JPS58161334A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS58161334A
JPS58161334A JP57042598A JP4259882A JPS58161334A JP S58161334 A JPS58161334 A JP S58161334A JP 57042598 A JP57042598 A JP 57042598A JP 4259882 A JP4259882 A JP 4259882A JP S58161334 A JPS58161334 A JP S58161334A
Authority
JP
Japan
Prior art keywords
bonding
vibration
wire
wire bonding
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57042598A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0153508B2 (enrdf_load_stackoverflow
Inventor
Shunichiro Fujioka
俊一郎 藤岡
Osamu Morita
森田　脩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP57042598A priority Critical patent/JPS58161334A/ja
Publication of JPS58161334A publication Critical patent/JPS58161334A/ja
Publication of JPH0153508B2 publication Critical patent/JPH0153508B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57042598A 1982-03-19 1982-03-19 ワイヤボンデイング装置 Granted JPS58161334A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57042598A JPS58161334A (ja) 1982-03-19 1982-03-19 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57042598A JPS58161334A (ja) 1982-03-19 1982-03-19 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58161334A true JPS58161334A (ja) 1983-09-24
JPH0153508B2 JPH0153508B2 (enrdf_load_stackoverflow) 1989-11-14

Family

ID=12640487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57042598A Granted JPS58161334A (ja) 1982-03-19 1982-03-19 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58161334A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02302055A (ja) * 1989-05-16 1990-12-14 Nec Kyushu Ltd 半導体装置
JP2000208560A (ja) * 1999-01-12 2000-07-28 Asahi Rubber Kk 超音波複合振動を用いた半導体チップの基板への実装方法
US6116490A (en) * 1997-07-29 2000-09-12 Kabushiki Kaisha Shinkawa Bonding apparatus

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126063A (en) * 1975-04-25 1976-11-02 Hitachi Ltd Wire bonding method
JPS534185U (enrdf_load_stackoverflow) * 1976-06-28 1978-01-14
JPS55128841A (en) * 1979-03-27 1980-10-06 Marine Instr Co Ltd Ultrasonic drive device
JPS57157534A (en) * 1981-03-23 1982-09-29 Nec Corp Assembling device for semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126063A (en) * 1975-04-25 1976-11-02 Hitachi Ltd Wire bonding method
JPS534185U (enrdf_load_stackoverflow) * 1976-06-28 1978-01-14
JPS55128841A (en) * 1979-03-27 1980-10-06 Marine Instr Co Ltd Ultrasonic drive device
JPS57157534A (en) * 1981-03-23 1982-09-29 Nec Corp Assembling device for semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02302055A (ja) * 1989-05-16 1990-12-14 Nec Kyushu Ltd 半導体装置
US6116490A (en) * 1997-07-29 2000-09-12 Kabushiki Kaisha Shinkawa Bonding apparatus
JP2000208560A (ja) * 1999-01-12 2000-07-28 Asahi Rubber Kk 超音波複合振動を用いた半導体チップの基板への実装方法

Also Published As

Publication number Publication date
JPH0153508B2 (enrdf_load_stackoverflow) 1989-11-14

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