 171
1 By setting the mounting position in a sinusoidal curved line, the opening position of the nozzle σ is made to meander in a sinusoidal curved line.

Figure 9 shows one manifold t'tie shown in Figure 8.
K defeated nozzle (17a) (17,6)
---(17y) are juxtaposed.

Even with this configuration, the openings of the nozzles (lη) are not lined up in a straight line when the silkworm movement is stopped (initial state). By equalizing the level of liquid pressure without concentration, variations in pore size distribution can be suppressed.

Although the above explanation has been made regarding the case where a shadow mask for a color cathode ray tube is manufactured by etching, the present invention can be applied to other types of etching as well as the etching apparatus according to the invention.

〔Effect of the invention〕

As described above, according to the present invention, the liquid pressure of the etching group against the material to be etched is made uniform, so that there is no possibility that the pore diameter changes in the period corresponding to the pitch of the manifold as in the prior art. Moreover, there is no need to increase the number of manifolds or nozzles for this purpose, and there is no need to increase the cost.

[Brief explanation of drawings]

Figure 1 is an overall diagram showing a conventional etching device, Figure 2 is
The figure is a plan view showing the arrangement of the manifold and nozzle of the device shown in Fig. 1, Fig. 3 is a partial front view showing the relationship between the nozzle priming operation and the material to be etched in a conventional device, and Fig. 4 is a plan view showing the arrangement of the manifold and nozzle. Figure 5 (6) is a diagram showing the shape of a product etched by conventional manufacturing.
1, 1'F6 is a plan view showing the electrical distribution between the manifold and the nozzle of an embodiment of the etching apparatus according to the present invention, and the off-line view (α) is a diagram showing the results of the etching according to the present invention. A diagram explaining the method for measuring the hole/strain distribution of actual etched specimens, an off-line diagram (j) is a diagram showing the measurement results, and Figure 8 is a plan view showing another embodiment of the invention. ? Figure 9 is a diagram showing the nozzles attached to the single manifold shown in Figure 8 juxtaposed. 11υ...Etching material, 13...Layer etching material:
1F3・Life manifold, 117111・Nozzle, l
IS... Etching liquid.

Claims (3)

[Claims] (1) An etching tank in which the material to be etched moves continuously, and a part of the etching tank that faces the material to be etched is provided so that the length direction is in the direction of movement of the material to be etched. E? A plurality of nozzles for etching liquid are arranged in this manifold at a constant pitch in the length direction thereof and each of them opens toward the material to be etched. , a mechanism for moving the nozzle within a certain range in a direction orthogonal to the direction of movement of the material to be etched; An etching device characterized by meandering in the shape of a sinusoidal curve. (2) The etching apparatus according to claim 1, wherein the manifold to which the nozzle is attached is curved in a sinusoidal curve in order to meander the opening position of the nozzle in a sinusoidal curve. (3) In order to make the opening position of the nozzle meander in a sinusoidal curve shape, a manifold with a single line is used, and the nozzle mounting position with respect to this manifold is made to meander in a sinusoidal curve shape. An etching apparatus according to claim 1.