JPS5818319Y2 - Convection induction device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a convection induction device constituting an air cooling system of an electronic device.

Figure 1 shows a conventional convection guide plate.

In the figure, when an electronic circuit package 1 constituting an electronic device operates, power is consumed and heat is generated.

The air is warmed by this heat, cold air from the outside is supplied from the intake port 21 of the convection guide plate 2 at the bottom, and warm air becomes an upward airflow from the exhaust port 31 of the convection guide plate 3 at the top and is exhausted outside the electronic device. be done.

At this time, near the exhaust port 31, air from outside the device flows through the exhaust port 31.
Since the air flows backward into the air and gets mixed up in the rising air current, the amount of air flowing in from the suction port 21 decreases, which has the disadvantage that the device cannot be cooled sufficiently.

The present invention has been proposed to improve the above-mentioned drawbacks, and its purpose is to further reduce the rise in air temperature within electronic devices.

Hereinafter, the present invention will be described in detail with reference to the drawings.

Figure 2 A shows the convection induction device of the present invention. In the figure, convection induction plates 2 and 3 are installed diagonally in the package loading rack A to cross the interior of the package loading rack. An opening surface 5 for rising air is provided in the package mounting rack in contact with the upper edge of the plate, and a gutter-like entrainment prevention part 4 is formed in contact with the opening surface.

That is, both side surfaces 6 of the entrainment prevention section are on the same plane as the side surfaces of the package loading rack A, and the front section 7 has a curved surface, and the upper edge of the front section 7 and the upper edge of both side surfaces 6 An exhaust port 8 is formed.

Note that even if the front part is not curved, it has the same effect as the front part.

By providing the entrainment prevention part 4 as described above, the present invention eliminates backflow and entrainment on the exhaust side of the electronic device when exhausting from the exhaust port 31, and reduces the amount of inflow from the exhaust port 31 and the intake port 21. The inflow amount can be made equal.

Furthermore, by arranging the opening of the entrainment prevention portion upward, the rising airflow becomes a laminar flow, increasing the exhaust speed.

Figure 3 shows the experimental results.

The horizontal axis represents the power consumption of the electronic circuit package, and the vertical axis represents the temperature rise within the device, and the straight line A represents the relationship between the power consumption of the electronic circuit package and the temperature rise within the device in the conventional structure.

B shows a similar relationship in the present invention. Assuming that the temperature rise inside the device is constant, the power consumption will be approximately 1.4 times that of the conventional structure due to the effects of the present invention.

As explained above, according to the present invention, the temperature of the electronic device can be lowered by increasing the volume of cooling air, so there is an advantage that high-density packaging is possible even in natural air cooling.

[Brief explanation of the drawing]

Fig. 1 is a side view of the conventional structure, Fig. 2 shows an embodiment of the convection induction device of the present invention, A is a side view, the mouth is a perspective view, and Fig. 3 shows the differences between the inventive product and the conventional product. Indicates temperature rise. 1...Electronic circuit package, 2...Convection guide plate (lower part), 3...Convection guide plate (upper part)
, 4... Entanglement prevention part, 5... Opening surface, 6... Side surface, 7... Front part, 8...
...Exhaust port, 21...Intake port, 31...
...Exhaust port, A...Package mounting rack.

Claims (1)

[Scope of utility model registration request] A convection guide plate that diagonally crosses the inside of the package mounting rack is provided, and an opening surface is formed in the package mounting rack in contact with the upper edge of the convection guide plate, and the opening surface is provided on the same plane as the side surface of the package mounting rack. What is claimed is: 1. A convection inducing device characterized by having a side surface, a front surface portion curved upward, and an entrainment prevention portion provided with an exhaust port above.