JPS581956A - Flat display unit of electron beam accelerating type - Google Patents

Abstract

PURPOSE:To make it easier to handle a display unit while it is being assembled and to ensure its alignment by a construction wherein a plurality of filaments corresponding to fluorescent picture elements and conductive passages for supplying power to the filaments are formed in one body and gaps are provided in the lower portions of the filaments. CONSTITUTION:In the drawing, a substrate 31 is made of alumina-ceramics and the like, and an insulating layer 32 made of glas glaze is formed on the substrate. Then a filament 331 and a conductive passage 332 are formed in one body in a metal layer 33 made of tungsten, tungsten alloy or the like, The resistance of each filament 331 is set so as to cause thermions to be discharged when power is supplied. The lower portion of each filament 331 is constructed in such a way that a portion of the insulating layer 32 is removed to provide a gap 34. Consequently, alignment at the time of assembling can be readily made, whereas highly accurate positioning is made possible.

Description

[Detailed Description of the Invention] This invention relates to an electron beam accelerated flat display device);
Concerning the improvement of the thermionic source for tatami mats.

As flat display devices, devices using an electroluminescence method, a Zodsma method, and a liquid crystal method are known. However, these O-type flat display devices are not practical as display devices with low resolution images such as character display, but are they suitable for color televisions that require high-speed scanning and high resolution images? The light-emitting efficiency of the front panel K is too high, and it is not practical for use on large screens.

For use in rounded television televisions, etc., an electron stream is modulated and accelerated in a high vacuum to add enough energy to form on a phosphor surface and cause nine phosphor pixels to emit light, and then to irradiate the phosphor pixels. 2. Description of the Related Art Flat display devices using electronic accelerators that reproduce dynamic images are attracting attention.

An example of a conventional electron beam acceleration type flat plate-shaped desugare device will be explained with reference to FIGS. 1 and 2.

Figure 1 is a perspective view of the appearance of a flat display device with a diagonal length of approximately 1.2 feet. It contains electrodes, a fluorescent surface on which fluorescent pixels are formed, etc. The display surface has a fluorescent surface adhered to it and is transparent on a flat panel made of nine glasses! A protective plate 11 made of a rusty plate, a lath plate, a t-Las plate, or the like is provided.

Reference numeral 12 denotes a frame-shaped support provided on the periphery of the protective plate 110, and 23 indicates seven lunges formed integrally with this support.

FIG. 112 is an exploded perspective view of the main parts of the internal structure. 2
Reference numeral 1 denotes a back substrate made of a metal plate or the like that constitutes the back envelope of the flat display device, and a space V is placed on top of this.
ZX is fixed, and a flat thermionic beam source 24 is provided on this spacer 22 via a metal support plate 2J. A conductive path 24 is formed on the substrate 241 by opening a hole at a position where the filament 2 is made of, for example, a coiled tungsten wire.
41 is arranged at each pixel position.

A first modulating electrode group 25 and a second modulating electrode group 26 are stacked on the thermionic source z4. The first modulating electrode group 2J corresponds to the effective part of the thermionic source 24. A large number of circular electrode pieces are arranged in the vertical axis (Y) direction of the 1-day array device on an insulating substrate with holes drilled at the positions shown in FIG. A hole with a smaller diameter O is provided in the substrate 251 to correspond to the hole in the substrate 251 . A large number of glue-shaped electrode pieces 21 are arranged on the insulating substrate 2 #1 in the horizontal axis (X) direction of the display device. Similar holes are provided corresponding to the holes. That is, the linear electrode pieces 2J of the first modulation electrode group 25 and the linear electrode pieces 26 of the second modulation electrode group 26 are arranged in the horizontal axis (X) direction and vertical direction of the flat display device. Axis (Y
) direction to form a matrix and a box.

The first and second modulation electrode groups
A flat accelerating electrode 2a having holes fK corresponding to holes tt is provided.

On this accelerating electrode 2B, there is provided a planar mirror 30 having one of its optical surfaces adhered thereto via a spacer 29 made of an insulating inorganic material and having a substantially circular cross section. The phosphor surface is, for example, a band-shaped phosphor layer that emits red, green, and blue colors forming a phosphor pixel. These are formed by regularly arranging them parallel to each other to form a surface envelope. The number of phosphor pixels is approximately 75×1G in the case of color.

