JPS58166044U - 電子部品 - Google Patents

電子部品

Info

Publication number
JPS58166044U
JPS58166044U JP6478682U JP6478682U JPS58166044U JP S58166044 U JPS58166044 U JP S58166044U JP 6478682 U JP6478682 U JP 6478682U JP 6478682 U JP6478682 U JP 6478682U JP S58166044 U JPS58166044 U JP S58166044U
Authority
JP
Japan
Prior art keywords
electronic components
electronic component
electrodes
electrode plate
component body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6478682U
Other languages
English (en)
Inventor
仙波　謙三
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP6478682U priority Critical patent/JPS58166044U/ja
Publication of JPS58166044U publication Critical patent/JPS58166044U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードレス電子部品の一例を示す側断面
図、第２図は従来のチップ型電子部品の一例を示す側断
面図、第３図は本考案の一実施例を示す側断面図、第４
図は第３図電子部品の製造に用いるリードフレームの斜
視図、第５図及び第６図は第３図電子部品の製造を説明
する要部斜視図、第７図は本考案の他の実施例を示す側
断面図、第８図は第７図電子部品の製造を説明する側断
面図である。 ９．９′・・・・・・電子部品本体、ｌｅａ、１０’　
ａ。 １０ｂ・・・・・・電極、１１・・・・・・電極板、１
２・・・・・・樹脂モールド部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 表裏面に電極を有する電子部品本体の一方の電極に電極
    板を電気的に接続し、電極板の一部及び電子部品本体の
    他の電極を外面に露呈させて樹脂材にて被覆したことを
    特徴とする一電子部品。　　　−
JP6478682U 1982-04-28 1982-04-28 電子部品 Pending JPS58166044U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6478682U JPS58166044U (ja) 1982-04-28 1982-04-28 電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6478682U JPS58166044U (ja) 1982-04-28 1982-04-28 電子部品

Publications (1)

Publication Number Publication Date
JPS58166044U true JPS58166044U (ja) 1983-11-05

Family

ID=30074799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6478682U Pending JPS58166044U (ja) 1982-04-28 1982-04-28 電子部品

Country Status (1)

Country Link
JP (1) JPS58166044U (ja)

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