JPS58206005A - 被膜組成物およびその被膜を設けてなる電子回路 - Google Patents

被膜組成物およびその被膜を設けてなる電子回路

Info

Publication number
JPS58206005A
JPS58206005A JP58051714A JP5171483A JPS58206005A JP S58206005 A JPS58206005 A JP S58206005A JP 58051714 A JP58051714 A JP 58051714A JP 5171483 A JP5171483 A JP 5171483A JP S58206005 A JPS58206005 A JP S58206005A
Authority
JP
Japan
Prior art keywords
aromatic
substrate
chip
acetylene
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58051714A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354401B2 (enExample
Inventor
ロジヤ−・ジエイ・クラ−ク
ジエ−ムズ・エコノミ−
メアリ・アン・フランデラ
ジヨン・リチヤ−ド・サスコ
ロビン・アン・ウイ−タ−
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS58206005A publication Critical patent/JPS58206005A/ja
Publication of JPH0354401B2 publication Critical patent/JPH0354401B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49894—Materials of the insulating layers or coatings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/025—Non-macromolecular photopolymerisable compounds having carbon-to-carbon triple bonds, e.g. acetylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Paints Or Removers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Insulating Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP58051714A 1982-05-24 1983-03-29 被膜組成物およびその被膜を設けてなる電子回路 Granted JPS58206005A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38148582A 1982-05-24 1982-05-24
US381485 1982-05-24

Publications (2)

Publication Number Publication Date
JPS58206005A true JPS58206005A (ja) 1983-12-01
JPH0354401B2 JPH0354401B2 (enExample) 1991-08-20

Family

ID=23505220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58051714A Granted JPS58206005A (ja) 1982-05-24 1983-03-29 被膜組成物およびその被膜を設けてなる電子回路

Country Status (3)

Country Link
EP (1) EP0095048B1 (enExample)
JP (1) JPS58206005A (enExample)
DE (1) DE3378603D1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989007336A1 (en) * 1988-02-05 1989-08-10 Raychem Limited Laminar polymeric sheet
US5487852A (en) * 1988-02-05 1996-01-30 Raychem Limited Laser-machining polymers
EP0584891B1 (en) * 1988-06-28 1997-03-12 Matsushita Electric Industrial Co., Ltd. Method for the formation of built-up films of monomolecular layers using silane compounds having an acetylene bond
US5196251A (en) * 1991-04-30 1993-03-23 International Business Machines Corporation Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate
US7211642B2 (en) * 2005-03-29 2007-05-01 The Board Of Trustees Of The Univeristy Of Illinois Thermosetting aromatic dielectric material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4273906A (en) * 1978-10-31 1981-06-16 International Business Machines Corporation Polymerizable acetylenic oligomers
US4258079A (en) * 1979-12-13 1981-03-24 International Business Machines Corporation Preparation of continuous films of diacetylenic polymers

Also Published As

Publication number Publication date
EP0095048A2 (en) 1983-11-30
DE3378603D1 (en) 1989-01-05
EP0095048A3 (en) 1985-10-23
EP0095048B1 (en) 1988-11-30
JPH0354401B2 (enExample) 1991-08-20

Similar Documents

Publication Publication Date Title
US4592944A (en) Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
AU729554B2 (en) Anisotropic conductive adhesive compositions
HUP0000811A2 (en) Thermally reworkable binders, with them making flip-chip devices and process for producing thereof
US6172143B1 (en) Resin composition for use in sealant and liquid sealant using the resin composition
EP0946646B1 (en) Thermosetting encapsulants for electronics packaging
CA2266314A1 (en) Thermosetting resin compositions useful as underfill sealants
JPH05506691A (ja) 電子用途のための再加工性接着剤
WO2015048575A1 (en) Low dielectric constant, low dielectric dissipation factor coatings, films and adhesives
JPH03500707A (ja) ベンゾシクロブテンに基づくダイ付着接着剤組成物
KR101262151B1 (ko) 퍼(페닐에티닐) 아렌 유도체를 포함하는 폴리머 조성물
JPS58206005A (ja) 被膜組成物およびその被膜を設けてなる電子回路
KR100776554B1 (ko) 접속 재료 및 접속 구조체
KR100310924B1 (ko) 방향족폴리카보디이미드및이를사용한시트
Nagai et al. The curing reaction and glass transition temperature of maleimide resin containing epoxy groups
WO2003057749A1 (en) Organic compositions
US4690962A (en) Composition, coated article and method of coating
JP2005529983A (ja) 有機組成物
EP0842966B1 (en) Polymaleimide resin composition and laminate plate for semiconductor substrate using it
US7064176B2 (en) Coating material for electronic components
KR100540913B1 (ko) 액상 에폭시 수지 조성물
US9890238B2 (en) Curing catalyst for epoxy resin composition, epoxy resin composition comprising same, and apparatus manufactured by using same
TW526233B (en) Liquid epoxy resin composition for semiconductor sealing, sealed semiconductor device, and production process of sealed semiconductor device
MXPA99005407A (en) Thermosetting encapsulants for electronics packaging
KR20100072545A (ko) 속경화형 이방 도전성 접착제 수지 조성물