JPS5960681U - light emitting diode display - Google Patents

light emitting diode display

Info

Publication number
JPS5960681U
JPS5960681U JP15589582U JP15589582U JPS5960681U JP S5960681 U JPS5960681 U JP S5960681U JP 15589582 U JP15589582 U JP 15589582U JP 15589582 U JP15589582 U JP 15589582U JP S5960681 U JPS5960681 U JP S5960681U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode display
light
shielding film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15589582U
Other languages
Japanese (ja)
Other versions
JPS6328452Y2 (en
Inventor
山内　千束
梅崎　昌昭
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP15589582U priority Critical patent/JPS5960681U/en
Publication of JPS5960681U publication Critical patent/JPS5960681U/en
Application granted granted Critical
Publication of JPS6328452Y2 publication Critical patent/JPS6328452Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の表示器の斜視図、第２図は本考案実施例
の発光ダイオード表示器の断面図である。 １・・・・・・基板、２，２，２・・・・・・発光ダイ
オード、３・・・・・−・反射枠、４・・・・・・光拡
散シート、６，６・・・・・・遮光膜、７，７・・・・
・・白色塗料。FIG. 1 is a perspective view of a conventional display, and FIG. 2 is a sectional view of a light emitting diode display according to an embodiment of the present invention. 1...Substrate, 2,2,2...Light emitting diode, 3...Reflection frame, 4...Light diffusion sheet, 6,6... ... light shielding film, 7,7...
・White paint.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光ダイオード−と、発光ダイオードを囲む反射枠と、
反射枠の表面に敷設された光拡散シートと、光拡散シー
トの表面に所望形状に印刷された遮光膜と、その遮光膜
の周囲に印刷された白色塗料とを具備した事を特徴とす
る発光ダイオード表示器。A light emitting diode, a reflective frame surrounding the light emitting diode,
A light emitting device characterized by comprising a light diffusion sheet laid on the surface of a reflective frame, a light shielding film printed in a desired shape on the surface of the light diffusion sheet, and a white paint printed around the light shielding film. Diode indicator.
JP15589582U 1982-10-14 1982-10-14 light emitting diode display Granted JPS5960681U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15589582U JPS5960681U (en) 1982-10-14 1982-10-14 light emitting diode display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15589582U JPS5960681U (en) 1982-10-14 1982-10-14 light emitting diode display

Publications (2)

Publication Number Publication Date
JPS5960681U true JPS5960681U (en) 1984-04-20
JPS6328452Y2 JPS6328452Y2 (en) 1988-08-01

Family

ID=30344162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15589582U Granted JPS5960681U (en) 1982-10-14 1982-10-14 light emitting diode display

Country Status (1)

Country Link
JP (1) JPS5960681U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171294A (en) * 2009-01-26 2010-08-05 Rohm Co Ltd Light-emitting device
JP2010287777A (en) * 2009-06-12 2010-12-24 Koito Mfg Co Ltd Light emitting module and head lamp for vehicle

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2005013246A1 (en) * 2003-08-04 2006-09-28 株式会社光波 Display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171294A (en) * 2009-01-26 2010-08-05 Rohm Co Ltd Light-emitting device
JP2010287777A (en) * 2009-06-12 2010-12-24 Koito Mfg Co Ltd Light emitting module and head lamp for vehicle

Also Published As

Publication number Publication date
JPS6328452Y2 (en) 1988-08-01

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