Features of the flat disk gray device with this structure: One phosphor pixel is associated with one hot cathode, a pair of modulating electrode holes, and one accelerating electrode hole. It has the simplest structure.

(9) When forming a large screen with such a structure, the internal electrodes, that is, the planar thermionic beam sources, the first and second
It is necessary to combine modulation electrodes and acceleration electrodes that are divided into harmful dimensions for processing and assembly. For example, the filament of a flat thermionic beam source is 75 x 101! Am degrees, and if they were all connected in parallel, the supply current would reach as much as 1 kA, and the supply method required special measures, and the practical supply current unit was 70. It is desirable to separate the terminals, remove nine current supply terminals, and connect them in series and parallel.

In such a flat display device, the structure of the thermionic beam source in particular has a great impact on the overall function and the assembly process, which requires high precision. There is a method of forming the wire into a coil shape and welding it to the electrode metal. Of course, it has been confirmed that the thermionic beam source created in this way fulfills the desired function. However, the process described above and the process of creating 75 x 10' filament groups requires a large amount of time. Do ζ■
Because it is a minute structure, it is easily deformed or cut during fabrication or assembly, making it extremely difficult to handle, and (2) having difficulty achieving positional accuracy.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electron beam acceleration type plate-shaped display gray device having a thermionic beam source that eliminates the above-mentioned difficulties.

In the thermionic beam source of the present invention, a plurality of filament portions corresponding to phosphor pixels and a conductive path portion for supplying current to the filament portions are integrally formed by a metal layer provided on a predetermined substrate with an insulating layer interposed therebetween. , and a structure in which a portion of the lower insulating layer of each filament portion is removed to provide a gap below the filament portion.

When such a thermionic beam source structure is used, handling during assembly of the display device becomes easier, and accurate processing and alignment can be ensured. In addition, such a thermionic source structure is
Compared to the conventional method 4, in which each filament is made independently by molding a tungsten wire, it can be easily prepared through processes such as vapor deposition, processing, and etching.

A thermionic beam source according to an embodiment of the present invention will be explained using FIG. Reference numeral 11 denotes a substrate made of Aluna ceramics or the like, on which an insulating layer 32 such as glass glaze is formed, and on top of that is a metal layer IJ made of tungsten or tungsten alloy! J filament part is,
and a conductive path portion jJ are integrally formed. The resistance value of each filament portion is set so that thermoelectrons are emitted when energized. Also, each filament part j
At least a portion of the insulating layer 32 is removed from the lower part of the insulating layer 31, resulting in a structure having a gap Hs4. Figure 3) is (&
) is shown.

As mentioned above, the thermionic beam source of this structure has an integrated structure in which the conductive path and the filament are constructed using the same metal layer on the substrate, so alignment during assembly is easy and high precision can be achieved. Positioning is possible, and handling and assembly work are also simplified. Furthermore, since the filament part is not in contact with the substrate, there is less heat loss when electricity is applied, and there is less chance of contamination with substances forming the substrate or insulating layer during heating.

In FIG. 3, the conductive path portion 33 and the filament portion 331 are parallel, and the filament portion 33. In this example, all of the conductive path sections and filament sections are connected in parallel, but various arrangements are possible for the conductive path section and the filament section. Another arrangement example is the 4th
As shown in the figure. FIG. 4(1) shows that the longitudinal direction of the filament portion JJ1 is connected to the conductive path portion 33. This is a parallel arrangement orthogonal to the Further, as shown in FIG. 4, 6)K, it is also possible to arrange three filament sections 331 in series in parallel, corresponding to one pixel consisting of three electron guns.

This type of filament connection has the advantage that the voltage applied to the electrodes can be increased, and therefore the filament can be ignited with a small amount of current. The number of such filaments connected in series can be increased as required, and all the filaments can be connected in series as shown in FIG. 4 (@).

