JPS58188127A - Semiconductor wafer - Google Patents

Abstract

PURPOSE:To improve the efficiency of P/W test, assemblage, selection, etc. in forming chip areas on a semiconductor wafer by such an arrangement wherein an optional character or symbol containing information whereby each of chip areas can be distinguished from others is provided in each chip area. CONSTITUTION:In preparing a semiconductor integrated circuit, many chips having areas of diffusion, whring, etc. are formed by using a mask of quartz glass. At this time, in each of chips A11-A22, an area D of which size is of such a degree that will not give any influence on a functional area C of the chip is formed at such a corner outside the area C, and an optional character, symbol, etc. are provided in the area. By this arrangement, chips can be distinguished from outside, even if relative positions of chips are changed after they are scribed. Based on test information, it also becomes possible not only to distinguish good chips from bad ones, but also to classify good ones in ranks, and production efficiency can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides semiconductor ueno)-! % Ueno 1-
This invention relates to a semiconductor urchin/"t-" in which identification information is provided in each region that becomes a chip.

Currently, semiconductor manufacturing uses a 3 to 5 inch square glass mask to expose the resist coated on the silicon bar to ultraviolet rays, etc., and remove the unexposed areas (negative resist). (or remove the exposed areas (positive resist)) Use the remaining oxide film as a mask to diffuse impurities to produce P-type and N-type semiconductors, and interconnect with Al, Ni, polysilicon, etc. The company manufactures semiconductor integrated circuits.

When an electron beam exposure apparatus is used, the diffusion and wiring processes are the same as those for the glass mask, except that the resist on the Kli-contact electron beam is exposed instead of the glass mask.

After completing all processes such as diffusion and wiring, the wafer is subjected to a P/W test using an LSI tester, proper, etc., and defective chips are marked with some kind of mark, so that it is possible to distinguish between good and defective chips when assembling them after scribing. It looks like this.

If the l chip has one circuit (one function), there is no problem with adding some kind of mark, but if the l chip has two or more circuits (two or more functions)
If some of the circuits are good, the chip can be assembled and used. In this case, it is necessary to know the coordinates on the wafer and which circuits on the chip are good. To obtain this information, a tester and a prober having functions such as wafer mapping may be used.

However, even with this method, if the relative positions of each chip change as the wafer is scribed, it becomes impossible to know where each chip is located on the wafer.

An object of the present invention is to provide a semiconductor wafer that does not have these conventional drawbacks.

Another object of the present invention is to provide a method for manufacturing a semiconductor integrated circuit device that increases the efficiency of P/W testing, assembly 1 selection, etc. in the manufacturing of semiconductor integrated circuit devices. ! It is about providing.

A feature of the present invention resides in a semiconductor wafer in which each chip has arbitrary characters, symbols, etc. containing information that can distinguish each chip region manufactured on the wafer. It is possible to include information on this chip that can also distinguish the position of the chip on the wafer. Also, ζO? The information on the YP is information that can be distinguished by wafer.

It is possible to include information that allows the date of manufacture to be distinguished.

Next, embodiments of the present invention will be described with reference to the drawings.

Figure 1 shows an example of a mask for manufacturing semiconductor integrated circuits using 5-quartz glass, and a part of the entire process is manufactured using this mask.
In addition, the portion manufactured using this mask is visible from the outside when all processes such as diffusion wiring are completed. Examples of this process are Alonium, poly/lico/etc. deposition processes. Also.

AII + A12 r...Aij・ in Figure 1
・The functions of each chip marked ・A77 shall all be the same. Figure 2 is an enlarged view of each nap putter / (Aij) in Figure 1.
The symbol or character in the lj digit [= is written in such a size that it does not have any effect on the area C that functions as a semiconductor integrated circuit during mask manufacturing. In this embodiment, as shown in FIG. 3, "1" is written in areas A and D' shown in FIG. 3 at the time of mask manufacturing.

