JPS58166044U - 電子部品 - Google Patents
電子部品Info
- Publication number
- JPS58166044U JPS58166044U JP6478682U JP6478682U JPS58166044U JP S58166044 U JPS58166044 U JP S58166044U JP 6478682 U JP6478682 U JP 6478682U JP 6478682 U JP6478682 U JP 6478682U JP S58166044 U JPS58166044 U JP S58166044U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- electronic component
- electrodes
- electrode plate
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来のリードレス電子部品の一例を示す側断面
図、第2図は従来のチップ型電子部品の一例を示す側断
面図、第3図は本考案の一実施例を示す側断面図、第4
図は第3図電子部品の製造に用いるリードフレームの斜
視図、第5図及び第6図は第3図電子部品の製造を説明
する要部斜視図、第7図は本考案の他の実施例を示す側
断面図、第8図は第7図電子部品の製造を説明する側断
面図である。 9.9′・・・・・・電子部品本体、lea、10’
a。 10b・・・・・・電極、11・・・・・・電極板、1
2・・・・・・樹脂モールド部。
図、第2図は従来のチップ型電子部品の一例を示す側断
面図、第3図は本考案の一実施例を示す側断面図、第4
図は第3図電子部品の製造に用いるリードフレームの斜
視図、第5図及び第6図は第3図電子部品の製造を説明
する要部斜視図、第7図は本考案の他の実施例を示す側
断面図、第8図は第7図電子部品の製造を説明する側断
面図である。 9.9′・・・・・・電子部品本体、lea、10’
a。 10b・・・・・・電極、11・・・・・・電極板、1
2・・・・・・樹脂モールド部。
Claims (1)
- 表裏面に電極を有する電子部品本体の一方の電極に電極
板を電気的に接続し、電極板の一部及び電子部品本体の
他の電極を外面に露呈させて樹脂材にて被覆したことを
特徴とする一電子部品。 −
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6478682U JPS58166044U (ja) | 1982-04-28 | 1982-04-28 | 電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6478682U JPS58166044U (ja) | 1982-04-28 | 1982-04-28 | 電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58166044U true JPS58166044U (ja) | 1983-11-05 |
Family
ID=30074799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6478682U Pending JPS58166044U (ja) | 1982-04-28 | 1982-04-28 | 電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58166044U (ja) |
-
1982
- 1982-04-28 JP JP6478682U patent/JPS58166044U/ja active Pending
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