Next, a method of manufacturing the thermionic beam source as in the above embodiment will be explained with reference to FIG. First, as shown in FIG. 5(a), a laminate is prepared in which a substrate JIK glass insulating film 2 and a metal layer IJ are formed by, for example, screen printing and the Suno-do tsuttering vapor deposition method. Resin J
5 is coated using a spinner method, for example, and exposed and imaged using a mask in the shape of the conductive path portion and filament portion as shown in Fig. 5). Next, in the case of tungsten, the metal layer JJ is etched with an alkaline solution of potassium 78 lysyanide to form a filament part 33 and a conductive path part J1, as shown in FIG. remove. Next, the photosensitive resin 36 is applied again, exposed, and developed. The filament portion 331 and its surroundings are exposed as shown in 1l(d). After that, using a mixture of fluorine and ammonium heptadide, for example, the vitreous insulating layer 3 is formed around and under the fluorine IIJJ* as shown in FIG.
Remove 2. In this case, in normal solution etching, etching progresses horizontally to the same extent as in the depth direction, so-called side etching.

If the insulating layers 3 and 2 are etched to a depth greater than the width of the filament portion 331, a gap 34 will be formed below the filament portion 33, and the filament portion 331 will be in a floating state.

Thereafter, as shown in FIG. 5(f), the photosensitive resin 36 is removed to obtain the desired structure.

A simpler manufacturing method 4 is possible. That is, FIG. 5(c)
Step t is the same as the above step, but in this case, the width of the conductive path portion 33 is pre-machined and the width of the insulating layer 32 to be etched is twice the depth of the insulating layer 32.
Make it larger than twice. Then, the process of FIG. 5(d) is omitted and the insulating layer 12 is directly immersed in a tinda solution, for example, a fluorinated sulfuric acid mixture.

As a result, the metal layer 33 acts as a mask and etching progresses, and the insulating layer 3 under the narrow filament portion 311
2 is removed by side etching, but the conductive path portion 33! An insulating layer 32 remains under the structure, and the desired structure as shown in FIG. 5(f) can be achieved.

FIG. 6 shows an example of a nine-layer structure in which the dimensions of the barrier 1111J4 between the filament portion 33 and the insulating layer 320 can be freely controlled. First, as shown in Figure 6 (,), board J1
An insulating layer 32 such as glass is formed on top of the K
A 11102 film (or phosphosilicate film) 31 is formed by a CVD method or the like. Next, as shown in Figure 6), leaving the part where the filament is to be formed, the 8102 film 3
1 is removed using photo-etching technology. Next, metal layer 3
3. For example, tungsten is formed by the snow ring method as shown in FIG. 6(c), and the metal layer 33 is etched to form a conductive path portion 33 as shown in FIG. 6(d). 33 filament portions are formed. Next, before immersing the filament in the glass etching solution, the lower part of the filament 810. Layer 31 is m-. Since this liquid hardly dissolves the glass layer, the filament jar can be released from the insulating layer 32 by this treatment. Next, if the insulating layer J2 is processed with a tincture solution, there is almost no need to consider side etching, and the sixth
As shown in Figure (f), the insulating layer 32 can be etched to any depth.

In addition to alumina, the substrate to be used may also be made of a laminated glass material such as spinel or cordierite, or a metal such as molybdenum, tungsten, or iron.

In addition, any flat plate that can be coated with a glassy glaze can be used. The insulating layer is preferably a glassy glaze that is stable against strong acids or strong alkali and can be processed with a hydrofluoric acid etching solution. As mentioned above, a multilayer structure with StO, films, etc. can also be used. However, it is necessary to match the thermal expansion depending on the substrate material to avoid problems such as cracking and cracking. If the substrate material is resistant to acid or alkali, such as aluminum, it is sufficient to coat only one side, but if the substrate is made of tungsten, the entire surface must be coated to protect the substrate from the chemical and tinda liquid. Examples of insulating layers when the substrate is alumina include calci, -mualonosilicate glass, and lead borate silicate glass, and when the substrate is tungsten, there are borosilicate glasses.1 Filaments and conductive paths The metal layer is heat resistant and has 7
Preferred are metals that are stable in trous acid-based etching solutions and can be etched with strong acid or strong alkaline etching solutions. For example, tungsten, TI-W & any tungsten alloy, tantalum, etc. can be used, but tungsten or tungsten alloy, which has a good track record as a filament material and is relatively easy to etch, is preferable. Next, the structural specifications of the filament part and conductive path part. Let's talk about. - As an example, consider a case in which a tungsten filament having a number of turns as shown in FIG. 4(b) and having a thickness of 1.0 .mu.m and a width of 5 .mu.m meanderes 10 times with a pitch of 20 tones and a width of 30 .mu.m.

