JPS58175632U - Resist coating equipment - Google Patents

Resist coating equipment

Info

Publication number
JPS58175632U
JPS58175632U JP7335382U JP7335382U JPS58175632U JP S58175632 U JPS58175632 U JP S58175632U JP 7335382 U JP7335382 U JP 7335382U JP 7335382 U JP7335382 U JP 7335382U JP S58175632 U JPS58175632 U JP S58175632U
Authority
JP
Japan
Prior art keywords
resist coating
rotary table
suction plate
coating equipment
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7335382U
Other languages
Japanese (ja)
Inventor
久雄 森
辻野 嘉一
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP7335382U priority Critical patent/JPS58175632U/en
Publication of JPS58175632U publication Critical patent/JPS58175632U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のレジスト塗布装置の平面図、第2図以下
の図面はこの考案のレジスト塗布装置の    ゛1実
施例を示し、第2図は平面図、第3図は正面図、第4図
および第5図は要部の側面図および斜視図である。 7・・・・・・回転台、10・・・・・・半導体ウェハ
、15・・・・・・吸着板、17・・・・・・調節機構
Figure 1 is a plan view of a conventional resist coating device, Figure 2 and the following drawings show the first embodiment of the resist coating device of this invention, Figure 2 is a plan view, Figure 3 is a front view, and This figure and FIG. 5 are a side view and a perspective view of the main parts. 7... Turntable, 10... Semiconductor wafer, 15... Adsorption plate, 17... Adjustment mechanism.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウェハが載置される回転台と、前記回転台の外周
に設けられレジスト塗布時に前記半導体ウェハより飛散
するレジストを吸着する吸着板と、前記吸着板を着脱自
在に支持するとともに該吸着板の前記回転台に対する角
度および間隔を調節自在とする調節機構とを備えたレジ
スト塗布装置。
a rotary table on which a semiconductor wafer is placed; a suction plate provided on the outer periphery of the rotary table to adsorb resist scattered from the semiconductor wafer during resist coating; and a suction plate that removably supports the suction plate and A resist coating device comprising: an adjustment mechanism that freely adjusts the angle and distance with respect to the rotary table.
JP7335382U 1982-05-18 1982-05-18 Resist coating equipment Pending JPS58175632U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7335382U JPS58175632U (en) 1982-05-18 1982-05-18 Resist coating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7335382U JPS58175632U (en) 1982-05-18 1982-05-18 Resist coating equipment

Publications (1)

Publication Number Publication Date
JPS58175632U true JPS58175632U (en) 1983-11-24

Family

ID=30082863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7335382U Pending JPS58175632U (en) 1982-05-18 1982-05-18 Resist coating equipment

Country Status (1)

Country Link
JP (1) JPS58175632U (en)

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