JPS58193370A - Surface treatment and application thereof - Google Patents

Abstract

PURPOSE:To highly clarify and activate the surface of a workpiece to be treated, by applying low-temp. plasma to said surface. CONSTITUTION:Microwaves generated at a microwave power source 11 pass through a waveguide 12 to ionize H2 gas introduced through a gas-introducing opening 13 into the state 10 of low-temp. plasma. Said gas 10 under the condition of low-temp. plasma clarifies and activates the surface of a metal material 15 existent at the center of a treating vessel 14. The gas is then discharged through an exhaust opening 18. The low-temp. plasma may be formed by DC glow discharge. This method is esp. suitable for treating the surfaces of metal members in pressure-welding a plurality of metal members to manufacture a laminated article.

Description

[Detailed description of the invention] (Technical portion of invention W) The present invention relates to surface treatment using low temperature plasma.

(Technical background of the invention and its 5 problems) Conventionally, chemical treatment and mechanical treatment have been used to simultaneously clean and activate the surface of a material.

Electrical and combined treatments have been used.

For example, chemical treatments include acidic treatment using hydrochloric acid or sulfuric acid, and alkaline treatment using sodium hydroxide.

For mechanical processing! For example, there are emery polishing, brushing, and buffing.

Although electropolishing has been attempted as the electrical treatment, it has been difficult to obtain highly cleaned and activated surfaces using these methods alone or in combination.

(Purpose of the invention Φ) The purpose of the present invention is to relatively highly clean the surface of the object to be treated,
The goal is to find a way to make it active.

(Summary of the Invention) The present invention is a surface treatment method characterized by applying low-temperature plasma to the surface of an object to be treated, cleaning the surface to a relatively high degree, and scrubbing the surface with active scrubbing.

Plasma is a state in which gas is ionized and the positively and negatively charged particles vibrate to become electrically neutral. Plasma with low gas ionization and low temperature is called low-temperature plasma.

The present invention is a method in which gas ionized in a low-temperature plasma state is bombarded with or adhered to the surface of a material to increase the activity and cleanliness of the surface.

Next, we will discuss factors related to the cleanliness and activity of low-temperature plasma.

Cleaning and activation of the material surface depends on the speed at which the low-temperature plasma is applied to the surface of the object to be treated, the temperature of the low-temperature plasma, and the duration of the treatment. The higher the speed at which the low-temperature plasma is applied to the surface of the object to be treated, the more the surface can be cleaned and activated, but in order to avoid destroying the material, it is best to set an upper limit.

The higher the temperature of the low-temperature plasma, the more the surface can be cleaned and activated, but it is best to set an upper limit to avoid destroying the material.

The longer the treatment time, the easier it is to increase surface activity and cleanliness, but if the treatment time is too long, there is a high possibility that the material will be destroyed.

Therefore, when using low-temperature plasma, the speed at which the plasma impinges on the surface, the temperature of the low-temperature plasma, and the processing time are determined depending on the material of the object to be treated.

Next, there are various methods for generating low-temperature plasma.
The cleanliness and activity factors for each method are described below.

For example, by generating microwaves,
There is a method of obtaining low-temperature plasma by ionizing gas using chroma waves, and processing is performed by guiding this plasma to the surface of the object to be processed. In this case, the speed at which the low-temperature plasma impinges on the surface of the object to be processed increases as the gas flow rate and gas pressure increase, and the temperature also increases as the gas flow rate and gas pressure increase. Therefore, in this case, it is preferable to determine the gas flow rate, pressure, and processing time depending on the material of the object to be processed, and determine the cleanliness and activity of the surface of the object to be processed.

Another example is a method of obtaining low-temperature plasma by ionizing gas by direct current glow discharge using the object to be processed as an electrode. In DC glow discharge, ions are accelerated by a sharp potential gradient near the surface of the object to be processed and collide with the surface of the object to be processed. At this time, the secondary electrons on the surface continue to discharge at Tobita.The surface is damaged by the collision of ions.

Since sputtering is performed by sputtering, cleaning and activation can be achieved more easily than the above-mentioned microwave method for the same power consumption. Mashi, that IiL[Mo1
゛It rises with an increase in voltage. Therefore, in the case of DC glow discharge, the voltage and treatment time are determined by the material of the object to be treated, which preferably determines the cleanliness and activity of its surface.

Conventionally, when multiple members are crimped together to create a multilayer material, the surfaces of the members are made clean and active by chemical or mechanical treatment. However, these treatments were not sufficient, and a properly crimped multilayer material could not be obtained in some cases.

