JPS58180683U

JPS58180683U - Printed wiring board mounting structure

Info

Publication number: JPS58180683U
Application number: JP1982077419U
Authority: JP
Inventors: 小幡　吉昭
Original assignee: 株式会社東芝
Priority date: 1982-05-26
Filing date: 1982-05-26
Publication date: 1983-12-02
Also published as: JPH034068Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は印刷配線板が実装守れた従来のシャーシの外観
斜視図、第２図は上記シャーシに取り付けられているマ
ザーボードの信号パス布線状態の概略図、第３図は第２
図の一部分について信号パス布線状態を詳細に示す図、
第４図は第１図の斜視図のＸ−Ｙ断面図であり、マザー
ボードに対する印刷配線板の実装状態を示す図、第５図
はシャーシが実装された筐体の外観斜視図、第６図は従
来の印刷配線板の外観斜視図、第７図は本考案に係るマ
ザーボードの一実施例を示す正面図、第８図はその側面
図、第９図は第８図の側面図で示されている高密度コネ
クタの縦断面の拡大図、第１０図は本考案に係る印刷配
線板の一実施例を示す外観斜視図、第１１図は上記一実
施例の印刷配線板に実装される高密度コネクタの正゛面
図、第１２図はそのＸ’−Ｙ’断面図、第１３図はマザ
ーボードと印刷配線板とのコネクタ間接続を説明するた
めの図、第１４図は印刷配線板が実装されたシャーシの
一実施例を示す外観斜視図である。Ｐ１〜Ｐ３＋　Ｐ１１〜Ｐ１３・・・信号パス、１，４
１・・・シャーシ、２１，２□、３□〜３５．　４．　
４□〜４３，３０゜〜３０１□・・・印刷配線板（ＰＷ
Ｂ）、５．２０・・・マザーボード、８・・・拡張シャ
ーシ、２１．２１・・・第１高密度コネクタ、３１．３
１・・・第２高密度コネクタ。Figure 1 is an external perspective view of a conventional chassis in which a printed wiring board can be mounted securely, Figure 2 is a schematic diagram of the signal path wiring state of the motherboard attached to the chassis, and Figure 3 is a
A diagram showing the signal path wiring state in detail for a part of the diagram,
FIG. 4 is an X-Y cross-sectional view of the perspective view of FIG. 1, showing the mounted state of the printed wiring board on the motherboard. FIG. 5 is an external perspective view of the casing with the chassis mounted. FIG. 7 is a front view showing an embodiment of a motherboard according to the present invention, FIG. 8 is a side view thereof, and FIG. 9 is a side view of FIG. 8. FIG. 10 is an external perspective view showing an embodiment of the printed wiring board according to the present invention, and FIG. A front view of the density connector, FIG. 12 is an X'-Y' sectional view, FIG. 13 is a diagram for explaining the connection between the motherboard and the printed wiring board, and FIG. FIG. 2 is an external perspective view showing an example of a mounted chassis. P1-P3+ P11-P13...Signal path, 1, 4
1... Chassis, 21, 2□, 3□-35. 4.
4□~43,30°~301□...Printed wiring board (PW
B), 5.20... Motherboard, 8... Expansion chassis, 21.21... First high-density connector, 31.3
1...Second high-density connector.

Claims

[Scope of utility model registration request]

(1) Signal lines including multiple types of signal paths are commonly wired in all slots, and M is connected to these signal lines.
A motherboard in which a first high-density connector having M terminals is attached corresponding to each slot, and a motherboard that is electrically connected to some or all of the M terminals by mating with the first high-density connector. A printed wiring board mounting structure comprising: a printed wiring board to which a second high-density connector is attached; and a chassis to which the motherboard is attached and a plurality of the printed wiring boards are mounted.

(2) The first and second high-density connectors have 4 plug groups.
The printed wiring board mounting structure according to claim 1, wherein the printed wiring board mounting structure is arranged in a matrix of M74 rows and M74 columns.