JPS58173821A - Method of producing laminated ceramic condenser - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a stacked ceramic capacitor.

Conventionally, in order to obtain large capacitance even in ceramic capacitors, multiple capacitor units with electrode films formed on ceramic dielectric substrates are stacked, and solder is interposed between the electrode films of adjacent capacitor units. hand,
It has generally been proposed that a plurality of the above-mentioned capacitor units are fixed to each other.

By the way, in the stacked ceramic capacitors described above, the electrode films of adjacent capacitor units are fixed by solder, etc., so when the capacitor units are fixed, the solder shrinks and stress is applied to the capacitor units. Cracks occur in the dielectric substrate of the capacitor unit.

Furthermore, it is difficult to join capacitor units together without leaving any space between them, and if moisture enters the space left between capacitor units, the dielectric properties and withstand voltage properties of stacked capacitors will deteriorate, making it difficult to connect capacitors that can withstand practical use. was difficult to manufacture.

The present invention has been made in view of the above-mentioned circumstances regarding conventional stacked ceramic capacitors, and an object of the present invention is to arrange a plurality of capacitor units in a row, each having an electrode film extended to the side surface of a dielectric substrate. After covering the upper and lower surfaces with an insulating material, the insulating material is cut and stacked between adjacent capacitor units, thereby reducing the thermal stress applied to the dielectric substrate when the capacitor units are fixed, and An object of the present invention is to provide a method for manufacturing an insulated ceramic capacitor that prevents spaces from being formed between capacitor units.

Therefore, in the present invention, electrode films are formed on each side of both main surfaces of a rectangular plate-like dielectric substrate by leaving a certain width on each side, and these electrode films are formed on each side of both main surfaces of the rectangular dielectric substrate. A plurality of capacitor units each extending from the other side to the side surface of the dielectric substrate are prepared, these capacitor units are arranged in a line, and at least the top and bottom surfaces of these capacitor units are coated with a tape-shaped insulating material. After that, the insulator is cut alternately above the boundary between any adjacent capacitor units and below the boundary between capacitor units adjacent to the boundary, and the capacitor unit is folded at the cut portion of the insulator. It is characterized by being laminated.

Hereinafter, the present invention will be specifically described with reference to the accompanying drawings.

FIG. 1 shows a capacitor unit 11 used in the present invention.

The capacitor unit 11 has two opposite main surfaces 13 and 13 of a plate-like dielectric substrate 12 having a rectangular shape.
The side portions 14 and 14 are covered with electrode films 15, leaving a certain width.
．． At the same time, these electrode films 15.15 are extended from the other side portions 16.16 of the two main surfaces 13.13 to the side surfaces 17.17 of the dielectric substrate 12 to form an extraction electrode film 1.
8.18 was formed.

In the present invention, a plurality of the capacitor units 1 are prepared, and as shown in FIG. ,...
are arranged in a row, and a single-sided adhesive tape 21 made of a heat-resistant and insulating material is spirally wound thereon to form a single rod. In this case, although not shown, the adhesive tape 21 is not wound in a spiral shape, but the capacitor units 11, 11, . . . are connected together.
Adhesive tape may be attached to the upper and lower surfaces. Further, the direction in which the capacitor units 11.11, . . . A' line and B-B
The single-sided adhesive tape 21 is cut alternately in a staggered manner along the lines 1 and 2, so that each capacitor unit 11.
11, . . . are connected in a series by the uncut single-sided adhesive tape 21.

Necessary tests such as capacitance and voltage resistance are performed on each capacitor unit 11, 11 in a series using the single-sided adhesive tape 21, and defective products are discarded by cutting the single-sided adhesive tape 21.

When using each of the above capacitor units 11.11, . . . as a single-plate chip capacitor, the single-sided adhesive tape 2 that connects each capacitor unit 11.11, .
1, a single-plate chip capacitor is obtained in which the outside of the capacitor unit 11 except for the lead electrode film 18 is covered with an insulating single-sided adhesive tape 21, as shown in FIG.

In addition, each capacitor unit 11, 11, . . . is packaged in the state shown in FIG. 3 and shipped as a product without being separated, and each of the capacitor units 11, 11, . . . is attached to a printed circuit board (not shown). ) etc., each capacitor unit 11, 11, . . . may be separated.

