JPS58175634U - ボンデイングウエツジ - Google Patents

ボンデイングウエツジ

Info

Publication number
JPS58175634U
JPS58175634U JP7206982U JP7206982U JPS58175634U JP S58175634 U JPS58175634 U JP S58175634U JP 7206982 U JP7206982 U JP 7206982U JP 7206982 U JP7206982 U JP 7206982U JP S58175634 U JPS58175634 U JP S58175634U
Authority
JP
Japan
Prior art keywords
pressure surface
bonding wedge
guide hole
angle
wedge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7206982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6345001Y2 (enExample
Inventor
正孝 水越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP7206982U priority Critical patent/JPS58175634U/ja
Publication of JPS58175634U publication Critical patent/JPS58175634U/ja
Application granted granted Critical
Publication of JPS6345001Y2 publication Critical patent/JPS6345001Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)
JP7206982U 1982-05-19 1982-05-19 ボンデイングウエツジ Granted JPS58175634U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7206982U JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7206982U JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Publications (2)

Publication Number Publication Date
JPS58175634U true JPS58175634U (ja) 1983-11-24
JPS6345001Y2 JPS6345001Y2 (enExample) 1988-11-22

Family

ID=30081652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7206982U Granted JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Country Status (1)

Country Link
JP (1) JPS58175634U (enExample)

Also Published As

Publication number Publication date
JPS6345001Y2 (enExample) 1988-11-22

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