JPS58196163A - Soldering method of high frequency coil - Google Patents

Abstract

PURPOSE:To enable built-in solder immersion by face bonding by inserting the electrode of a high frequency coil into the window of a solder proof bottom plate, covering a shield case with a solder proof case and immersing in solder. CONSTITUTION:As electrode 4 is inserted into the window 6 of a solder proof bottom plate 15 in the side of a projection 3 formed on the base body of a high frequency coil, and covered with a solder proof case 17 to cover the shield case 8. Then, temporary fixing bond 18 is applied to fix temporarily the chip parts and high frequency coil to a conductive foil 12 on the circuit base plate 11. After hardening of the bond, soldering 19 is performed by solder immersion method. After soldering, only the solder proof case 17 is removed by a jig etc. By this way, soldering can be performed using built-in immersion system by face bonding even for a high frequency coil having variable mechanism.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of soldering a high-frequency coil in which a high-frequency coil having a variable mechanism is assembled on the conductive surface side of a copper foil or the like of a printed circuit board by face bonding and soldered by a dipping method. .

An example of a high frequency coil having a variable mechanism is an m1 frequency magnetic core. One side of this core is a base body (2+), and two or more protrusions (31) are integrally molded on the side surface of this base body (2). The projection (3) is coated with a conductive paint and fired or plated to form an electrode (4).A coil (5) is wound around this high frequency magnetic core (1), and its terminal end (6) is formed.
is wrapped and soldered to the base of the protrusion (4).

Further, a capacitor (7) may be connected between the two protrusions. This is a high frequency coil having a variable mechanism in which the above coil (5) is mounted in a shield case (8) with a cap-shaped magnetic core (9) prepared in a separate process. Naowa shows the prosthetic leg formed in the shield case (8).

FIG. 2 shows an embodiment in which the high frequency coil having the variable mechanism is soldered to the conductive foil side of the built-in printed circuit board by face bonding. This example uses a beam-flow one-type mounting process, in which conductive paint α3 is applied to the part where the high-frequency coil is to be attached to the conductive foil (121) on the circuit board (111), and resist is applied to the other parts. Apply ink α4.

After installing the coil, heat it to melt and check the mounting. However, such a single-flow method has disadvantages in that the heat processing time during mounting is slow and the high-frequency coil moves during the heat processing. Figure 3 shows the mounting process using the immersion method. In this method, a temporary fixing adhesive Q& is applied, and the conductive foil on the substrate In this method, the entire high-frequency coil is immersed in the solder, so the solder is applied to the base body side of the shield case (8) (Al and large hole 1b).
This has the disadvantage that the cap-shaped high-frequency magnetic core (9) cannot be rotated due to the short circuit between the electrodes (4).

It is an object of the present invention to solve the above-mentioned problems and provide a manufacturing method that allows soldering by a built-in immersion method using face bonding. The details of the method will be explained below.

In FIG. 4, portions (1) to 翻 are the same as those shown in FIG. (I51 is a solder-proof bottom plate made of heat-resistant resin or ceramic, and has a window (16) through which the electrode (4) of the high-frequency coil passes. (17) is made of the same material as the solder-proof bottom plate. It is a solder-proof case that is sized to cover the shield case (3).

In the method of the present invention, the electrode (4) is inserted through the solder-proof bottom plate (151) through the window α61 on the protrusion (3) side formed on the base body (2) of the high-frequency magnetic core (1) of the high-frequency coil. Then, a solder proof case (8) was placed over the shield case (8).
The figure shows the mounting process of the high-frequency coil covered with the solder-proof bottom plate α5) and the solder-proof case C17'l. First, temporary fixing adhesive (18) is applied, and the chip components and the high-frequency coil are was temporarily fixed to the conductive foil U21 on the circuit board TTU, and after the adhesive had hardened, soldering and soldering were performed using the Hirata dipping method. After soldering using the immersion method in this way, solder bruch case (1η
Remove only that part using a jig, etc.

Since the present invention employs the manufacturing method as described above, various conventional problems are solved, and even a high-frequency coil having a variable mechanism can be soldered by the immersion method using face bonding. It is also possible to attach the solder bluff case (171) to a part of the soldering device and automatically insert and remove the high-frequency coil.

[Brief explanation of the drawing]

Figure 1 shows a high-frequency coil with a general variable mechanism, (a) is a perspective view, (b) is a sectional view of the main part, and (c) is a perspective view.
2 is a bottom view, FIG. 2 is a side view showing a partial cross section of a high frequency coil mounted by the beam flow method, and FIG. 3 is a side view showing a partial cross section of the high frequency coil mounted by the immersion method.
Figure 4 is an exploded side view of a partial cross section showing the state in which the Hirata proof bottom plate and solder proof case are inserted into the high frequency coil.
Figures 1 and 5 are the positive ik1 diagram of the solder-proof bottom plate, Figure 6 is a partial cross-sectional side view showing the case of soldering by the immersion method using the method of the present invention, and Figure 7 is the solder solder soldered in the latter half blue. 7 Side view of part of jITTkU showing the state with the case removed,
(1)...High frequency magnetic core, (2I...Base body, (4
1... Electrode, (51.... Coil, (8)... Shield case, Qll.
...Circuit board, G card...4P electric defect, α51...solder proof bottom plate, (161...window, Q7+...solder blue case, u!J...solder. Agent: patent attorney) Island - Ko Figure 1 Figure 2 Flash b Figure 5

Claims (1)

[Claims] (1) In the process of incorporating a high-frequency coil with a variable mechanism onto the conductive foil side of a circuit board etc. by face bonding and soldering using the solder dipping method, a solder-proof bottom plate with a window through which the electrodes can be pushed is attached to the high-frequency magnetic core. A method for soldering a high-frequency coil, which comprises fitting the bottom surface of a base body, inserting a solder-proof case over the shield case, immersing it in solder, and then removing the solder-proof case.