Next, when manufacturing a stacked capacitor, the number of capacitor units 11 is determined according to the capacitance to be obtained.
．． The capacitor units 11, 11, . Fold and stack.

After that, as shown in FIG. 6, each capacitor unit 1
1.11,..., except for the extraction electrode film 18.18, if the whole is further covered with heat-resistant and insulating single-sided adhesive tape 22, the capacitor unit 11.11,...
・A stacked capacitor can be obtained by stacking .

For both the single-plate capacitor shown in Figure 4 and the stacked capacitor shown in Figure 6, preliminary soldering is performed on the extraction electrodes 18 and 18 as necessary. Although not shown in detail, after soldering lead terminals to the extraction electrodes 18 and 18, the entire structure may be dipped in an insulating resin or the like to provide an exterior covering.

If the above is done, a plurality of capacitor units 11.
11. . Capacitor unit 11 .
, . . are fixed to each other, the overall temperature of the dielectric substrate 12 does not become high, and the occurrence of cracks, cracks, etc. in the dielectric substrate 12 is reduced.

Furthermore, since each of the capacitor units 11, 11, .

If a plurality of capacitor units 11 and 11 are arranged in a row and the single-sided adhesive tape 21 is wound in a spiral shape as shown in FIG. If the above adhesive tape attachment method is used in combination, the adhesive tape 21 can be easily wound in a spiral shape as shown in FIG. In this case, use the single-sided adhesive tape 23.2 on the top and bottom sides.
3 serves to temporarily fix the capacitor units 11, 11, .

As is clear from the detailed description above, the present invention
By arranging multiple capacitor units in a line and covering them with heat-resistant and insulating single-sided adhesive tape, the single-sided adhesive tape is cut in a staggered manner at predetermined areas to produce stacked capacitors. Stacked ceramic capacitors can be manufactured continuously by simply cutting the coated single-sided adhesive tape, folding and stacking the capacitor units, and the manufacturing efficiency of stacked ceramic capacitors is greatly improved.

In addition, the capacitor units are fixed to each other using lead-out electrode films extended to the sides of the dielectric substrate.The overall temperature of the dielectric substrate does not increase when the capacitor units are fixed by fold soldering, and the dielectric Cracks and cracks are more likely to occur on the board.

Furthermore, since an insulating material such as a single-sided adhesive tape is interposed between the capacitor units, the problem of moisture entering between the capacitor units is also solved.

Furthermore, in the present invention, since the capacitor unit is covered with an insulating material during the manufacturing process, there is no large shock applied to the capacitor unit during the manufacturing of stacked capacitors, and the yield rate during manufacturing is greatly improved. do.

[Brief explanation of the drawing]

1, 2, 3, 4, 5, and 6 are explanatory diagrams of the manufacturing process of the stacked capacitor manufacturing method according to the present invention, respectively, and FIG. 7 is the same as in FIG. FIG. 6 is an explanatory diagram when the capacitor unit is temporarily fixed during the manufacturing process. 11... Capacitor unit, 12... Dielectric substrate,
13・Main surface, 14...-side portion, 15・Electrode film, 16
...Other side part, 17...Side surface, 18 - Extraction electrode film, 2
1.22.23・Single-sided adhesive tape. Patent applicant Murata Manufacturing Co., Ltd. Patent attorney Aoyama Ao and two others Prisoner 1 Figure 3 Figure 5 Figure 6

Claims (1)

[Claims] (1) Electrode films are formed on each side of both principal surfaces of a rectangular plate-shaped dielectric substrate by leaving a certain width y, and these electrode films are formed from the other sides of both principal surfaces. A plurality of connectors 7 each extend from the side surface of the dielectric substrate.
Prepare a capacitor unit, arrange these capacitor units in a line, cover at least the top and bottom surfaces of these capacitor units with a tape-shaped insulating material, and then apply tape-shaped insulating material to the upper part of the boundary between any adjacent capacitor units and the boundary part. A method for manufacturing a stacked ceramic capacitor, characterized in that the insulators are alternately cut below the boundary portions of adjacent capacitor units, and the capacitor units are folded and stacked at the cut portions of the insulators.