JPS58180095A - Electronic device housing and method of forming same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a housing made of hard polyurethane resin incorporating electronic device parts and a method for molding the same.

The housings of electronic devices have traditionally been made of thin metal sheets, but in recent years plastic molded products have come into widespread use, especially to improve design performance, and hard polyurethane is being used as the material. Liquid molded products are also used.

The function of this type of casing is to house and hold the main body of an electronic device that has a specific function configured by combining and combining electrical and electronic components, and to protect it from entering unnecessary objects from the outside.
Its main purpose is to do things.

For this reason, in order to simplify the installation of built-in devices in conventional plastic casings, the general structure is to insert screws or take out screws, and attach the devices to these screws so that they are exposed inside the casing. It has been carried out in

However, if the parts for electronic devices are exposed to the outside in this way, electronic devices constructed by combining various electrical and electronic components may be difficult to operate by the user during manufacturing, transporting the product, and so on. When carrying out maintenance work or repairing equipment, physical or electrical forces may damage or break parts, leading to accidents that may lead to malfunctions.

Therefore, it is an important issue to prevent breakage and damage to these parts, to improve safety by preventing electric shocks caused by damage and dust, and to improve product durability.

The present invention was made with the aim of solving these problems.Main electrical and electronic components such as printed circuit boards, cables, sockets, and their composite parts are inserted into the interior of the housing. It has been found that by embedding the device, the above-mentioned drawbacks can be solved all at once, and the reliability of the device can be improved.

That is, the electronic device casing according to the present invention is a hard polyurethane resin casing consisting of a side plate (2) and a bottom plate (3), as shown in FIG. Sockets (4), (6), etc. to which electronic device parts are connected are exposed on the surface of the cough casing.
The printed wiring board (5) and cables (1) connected to
) and/or embedded in the inner layer of the bottom plate (3).

In order to obtain the casing (η) of the present invention, as shown in FIG. When producing a housing by injecting and reacting and solidifying, a socket (4) to which an electronic device component such as an integrated circuit is connected is inserted into a recess (B) provided on the cavity (to) side of the mold. The printed circuit board (5) and cable connected to the cough socket (4)
Alternatively, these composite parts are molded by injecting a liquid material of hard polyurethane resin into the cavity (a) and causing it to react and solidify. The hard resin resin used here can be applied by both foam molding and non-foam molding.

According to the present invention, when molding the casing, there are some that have very small gaps or spaces in the socket parts, cable parts, and their connecting parts, and the polyurethane concentrate enters into these spaces. This will impair the function of the part. For this reason, the thermoplastic 41 which has been melted or molten removes the gaps and spaces that may cause the component function to be impaired due to the intrusion of the polyurethane stock solution.
It was discovered that by sealing with 1tli or reaction m thermosetting resin, it is possible to reliably prevent liquid from entering the parts, without impairing the functions of the parts. All thermoplastic resins such as polystyrene, polyethylene, polyamide, and polyvinyl chloride can be used as thermoplastic resins, but in particular, polystyrene/medium polyvinyl chloride, which has a low melting point and is easily dissolved in solvents, is used. It is also suitable as it has good workability. First, as the thermosetting resin, reactive ffi putty based on epoxy in non-stable polyester can be used.

The hard polyurethane resin according to the present invention can be molded in a liquid state, and the molding pressure is 1/100th that of the injection molding method for thermoplastic resins, which is an ultra-low-pressure molding method. Even with the complex shapes of electronic device parts, the fluidity of the stock solution is not inhibited and the fluidity of the stock solution is easily handled, and the components can be inserted into the inner layer of the housing without damaging them. , can be installed.

According to the present invention, as described above, only the sockets to which electronic device parts such as integrated circuits are connected are exposed on the surface of the housing, and the printed circuit boards and cables that constitute the circuits connected to the sockets are exposed. Alternatively, it is easy to obtain a housing in which these composite parts are buried under the weight of the housing, making it easier to repair the equipment during manufacturing, transporting the product, and when the user operates it. In addition, there is no need for rounded auxiliary parts to hold integrated parts, which can save wiring space, thereby reducing the size of the product and # type. It can be made lighter and lighter, and it can also contribute to lower manufacturing costs by reducing the number of man-hours required to assemble the equipment.