Therefore, the present invention is particularly effective in this case.

(Example of the invention) Example 1 An embodiment of the present invention will be described with reference to the drawings.

Figure 1 shows low-temperature plasma generated by microwaves,
1 is a cross-sectional view of an apparatus for treating a surface.

Microwaves generated from the microphone-wave transmission 11 are transferred to the waveguide 1.
The gas introduced into the device through the gas inlet 13 is ionized and turned into a low-temperature plasma 10. A low-temperature plasma-like gas 10 is placed in the material 1 in the center of the processing container 14.
5 is made clean and active, and then exhausted from the exhaust port 18. In this case, the material 15 is treated while being moved by the rolls 16 and 17, thereby completing the low temperature plasma treatment in a short time.

The gas used was hydrogen and the pressure was 2 Torr. The hydrogen feed rate was 3 Qce/min, the frequency of the generated microwaves was 13.56 MH2, and the material running speed was 10 Ml/sec.

The material used was @10CII, 0.1M thick, and 100 tubes long. When the nickel was subjected to low-temperature plasma treatment under 1 or more conditions, it was cleaner than chemical, chemical, mechanical, or electrical treatment. An active nickel surface was obtained.

Furthermore, when the surfaces of the ribbon-shaped nickel material and the ribbon-shaped stainless steel material were similarly treated with low-temperature plasma and crimped together, a multilayer material with very good adhesion was obtained. When 50 pieces of this multilayer material were created under the same conditions, all multilayer materials with good adhesion were obtained.

Seven out of 50 multilayer materials had good adhesion obtained by degreasing and brushing. Therefore, the present invention seems to be effective for cleaning cladding members.

Example 2 Other embodiments of the present invention will be described with reference to the drawings.

FIG. 2 is a cross-sectional view of an apparatus that generates low-temperature plasma by DC glow discharge to treat the surface of a material.

Gas is introduced into the processing container 24 from the gas inlet 23 .

An electrode 29 provided at the upper end of the processing container 24 is used as a positive electrode, and a processing material located at the center of the processing container 24 is used as a negative electrode, and a voltage is applied between them. As a result, the gas is glow-discharged and a low-temperature plasma 20 is generated. The processing gas ions 20 sputter the surface of the object to be processed, thereby making it clean and active.

The used gas is exhausted from the exhaust port 28 of the processing container 24.

The object to be processed 25 is run by rolls 25.27,
The inside of the processing container 24 other than the electrode 27 and the traveling material 25 is insulated.

The gas used was argon, and the pressure was 7.5X 10-
” Torr, and a DC voltage of 3KV was applied.

The material used was A copper with a width of 10 m (o, im) and a length of 100 m, and the running speed of the material was 10 m/yard.

When copper was subjected to low-temperature plasma treatment under the above conditions, the copper tDi was cleaner and more active than chemical treatment, mechanical treatment, or electrical treatment. The face was obtained and lost.

(Effects of the Invention) The present invention is a surface treatment method characterized by applying low-temperature plasma to the surface of an object to be treated to make the surface clean and active.

II5 with low-temperature plasma sober! The rate at which the plasma is applied, the temperature of the cold plasma, and the time during which it is treated are selected depending on the material to be treated, and the optimal conditions result in a relatively highly clean and active surface of the treated object.

Before crimping each member together in the process of manufacturing multilayer materials,
There is a need to keep the cladding part clean and active.
By using the present invention in this process, a multilayer material with extremely good adhesion can be produced.

[Brief explanation of the drawing]

FIG. 1 shows an apparatus that generates low-temperature plasma using microwaves to treat the surface of a material, and FIG. 2 shows an apparatus that generates low-temperature plasma using DC glow discharge to treat the surface of a material. 10.20...Low temperature plasma 11-...Microwave power source'12......Waveguide 13.23 Gas inlet 14.24...Processing container 15.25...Object to be processed 16.17.26.27... Roll 18.28... Exhaust port 29... Electrode

Claims (1)

[Scope of Claims] 1. A surface treatment method characterized by: 1. Applying low-temperature plasma to the surface of the object to be treated to clean and activate the armpit surface.-9. 2. The surface treatment method according to claim 1, wherein the low-temperature plasma is generated by microwaves. 3. The surface treatment method according to claim 1, wherein the low-temperature plasma is generated by direct current glow discharge. 4. The surface treatment method according to claim 1, wherein the object to be treated is metal. 5. The surface treatment method according to claim 1, wherein the object to be treated is intended to create a multilayer material by press-bonding a plurality of members.