JPS5820143B2 - How to use the handset - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device for a vehicle, and particularly to a semiconductor device for a vehicle with an improved cooling structure.

An example of a conventional vehicle semiconductor device will be described with reference to FIG.

This semiconductor device for a vehicle is of a forced air cooling type, and a semiconductor device 2 (such as a semiconductor element, a resistor, a capacitor, an axle, etc.) is housed in a wind barrel 1. Outside air is introduced into the air blower 3 for forced cooling.

By the way, the air around the vehicle is used as the outside air.
Abrasion powder from brake shoes and tires, sand dust, rain and snow, metal powder, etc. are floating in the air around the vehicle, and when this is inhaled with the air, some of it adheres to and accumulates on the semiconductor device 2. However, there is a drawback that the insulator of the semiconductor device 2 is deteriorated, leading to dielectric breakdown.

To this end, a filter 4 is provided on the intake side of the wind barrel 1, and a shutter 5 is provided on the exhaust side to prevent dust, rain and snow from entering. It cannot be collected and only prevents the inhalation of relatively large amounts of dust.

On the other hand, it is conceivable to use filter paper instead of the filter 40, but if filter paper is used, the wind pressure loss of the cooling air will increase, and the blower 3 will have to have a large capacity, which is not practical.

Therefore, in the end, there was no choice but to perform frequent maintenance and inspections to remove the accumulated dust.

The present invention addresses the above-mentioned problems, and an object of the present invention is to provide a semiconductor device for a vehicle that can be maintained without sacrificing cooling of the semiconductor device.

That is, in order to achieve the above-mentioned object, the present invention provides an air-to-air system in which a semiconductor device is housed in a closed-structure box body, with one side communicating with the internal air of the box body and the other side communicating with the external air of the box body. A heat exchanger is provided, and a blower is provided in the box body to circulate air within the box body between the semiconductor device and the heat exchanger, so that outside air is not drawn into the box body. It is something.

An embodiment of the present invention will be described below with reference to FIGS. 2 to 4.

The semiconductor device 2 is housed in a box 6 with a sealed structure.
The air that has cooled the semiconductor device 2 through the partition plate is transferred to the box body 6.
An air circulation path is formed that moves upward to the semiconductor device 2 and returns to the semiconductor device 2 again.

An air-to-air heat exchanger 7 is provided in the air circulation path above the box 6, and a blower 3 is provided at another position in the air circulation path.

As shown in FIG. 3, the heat exchanger 7 has air flow paths adjacent to each other that are orthogonal to each other when viewed from above.

The flow path in the direction A of the heat exchanger 7 is installed so as to become a part of the air circulation path within the box body 6, and the flow path in the direction B is opened to the outside of the box body 6. I have to.

The flow paths in the A direction and the B direction have wall surfaces A15B1 made of a single thin metal plate with good thermal conductivity, and the respective wall surfaces A1. B
, has fin A2. B2 is integrally formed.

Therefore, the heat exchanger 7 prevents the cooling air in the A direction and the B direction from intersecting with each other, and provides good heat transfer characteristics between both directions.

With the above structure, in order to operate the blower 3 in the box body 6, the air inside the box body 6 is passed from the semiconductor device 2 through the flow path in the A direction of the heat exchanger 7, as shown by the arrow.
The semiconductor device 2 is circulated from there to the semiconductor device 2.

At this time, if the flow path in the direction of the heat exchanger 70B is provided along the vehicle traveling direction, the outside air will flow through the B direction flow path as the vehicle advances, so the air inside and outside the box 6 will not intersect. Heat exchange is performed, and the internal semiconductor device 2 is cooled.

Therefore, there is no intrusion of air outside the box body 6 into the box body, and as a result, inconveniences caused by the intrusion of dust, rain and snow are eliminated, and maintenance-free operation can be achieved.

By the way, in the above explanation, the heat exchanger 7 is placed in the upper part of the box body 6, but as shown by the two-dot chain line in FIG. There is no problem in having the flow flow through from any direction.

Since the heat exchanger 7 can be placed at any position in the box body 6 in this way, it is possible to use a natural convection system in which outside air is introduced into the B-direction flow path along the movement of the vehicle as described above. It is also possible to install a separate blower to force the flow through.

As explained above, the present invention provides a box for storing semiconductor devices in a sealed structure, and a blower for circulating the air inside the box is provided, and a flow path for passing the air inside the box and an outside adjacent to this flow path are provided. Since an air-to-air heat exchanger is provided with a flow path through which air flows through, there is no intrusion of outside air into the box, and therefore, there is no dust, rain, or snow adhering to the semiconductor equipment housed in it, eliminating the need for maintenance. Therefore, it is possible to provide a semiconductor device for a vehicle that can maintain cooling of the semiconductor device.

[Brief explanation of drawings]

FIG. 1 is a longitudinal side view showing a conventional vehicle semiconductor device, FIG. 2 is a longitudinal side view showing an embodiment of the vehicle semiconductor device according to the present invention, and FIG. 3 is an air-to-air heat exchanger. A perspective view, FIG. 4 is a perspective view showing the vehicle semiconductor device shown in FIG. 2. 2... Semiconductor equipment, 3... Air blower, 6... Box body,
I... Heat exchanger.

Claims (1)

[Claims] 1 Is it a semiconductor device for a vehicle that stores semiconductor equipment inside a box? <When the box body is formed into a sealed structure, a co-current surface is connected to the air inside the box body with the sealed structure, and the other side is communicated with the air outside the box body with the sealed structure, an air-to-air heat exchanger. is provided in the sealed box, and a blower is provided in the sealed box for circulating air within the sealed box between the semiconductor device and the heat exchanger. Semiconductor devices for vehicles.