JPS58198000A - Method and apparatus for manufacturing bimorph diaphragm - Google Patents

Method and apparatus for manufacturing bimorph diaphragm

Info

Publication number
JPS58198000A
JPS58198000A JP57080744A JP8074482A JPS58198000A JP S58198000 A JPS58198000 A JP S58198000A JP 57080744 A JP57080744 A JP 57080744A JP 8074482 A JP8074482 A JP 8074482A JP S58198000 A JPS58198000 A JP S58198000A
Authority
JP
Japan
Prior art keywords
thin film
piezoelectric element
gel
thermosetting resin
bimorph
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57080744A
Other languages
Japanese (ja)
Other versions
JPS613158B2 (en
Inventor
Kyoichi Maeda
前田 杏一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seikosha KK
Original Assignee
Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha KK filed Critical Seikosha KK
Priority to JP57080744A priority Critical patent/JPS58198000A/en
Publication of JPS58198000A publication Critical patent/JPS58198000A/en
Publication of JPS613158B2 publication Critical patent/JPS613158B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives

Abstract

PURPOSE:To eliminate influence exerted to a characteristic due to an adhesive agent, by tightly adhering and coupling a piezoelectric element, at the time of reaction of polymerization or polycondensation of thermosetting resin which becomes a diaphragm. CONSTITUTION:A gel-like base material 19 of thermosetting resin is flowed, extended and formed to a gel-like thin film 20 with uniform thickness onto a container sheet 5 from a jet nozzle, is inserted, held and transferred by the container sheets 5, 22 from the upper and lower parts together with a reinforcing sheet material 21, is slightly hardened by a preheating device 24, the film thickness is adjusted by rolls 13, 14, and thereafter, a piezoelectric element 3 is supplied by one sheet each at constant interval from a piezoelectric element supplying device 26, on a table 25. Subsequently, the piezoelectric element 3 is lightly pressed against the thin film 20 by auxiliary rolls 27, 28 provided behind the table 25, and thereafter, is made to pass through a main heating device 29. By this main heating device, the thin film 20 becomes a hardened thin film 20 as a hardening reaction of polymerization or polycondensation advances, and at the same time, the piezoelectric element 3 is tightly adhered and coupled with the thin film 20. It is punched to a bimorph diaphragm 1 of a desired shape by a press device 30 in the end.

Description

【発明の詳細な説明】 本発明は、例えば圧電ブザーなどに使用するバイモルフ
振動板の製造方法とその装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for manufacturing a bimorph diaphragm used, for example, in a piezoelectric buzzer.

圧室ブザー等において、その発音体として第1図VC不
す如き非対称バイモルフ振動金1が使用さ)1、撮動1
ih2とその片面に貼着したセラミック等のEI:型素
子3とからなる。振動様2と圧電素子6とは、エボキ7
等の接着剤で固着する例を殆どであるが、この接着方法
によると、接着剤によシ重巌およびステイフネスが増大
し、振動周波数が高音側へずれる欠点がある。しかも接
着剤の塗布量などによって共振周波数にバラツキが生じ
、生産。
In a pressure chamber buzzer, etc., an asymmetric bimorph vibrating metal 1 such as the one shown in Fig. 1 is used as the sounding body.
It consists of an ih2 and an EI: type element 3 made of ceramic or the like attached to one side of the ih2. The vibration pattern 2 and the piezoelectric element 6 are
In most cases, the sound is fixed with an adhesive such as the above, but this adhesive method has the drawback that the adhesive increases the stiffness and stiffness, and the vibration frequency shifts to the high-pitched side. Moreover, variations in the resonance frequency occur due to factors such as the amount of adhesive applied during production.

