JPS58168308U - Ultrasonic inspection device probe - Google Patents

Ultrasonic inspection device probe

Info

Publication number
JPS58168308U
JPS58168308U JP6547782U JP6547782U JPS58168308U JP S58168308 U JPS58168308 U JP S58168308U JP 6547782 U JP6547782 U JP 6547782U JP 6547782 U JP6547782 U JP 6547782U JP S58168308 U JPS58168308 U JP S58168308U
Authority
JP
Japan
Prior art keywords
inspection device
ultrasonic inspection
device probe
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6547782U
Other languages
Japanese (ja)
Other versions
JPH0112813Y2 (en
Inventor
美喜雄 泉
Original Assignee
株式会社日立メデイコ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立メデイコ filed Critical 株式会社日立メデイコ
Priority to JP6547782U priority Critical patent/JPS58168308U/en
Publication of JPS58168308U publication Critical patent/JPS58168308U/en
Application granted granted Critical
Publication of JPH0112813Y2 publication Critical patent/JPH0112813Y2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の探触子の一実施例を示していて、第1図
は一部を破断された平面図、第2図は第1図■−■線に
そう断面図である。 □ 11・・・振動子アレイ、12・・・吸音材、14
・・・印刷配線板、21・・・導電性接着剤層。
The drawings show one embodiment of the probe of the present invention, in which FIG. 1 is a partially cutaway plan view, and FIG. 2 is a cross-sectional view taken along line 1--2 in FIG. 1. □ 11... Vibrator array, 12... Sound absorbing material, 14
. . . Printed wiring board, 21 . . . Conductive adhesive layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 吸音材と、振動子アレイと、振動子アレイを構成する各
振動子にたいする導体を形成されている印刷配線板とを
含み、印刷配線板が吸音体上に配置され、振動子アレイ
が導電性接着材によって吸音材および印刷配線板に固定
されてなること、を特徴としている超音波検査装置の探
触子。
It includes a sound absorbing material, a vibrator array, and a printed wiring board formed with a conductor for each vibrator constituting the vibrator array, the printed wiring board is placed on the sound absorbing material, and the vibrator array is attached with conductive adhesive. A probe for an ultrasonic inspection device, characterized in that it is fixed to a sound absorbing material and a printed wiring board by a material.
JP6547782U 1982-05-07 1982-05-07 Ultrasonic inspection device probe Granted JPS58168308U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6547782U JPS58168308U (en) 1982-05-07 1982-05-07 Ultrasonic inspection device probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6547782U JPS58168308U (en) 1982-05-07 1982-05-07 Ultrasonic inspection device probe

Publications (2)

Publication Number Publication Date
JPS58168308U true JPS58168308U (en) 1983-11-10
JPH0112813Y2 JPH0112813Y2 (en) 1989-04-14

Family

ID=30075429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6547782U Granted JPS58168308U (en) 1982-05-07 1982-05-07 Ultrasonic inspection device probe

Country Status (1)

Country Link
JP (1) JPS58168308U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108189A (en) * 1979-02-14 1980-08-19 Matsushita Electric Ind Co Ltd Method of manufacturing supersonic probe

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55108189A (en) * 1979-02-14 1980-08-19 Matsushita Electric Ind Co Ltd Method of manufacturing supersonic probe

Also Published As

Publication number Publication date
JPH0112813Y2 (en) 1989-04-14

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