The resistance of this part is about 6.40.38 at 1000℃ at room temperature.
．． 8 OK, rtc awycn due to 6° thermionic emission
? If the current rating of - element sb is required, then the current of element sb is 3 m
A. The voltage will be 0.12VK. If three filaments (one pixel) are connected in series and 100 i1i elements are arranged horizontally, a current of 300 mA and a voltage of 0.63 V are required per column. If the width of the conductive path is 500μ, even the part with the highest current density will have a width of 0. 'ni/ex2 becomes fK. Further, assuming that the temperature of the conductive path is 100° C., the resistance ratio with the filament portion is approximately 1300 to IK. If the size of the pad of the conductive path between the filaments is 100 μ x 100, the horizontal and vertical widths of the filament are 300 μ and 700, respectively, which is the pixel density required for a flat display of 4°. It can be seen that the temperature is sufficiently adjusted, and the temperature of the IC74 lament can be increased as well as the function of the conductive path portion can be sufficiently exerted as shown in the above estimation. Furthermore, the thermal expansion of tungsten as the temperature rises from room temperature to 1000°C is O
, S* or less, and it is about twice that for other metals, so the droop of the filament in the above structure is about 10 μm in the case of tungsten. Therefore, if the gap under the filament part is kept at a distance of at most 30 microns, there is no risk of contact. In addition, when processing and chipping an insulating layer of about 30μ, the above-mentioned Demenzi,
In this case, the width etching at the bottom of the conductive path is also less than 30μ), and that part does not separate from the substrate.

As explained above, according to the present invention, by using a thermionic beam source integrally formed with a large number of filament portions and a conductive path portion for supplying electricity to the filament portions, an assembly process of an electron bundle acceleration type flat display device is performed. This makes it possible to easily perform alignment, ensure alignment, and realize a high-performance flat disk gray device.

[Brief explanation of drawings]

Figure 1 is an external perspective view of an electron beam acceleration type flat disk array device, Figure 2 is an exploded perspective view showing its internal structure, and Figure 3 is a configuration of a thermionic source according to an embodiment of the present invention. Figure, 4th
Figures (a) to (,) show the arrangement of the filament part and the conductive path part in other embodiments. J, Figure 5(a)-(f
) is a schematic cross-sectional view showing the manufacturing process of the thermionic beam source of the above embodiment, and FIGS. 6(a) to (f) are schematic cross-sectional views showing other manufacturing processes. 31... One substrate, J2... Insulating layer, 33... Metal layer, 131... Filament part, 332... Conductive path part, 34-... Gap.

Claims (2)

[Claims] (1) Inside the vacuum container, there is a thermionic source that emits a thermionic beam corresponding to each phosphor pixel, and the electron flow from the thermionic source is modulated according to an information signal and extracted. a plurality of modulation electrode groups, an acceleration electrode that accelerates the electron flow taken out by the modulation electrode group, and the phosphor pixel that emits light due to the collision of the electron flow accelerated by the acceleration electrode. In an electron beam accelerated flat display device comprising nine phosphor surfaces, each of the phosphors is formed on a substrate with an insulating layer interposed therebetween, and a round metal layer is formed on the substrate. A plurality of filament parts corresponding to the pixels and a conductive path S for supplying current to the filament parts are integrally formed, and at least a part of the lower insulating layer of the filament parts is removed to form a gap below the filament parts.ゐThe electron beam accelerator part has a flat plate shape F4, which is characterized by a closed structure! Ray device. (2) The electron beam accelerated type flat display device according to claim 1, wherein the substrate is made of alumina ceramic, the insulating layer is made of glass, and the metal layer is made of tungsten or a tungsten alloy.