Further, the position of the region D' and the thickness of the characters and symbols can be arbitrarily determined by the semiconductor integrated circuit designer. When a semiconductor integrated circuit is manufactured using this mask, letters indicating the position of each chip remain on the wafer, and even if the relative position of each wafer changes after scribing, it can be identified from the outside.

FIG. 4 shows an example in which a pattern is written directly on a wafer using a beam exposure device. In this case as well, #'i,
Information indicating the position of each chip is written when the electron beam is off. At this time, the position and size of the characters and symbols indicating the position are arbitrarily determined so as not to affect the function of the semiconductor integrated circuit on the chip.

Figure 5 shows the step 7' used when using a stepper.
This is a reticle that magnifies the putter by 10 times, but in this case, the D area in Figure 5 is made transparent, and when the stepper projects the pattern of each chip, the position is determined through the D transparent area. The information shown will be projected. However, if position information is to be projected separately from the projection of a reticle for semiconductor manufacturing, the area D should be made opaque so that no light passes through.

Both of the above examples are characters that can be read by human eyes.

Symbols are created on wafers during the manufacture of semiconductor integrated circuits, but when using automatic assembly equipment with functions such as pattern recognition, the characters and symbols indicating this positional information can be identified by putter/recognition equipment. The pattern can be made on a gold wafer. This example is shown in Figure 6. In FIG. 6, person is a prober, L8I tester, BVi scribe processing, C is an automatic assembly device, and D is an information processing device that performs data processing, pattern recognition, etc. A.

C and DI4 are connected to each other by a bus and can receive and receive data. The actual processing method is as follows.

A wafer that has been P/W tested with the LSI tester proper has position information on the wafer, and whether the wafer is good or not.

Information such as the rank of defective and non-defective products is sent to the information processing device. The next KB's scribed wafer is sent to the assembly device at C, but if the wafer is manufactured using a glass mask during this process, it can be stored at D if the processing order is managed for each wafer. It is now possible to rank not only good and bad products but also non-defective products based on the test information sound, which eliminates the need for ranking time, which was traditionally done after completing one assembly task, and can also shorten test time. Become.

When using electron beam exposure or a stepper.

Since it is possible to create information on each chip to distinguish each chip by each wafer and each manufacturing date, there is no need to manage each wafer.

Further, when there are circuits having multiple functions in the same chip, by using the apparatus shown in FIG. 6, it is possible to automatically perform tasks such as assembling only the non-defective parts of the circuit.

Even if you do not have the device shown in Figure 6, if you create a pattern on the chip that allows a person to map the wafer position, you can use it in conjunction with the wafer mapping function.

It is also possible to select only the food portion of a circuit with multiple functions faster than before.

As explained above, the present invention enables each chip on a semiconductor integrated circuit wafer to be printed with arbitrary characters having compensation information for that chip on the wafer at the time of semiconductor integrated circuit manufacturing. This has the effect of increasing efficiency.

[Brief explanation of the drawing]

FIG. 1 shows a quartz glass mask used in one embodiment of the present invention, and a specific step of the entire process is manufactured using this mask. FIG. 2 shows one chip pattern /A4 Jf taken out from FIG. 1, and a specific pattern / shown at position f1/11 on the mask is written in the D area. w, Figure 3Fi is an enlarged view of the part D in Figure 2, and in this example, it is A3. ``Yo 1'' putter/ is written to indicate that the chip is located on the tip. FIG. 4 shows a wafer made by writing a pattern on the wafer using a beam-forming device, and information indicating the fit is created on each chip. The m5 diagram is a 10x reticle for use with stepper 2, and the D@ area is transparent. Figure 6 shows two devices assembled from LSI P/W.A...proper, LSI tester. B...Scribe processing, C...Automatic assembly machine. D... Information processing device. Figure 1 Figure 3 Figure 4 Figure 5

Claims (1)

[Claims] A semiconductor wafer characterized in that arbitrary characters and symbols containing information for distinguishing each chip region manufactured using scissors are provided on each chip region.