JPS58172975U - light emitting diode display device - Google Patents

light emitting diode display device

Info

Publication number
JPS58172975U
JPS58172975U JP7094882U JP7094882U JPS58172975U JP S58172975 U JPS58172975 U JP S58172975U JP 7094882 U JP7094882 U JP 7094882U JP 7094882 U JP7094882 U JP 7094882U JP S58172975 U JPS58172975 U JP S58172975U
Authority
JP
Japan
Prior art keywords
substrate
light emitting
display device
emitting diode
diode display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7094882U
Other languages
Japanese (ja)
Inventor
山根　博
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP7094882U priority Critical patent/JPS58172975U/en
Publication of JPS58172975U publication Critical patent/JPS58172975U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は発光ダイオード表示装置組立体の斜視図、第２
図は本考案実施例の発光ダイオード表示装置の側面図ａ
と背面図すである。 １・・・基板、２，２・・・発光ダイオード、３，３・
・・リードピン、４・・・植入ボルト。Figure 1 is a perspective view of a light emitting diode display assembly;
The figure is a side view a of a light emitting diode display device according to an embodiment of the present invention.
This is the rear view. 1...Substrate, 2,2...Light emitting diode, 3,3.
... Lead pin, 4... Implant bolt.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）基板と、その基板の表面に載置された多数の発光
ダイオードと、その基板の裏面の周縁部に設けられたリ
ードピンと、その基板の裏面の中央部に突出して設けら
れた植入ボルトとを具備した発光ダイオード表示装置。(1) A substrate, a large number of light emitting diodes placed on the surface of the substrate, lead pins provided on the periphery of the back surface of the substrate, and an implant provided protruding from the center of the back surface of the substrate. A light emitting diode display device equipped with a bolt. （２）前記発光ダイオードはドツトマトリクスと゛して
配置配線されており、前記基板の周縁部において発光ダ
イオードと基板端部の距離は２分の１ドツトピツチ以下
となっている事を特徴とする前記実用新案登録請求の範
囲第１項記載の発光ダイオード表示装置。(2) The light-emitting diodes are arranged and wired in a dot matrix, and the distance between the light-emitting diodes and the edge of the substrate is 1/2 dot pitch or less at the periphery of the substrate. A light emitting diode display device according to claim 1 of patent registration.
JP7094882U 1982-05-14 1982-05-14 light emitting diode display device Pending JPS58172975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7094882U JPS58172975U (en) 1982-05-14 1982-05-14 light emitting diode display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7094882U JPS58172975U (en) 1982-05-14 1982-05-14 light emitting diode display device

Publications (1)

Publication Number Publication Date
JPS58172975U true JPS58172975U (en) 1983-11-18

Family

ID=30080586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7094882U Pending JPS58172975U (en) 1982-05-14 1982-05-14 light emitting diode display device

Country Status (1)

Country Link
JP (1) JPS58172975U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019068A (en) * 2013-07-11 2015-01-29 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Light emitting member and lighting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015019068A (en) * 2013-07-11 2015-01-29 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． Light emitting member and lighting device

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