JPS58196839U - Resin composition tablet for semiconductor encapsulation - Google Patents

Resin composition tablet for semiconductor encapsulation

Info

Publication number
JPS58196839U
JPS58196839U JP9459382U JP9459382U JPS58196839U JP S58196839 U JPS58196839 U JP S58196839U JP 9459382 U JP9459382 U JP 9459382U JP 9459382 U JP9459382 U JP 9459382U JP S58196839 U JPS58196839 U JP S58196839U
Authority
JP
Japan
Prior art keywords
resin composition
semiconductor encapsulation
composition tablet
tablet
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9459382U
Other languages
Japanese (ja)
Inventor
高島　保隆
多喜　秀彰
井上　保夫
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to JP9459382U priority Critical patent/JPS58196839U/en
Publication of JPS58196839U publication Critical patent/JPS58196839U/en
Pending legal-status Critical Current

Links

Landscapes

  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａ並びに第１図Ｂはそれぞれ本考案タブレットを
示す側面図並びに上面図、第２図は本考案タブレットの
成形法を示す説明図、第３図Ａ、第３図Ｂ並びに第３図
Ｃは本考案のそれぞれの別実施例を示す側面図である。1A and 1B are a side view and a top view showing the tablet of the present invention, respectively, FIG. 2 is an explanatory diagram showing the method of forming the tablet of the present invention, FIGS. 3A, 3B, and 3 C is a side view showing each alternative embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 粉末状樹脂組成物を円柱状に圧縮成形せるタブレットに
おいて、円柱上下の縁部を深圧縮し高密度化したことを
特徴とする半導体封止用樹脂組成物タブレット。1. A resin composition tablet for semiconductor encapsulation, characterized in that the tablet is made by compression molding a powdered resin composition into a cylindrical shape, and the upper and lower edges of the cylinder are deeply compressed to increase the density.
JP9459382U 1982-06-23 1982-06-23 Resin composition tablet for semiconductor encapsulation Pending JPS58196839U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9459382U JPS58196839U (en) 1982-06-23 1982-06-23 Resin composition tablet for semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9459382U JPS58196839U (en) 1982-06-23 1982-06-23 Resin composition tablet for semiconductor encapsulation

Publications (1)

Publication Number Publication Date
JPS58196839U true JPS58196839U (en) 1983-12-27

Family

ID=30226356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9459382U Pending JPS58196839U (en) 1982-06-23 1982-06-23 Resin composition tablet for semiconductor encapsulation

Country Status (1)

Country Link
JP (1) JPS58196839U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198970A (en) * 1975-02-27 1976-08-31 Handotaisochino seizohoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5198970A (en) * 1975-02-27 1976-08-31 Handotaisochino seizohoho

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