注も悪い。tfc、一般にプラスチックフイルフに別部
品を接着する技術として、熱゛f6着法、超音波接合法
、高周波接合法など、種々知られているが、かかる技術
をバイモルフ振msに使用することは、コスト面または
振動板としての撮動特性そのものが悪化するために、殆
と析なわれていない、そこで本発明は、−り配実状に鑑
みて発明したものであり、その%敵とするところは、振
戴也となる熱硬化性樹脂の重合や縮重合の反応時に、F
tE寒素子1r密着結合せ[7約2ことにある、本発明
の一実施例の製造装置’r、製造方法と一緒に図面にし
たがって説明する。成膜装[4に周知の装置であって、
種々の11式のものがあるが、−例として示したこの実
施例では、っぎのように構成されている、メタルバンド
などのコンテナシート5は、送出ドラム6からロール7
〜14を経て巻取ドラム15へ一定の速度でlヨぼ水平
に移送せしめられる。ベンチ17の上方にはホッパ18
が配置してあり、このホッパ18内に、エボキン。
The notes are also bad. Various techniques are known for bonding separate parts to plastic films, such as thermal F6 bonding, ultrasonic bonding, and high frequency bonding, but the use of such techniques for bimorph vibration MS is The present invention was invented in consideration of the practical situation, and the % enemy is , during the polymerization and condensation polymerization reactions of thermosetting resins, F
A manufacturing apparatus and a manufacturing method according to an embodiment of the present invention, in which the tE cold element 1r is tightly coupled, will be described with reference to the drawings. A film forming apparatus [4] is a well-known apparatus,
Although there are 11 different types, in this embodiment shown as an example, a container sheet 5 such as a metal band, which is configured as shown in FIG.
14, and then horizontally transferred to the winding drum 15 at a constant speed. Above the bench 17 is a hopper 18.
is arranged, and inside this hopper 18, Evokin is placed.

・ フェノール、ボ1)エステル、ポリイミドなどの熱
硬化性樹脂のゲル状素材(ドープ〕19が納めら□  
れている。ゲル状素材19は、ホッパ18下へのジェッ
トノズル20から移送中のコンテナシート5上に所定の
幅でかつ均一な厚みで、ゲル状薄膜20に流延成形され
る。21はガラス績維布や紙など強化ソート材であって
、ゲル状薄M20にロール10を介して送り込1ねる。
・ Contains gel material (dope) of thermosetting resin such as phenol, bo1) ester, polyimide, etc.□
It is. The gel-like material 19 is cast into a gel-like thin film 20 with a predetermined width and uniform thickness onto the container sheet 5 being transferred from the jet nozzle 20 below the hopper 18 . 21 is a reinforced sorting material such as glass fiber cloth or paper, which is fed into the gel-like thin M20 via a roll 10.

強化シート材21にはゲル状薄膜20が含浸し、ロール
11゜12を通過するときに脱泡および膜厚調整が為さ
れる。1にロール11.13間で、コンテナ7−ト5と
同じ材料の上コンテナシート22がゲル状薄膜20上に
被せられる。コンテナシート22は、送出ドラム23か
らロール11.13’i(経て巻取ドラム24に巻き取
られる。したかつてケル状薄膜20は、上下よりコンデ
ナン−)5.22に挾持されて移送され、このとき前加
熱装置k24の中に通さfすることによって幾らか硬化
する、前加熱装置Mt24を通過した薄膜20は、ロー
ル13.14によってさらに膜厚が調整され、コンテナ
シート5.22はそれぞれ巻取ドラム16.24F(1
巻き取られることVこよって薄膜20か剥ぎ取られる。
The reinforced sheet material 21 is impregnated with a gel-like thin film 20, and defoaming and film thickness adjustment are performed when it passes through the rolls 11 and 12. Between the rolls 11 and 13, an upper container sheet 22 of the same material as the container 7-5 is placed over the gel-like membrane 20. The container sheet 22 is transferred from the delivery drum 23 to the roll 11.13'i (and then wound onto the take-up drum 24). The thin film 20 that has passed through the preheating device Mt24, which is then somewhat hardened by passing it through the preheating device k24, is further adjusted in film thickness by means of rolls 13.14, and the container sheets 5.22 are each wound up. Drum 16.24F (1
As it is wound up, the thin film 20 is peeled off.

