JPS58183699U - bubble memory package - Google Patents

bubble memory package

Info

Publication number
JPS58183699U
JPS58183699U JP8000382U JP8000382U JPS58183699U JP S58183699 U JPS58183699 U JP S58183699U JP 8000382 U JP8000382 U JP 8000382U JP 8000382 U JP8000382 U JP 8000382U JP S58183699 U JPS58183699 U JP S58183699U
Authority
JP
Japan
Prior art keywords
bubble memory
memory package
openings
assembly
shield body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8000382U
Other languages
Japanese (ja)
Inventor
知之 森
慎一 笠原
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP8000382U priority Critical patent/JPS58183699U/en
Publication of JPS58183699U publication Critical patent/JPS58183699U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のパッケージ組立構成を示す斜視図、第２
図は本考案の一実施例を示す組立構成を示す斜視図イ図
及び樹脂接合の筐体端部拡大の断、面図０図である。 図中、１はバブルメモリ素子組立体、２は外筐体、３は
両端開口のシールド体、４は端子、５は３の開口端部及
び７は前記端部５において２のコーナを斜めに切除した
凹溝である。Figure 1 is a perspective view showing the conventional package assembly configuration;
The figures are a perspective view showing an assembled configuration of an embodiment of the present invention, and an enlarged cross-sectional view and a plan view of the resin-bonded end of the casing. In the figure, 1 is a bubble memory element assembly, 2 is an outer casing, 3 is a shield body with openings at both ends, 4 is a terminal, 5 is an open end of 3, and 7 is a corner of 2 at an angle at the end 5. This is the groove that was removed.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] バブルメモリ素子組立体、該組立体を磁気遮蔽する両端
開口のシールド体に嵌入して樹脂接合するバブルメモリ
パッケージの組立構造において、前記両端開口のシール
ド体との接合端周辺に接合用樹脂の溜る凹溝部が形成さ
れたことを特徴とするバブルメモリパッケージ。In the assembly structure of a bubble memory element assembly and a bubble memory package in which the assembly is fitted into a shield body having openings at both ends for magnetic shielding and bonded with resin, bonding resin accumulates around the joint end with the shield body having openings at both ends. A bubble memory package characterized by having a concave groove formed therein.
JP8000382U 1982-05-31 1982-05-31 bubble memory package Pending JPS58183699U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8000382U JPS58183699U (en) 1982-05-31 1982-05-31 bubble memory package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8000382U JPS58183699U (en) 1982-05-31 1982-05-31 bubble memory package

Publications (1)

Publication Number Publication Date
JPS58183699U true JPS58183699U (en) 1983-12-07

Family

ID=30089162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8000382U Pending JPS58183699U (en) 1982-05-31 1982-05-31 bubble memory package

Country Status (1)

Country Link
JP (1) JPS58183699U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547096U (en) * 1979-10-02 1980-03-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5547096U (en) * 1979-10-02 1980-03-27

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