The present invention will be explained in more detail below with reference to Examples. Example 1 1) A composite part was manufactured by connecting 160 square sockets (→) to both ends of a 7 flexible printed wiring board (5). When placed in a mold, Place a rod-shaped polystyrene rod with a diameter of 1 cm made by extrusion molding into the gap in the part of the connector that is in contact with the polyurethane stock solution, and use a soldering iron heated with 5ovo voltage to melt this polystyrene monument while filling this gap. did.

2) Connect the composite part of the socket and flexible printed wiring board adjusted in 1) to the predetermined position O recess (2) of the upper mold (core mold) (8) of the aluminum mold for forming the casing. Part (Sokef) ) (4)
The mold was closed by pushing it into place. Next, a hard polyurethane stock solution prepared into two component systems, one containing polyol, a catalyst, a blowing agent, etc., and the other containing polyisocyanate, is poured into the cavity (E) of the mold using a general-purpose foaming machine. It was injected and filled into the space inside the mold via the runner gate and film gate.

After waiting for the polyurethane stock solution to react and solidify, open the mold and pour out the molded product. The flexible printed wiring board is completely embedded in the inner layer of hard polyurethane resin and is not visible from the outside, and the 160 socket is placed in a predetermined position with its upper part protruding and
A hard polyurethane casing was obtained in which the six integrated circuit insertion holes were not filled with urethane and the main electronic device components were inserted and embedded to maintain sufficient socket functionality.

Example ■ 1) For nine composite parts, 50 sockets (6) were connected to both ends of a ribbon-shaped flat cable (7) covered with polyvinyl chloride, and the gap between the joints was heated with a soldering iron of 907. was applied to melt the polyvinyl chloride coating and seal it. In addition, the cut end of the ribbon-like flat cable (7) was dipped in a polyvinyl chloride solution prepared by dissolving 50 weight of polyvinyl chloride in a 1:1 mixed solvent of methyl ethyl ketone and tetrahydrochloride, and then dried. The gap was sealed by forming a thin film of vinyl chloride.

2) Connect the flat cable (η) and socket (
The composite part 6) was molded in the same manner as in Example 2-2).

The flat cable (7) is completely buried in the hard polyurethane*MCT inner layer and cannot be seen from the outside, and the 50 socket (6) is placed in a predetermined position with its upper part protruding. The integrated enclosure insertion hole of 501i was not filled with urethane, but an electronic device component retaining a sufficient socket function was inserted and filled to obtain a hard polyurethane housing.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway perspective view of a side plate of an electronic device casing according to the present invention in good condition, and FIG. 2 is an explanatory view showing a molding method. 1... Housing for electronic equipment 2... Side plate 3...
・Bottom plate number... Connector (socket) 5...
Printed wiring board 6... Socket cable... Flat cable 8... Upper die of mold 9... Lower plate of mold 10... Cavity patent applicant

Claims (1)

[Claims] (→ A casing made of hard polyurethane resin consisting of a side plate and a bottom plate, with sockets to which electronic device parts such as integrated circuits are connected are exposed on the surface of the casing, An electronic device casing characterized in that a printed wiring board, cables, or composite parts thereof connected to a cough socket are embedded in the side plate and/or the bottom plate. (2) Molding When producing a housing by injecting a liquid material of hard polyurethane resin into the cavity of a sealed nine-molding mold having a cavity and causing it to react and solidify, an integrated circuit is injected into the recess provided on the cavity side of the mold. A socket to which an electronic device component such as the like is connected is fitted, and a printed circuit board, cables, or a combination thereof connected to the socket is placed in the cavity,
A method of molding a housing for an electronic device, in which a liquid material of hard polyurethane resin is then injected into the cavity and allowed to react and solidify. (3) When placing sockets, printed circuit boards, cables, or composite parts thereof in the cavity, the gaps and spaces between these parts should be filled with melted thermoplastic synthetic resin or reactive thermosetting resin. 3. The method for molding a casing for an electronic device according to claim 2, wherein the casing is sealed in advance using a synthetic resin putty.