なお、コンテナシート5,22は、エンドレスパ;・ド
にする場合もある。上記成膜装置4から出てきた薄膜2
0はテーブル25上を通され、その上方に配置しである
王市素子供給装ff126から圧電素子5が1枚ずつ一
定間隔をあけて供給される。
In addition, the container sheets 5 and 22 may be endless pads. Thin film 2 coming out of the film forming apparatus 4
0 is passed over the table 25, and the piezoelectric elements 5 are supplied one by one at regular intervals from the Oichi element feeder ff126 arranged above the table 25.

そしてテーブル25の後に設けrnれている補助ロール
27.28によって圧電素子3は薄膜20′に軽く押し
付けられ、その後で主加熱装@29の中に通される。こ
の主加%装@ 29 VCよって薄膜20は十分な高温
に加熱され、これによって薄膜20は重合や縮重合の硬
化反応が完全に進んで、完全に硬化した薄膜20′にな
り、この硬化反応時に圧1E素子3は薄膜20′に密着
結合する。しかる後に、連続帯状薄膜20′はプレス装
置しに送られ、その固定金型50aと可動金型30bに
よって圧電素子5の位置に合わせて第1図(a)の如き
所望形状のバイモルフ振IE11に打ち抜かれる。バイ
モルフ振動板上が打ち抜刀・九た後のスフラック材20
“は、図示しないスクラップ巻取ドラムにて巻き取られ
る。
The piezoelectric element 3 is then pressed lightly against the membrane 20' by means of auxiliary rolls 27, 28 arranged behind the table 25 and then passed into the main heating device 29. By this main heating @ 29 VC, the thin film 20 is heated to a sufficiently high temperature, whereby the hardening reactions of polymerization and condensation of the thin film 20 proceed completely, and the thin film 20 becomes a completely hardened thin film 20'. At times, the pressure 1E element 3 is tightly coupled to the membrane 20'. Thereafter, the continuous strip-shaped thin film 20' is sent to a press machine, and is formed into a bimorph IE 11 with a desired shape as shown in FIG. Punched out. The top of the bimorph diaphragm is punched and made of sulfuric material 20.
" is wound up on a scrap winding drum (not shown).

なお上記1!施例において、場合によっては、強化シー
ト材21および前加熱装置1i24が省略されることも
ある。
In addition, the above 1! In the embodiment, the reinforcing sheet material 21 and the preheating device 1i24 may be omitted in some cases.

以上、詳細に説明した不発明のバイモルフ振動板の製造
方法およびその装置によれば、FEi!素子の貼着を接
着剤を使用することなしして実現でき、接着剤による特
性への影響を完全に排除できる。
According to the uninvented bimorph diaphragm manufacturing method and device described in detail above, FEi! The elements can be attached without using adhesives, and the influence of adhesives on properties can be completely eliminated.

さらに、m1Flfii自体の歪み変形等が、他の結合
方法に比して少なくでき、発音捷たは撮動の特性への影
蕃がない。
Furthermore, distortion and deformation of m1Flfii itself can be reduced compared to other coupling methods, and there is no effect on sound quality or imaging characteristics.

