JPS58148932U - キヤピラリ− - Google Patents
キヤピラリ−Info
- Publication number
- JPS58148932U JPS58148932U JP1982047219U JP4721982U JPS58148932U JP S58148932 U JPS58148932 U JP S58148932U JP 1982047219 U JP1982047219 U JP 1982047219U JP 4721982 U JP4721982 U JP 4721982U JP S58148932 U JPS58148932 U JP S58148932U
- Authority
- JP
- Japan
- Prior art keywords
- capillary
- main body
- view
- utility
- small diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来のキャピラリーの構造を示した断面図。第
2図は本考案のキャピラリー先端近傍の拡大断面図a、
および斜視図す。第3図は洗浄状態を比較した概略図で
あり、Cは従来の態様、dは本考案の態様を示す。第4
図は本考案の他の実施例を示す正面図。 1:本体、2:中心孔、3:先端部、4:細線、5:′
孔、6:洗浄液、7:洗浄液の流れ、8:中央孔先端部
の内壁、9ニスリツト。
2図は本考案のキャピラリー先端近傍の拡大断面図a、
および斜視図す。第3図は洗浄状態を比較した概略図で
あり、Cは従来の態様、dは本考案の態様を示す。第4
図は本考案の他の実施例を示す正面図。 1:本体、2:中心孔、3:先端部、4:細線、5:′
孔、6:洗浄液、7:洗浄液の流れ、8:中央孔先端部
の内壁、9ニスリツト。
Claims (1)
- 半導体ワイヤーボンディング等に使用するキャピラリー
において、該本体側面に中央孔に達する小径の孔を形成
したことを特徴とするキャピラリ0
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982047219U JPS58148932U (ja) | 1982-03-31 | 1982-03-31 | キヤピラリ− |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1982047219U JPS58148932U (ja) | 1982-03-31 | 1982-03-31 | キヤピラリ− |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58148932U true JPS58148932U (ja) | 1983-10-06 |
JPS6344995Y2 JPS6344995Y2 (ja) | 1988-11-22 |
Family
ID=30058187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1982047219U Granted JPS58148932U (ja) | 1982-03-31 | 1982-03-31 | キヤピラリ− |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58148932U (ja) |
-
1982
- 1982-03-31 JP JP1982047219U patent/JPS58148932U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6344995Y2 (ja) | 1988-11-22 |
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