しかも−頁連続生産できるから生産性に優れ、製造コス
トを著しく下げることができる。
Moreover, continuous production of pages is possible, resulting in excellent productivity and a significant reduction in manufacturing costs.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)はバイモルフ振動槽の一例の正面図、第1
図(b)はその断面図、第2図は本発明の製造装置の漿
略構成図、である。 ユ・・・・・・バイモルフ振蛎敬 2・・・・・・振[15・・・・・・圧電素子4・・・
こ・・成膜装置 5・・・・・・コンテナシート 18・・・・・・ホッパ 19・・・・・・ゲル状素材(熱硬性樹脂)20.20
’・・・・・・薄 膜 22・・・・・・コンテナンート 26・・・・・・圧窒素子供給装置 29・・・・・・主加熱装置 30・・・・・・プレス装置 以   上 出願人 株式会社 梢 ]: 舎 代理人 弁理士 紋土 務
Figure 1(a) is a front view of an example of a bimorph vibrating tank;
FIG. 2B is a sectional view thereof, and FIG. 2 is a schematic structural diagram of the manufacturing apparatus of the present invention. Yu... Bimorph Shikei 2... Shake [15... Piezoelectric element 4...
Film forming device 5 Container sheet 18 Hopper 19 Gel material (thermosetting resin) 20.20
'... Thin membrane 22... Container unit 26... Pressurized nitrogen feeder 29... Main heating device 30... Press equipment Applicant Kozue Co., Ltd.]: Agent Tsutomu Mondo, patent attorney

Claims (2)

【特許請求の範囲】[Claims] (1)  熱硬化性樹脂のゲル状素材を薄膜状に成形し
た後であって、かつ加熱によって硬化反応を起とはせる
前に、このゲル状薄膜の片面に圧電素子を置き、 しかる後に加熱によって上記ゲル状薄膜に硬化反応を起
こさせ、 この硬化反応によって上記薄板と上記圧電素子とを密着
結合せしめること1 、を特徴とするバイモルフ振動板の製造方法。
(1) After forming a thermosetting resin gel-like material into a thin film and before causing a curing reaction by heating, a piezoelectric element is placed on one side of this gel-like thin film, and then heated. A method for producing a bimorph diaphragm, comprising: (1) causing a curing reaction in the gel-like thin film, and tightly bonding the thin plate and the piezoelectric element by the curing reaction.
(2)  熱硬化性樹脂のゲル状素材を薄膜状に連続的
[!it形するrlL膜装置と、この成膜装置力・ら出
てきたゲル、状薄膜の上に、圧1素子を一定間隔をあけ
て載置する圧11N素子供給装置と、圧電素子載置後に
上記薄膜が通される加熱装置と、この加熱装置から出て
きて硬化した上記薄膜を上記圧電素子の位置に合わせて
所定形状に打ち抜くプレス載置とを備えていること、を
特徴とするバイモルフ振動書の製造装置。
(2) Continuously form a thin film of thermosetting resin gel material [! A pressure 11N element feeding device that places pressure 11N elements at regular intervals on the gel-like thin film that has come out of the film forming apparatus, and a pressure 11N element feeder that places pressure 11N elements at regular intervals on top of the gel-like thin film that has come out of the film forming apparatus. Bimorph vibration characterized by comprising: a heating device through which the thin film is passed; and a press mounting device for punching out the hardened thin film that comes out of the heating device into a predetermined shape in accordance with the position of the piezoelectric element. Book manufacturing equipment.
JP57080744A 1982-05-13 1982-05-13 Method and apparatus for manufacturing bimorph diaphragm Granted JPS58198000A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57080744A JPS58198000A (en) 1982-05-13 1982-05-13 Method and apparatus for manufacturing bimorph diaphragm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57080744A JPS58198000A (en) 1982-05-13 1982-05-13 Method and apparatus for manufacturing bimorph diaphragm

Publications (2)

Publication Number Publication Date
JPS58198000A true JPS58198000A (en) 1983-11-17
JPS613158B2 JPS613158B2 (en) 1986-01-30

Family

ID=13726903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57080744A Granted JPS58198000A (en) 1982-05-13 1982-05-13 Method and apparatus for manufacturing bimorph diaphragm

Country Status (1)

Country Link
JP (1) JPS58198000A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116802A (en) * 2017-07-03 2017-09-01 侯新源 One kind is used for rubber extrusion trimming equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107116802A (en) * 2017-07-03 2017-09-01 侯新源 One kind is used for rubber extrusion trimming equipment

Also Published As

Publication number Publication date
JPS613158B2 (en) 1986-01-30

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