JPS58148500A - Electronic part series - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in the structure of an electronic component series in which a plurality of parallel lead type electronic components are held by a holding band.

FIG. 11 is a partially cutaway plan view showing an example of a conventional electronic component series. Referring to FIG. 1, a parallel lead type electronic component 2 is arranged on one side of a holding band 1 made of a flexible material such as cardboard. The parallel lead type electronic component 2 includes an electronic component element 3 constituting, for example, a capacitor, a resistor, etc., and a lead wire 4.4 led out in parallel from the electronic component element 3. As is clear from No. 11II, each lead strand 4 is fixed and held on the holding band 1 by pasting it on the adhesive tape 5 and holding 11.

That is, the parallel lead type electronic component 2 has a lead ring 4
It is held between the adhesive tape 5 and the holding band 1 at the part shown in FIG. A large number of perforations 6 are formed in the longitudinal direction of the holding band 1 and the adhesive tape 6 through the holding band 1 and the adhesive tape 5, so that the electronic component series shown in FIG. It may be automatically fed by an insertion sprocket (not shown) or the like. Although only a part of the electronic component series is shown in No. 11I, a large number of parallel lead type electronic components 3 are distributed and arranged in the longitudinal direction of the holding band 1.

By the way, electronic components with such a structure are shipped after being folded to a predetermined length and stored in a closet, or wrapped around a reel, and the user has to remove them from the container or reel. The taped layer is continuously supplied to an automatic insertion machine and inserted into a printed IIIJII board or the like.

Currently, in order to reduce the cost of the finished product to which electronic components are attached, the first step is to reduce the cost of the finished product. In the electronic component series as shown in 1, an insertion rate of 99.99% is considered to be an essential rule. In order to achieve an insertion rate of 99.99%, it is essential that the parallel lead type electronic component 2 is held in an accurate posture without being deformed on the holding band 1.

However, when manufacturing a series of electronic components, when winding the manufactured series of electronic components onto a reel or folding them in a zigzag manner and packaging them in a container, and when transporting the packaged series of electronic components, It is unavoidable that external forces such as various vibrations or shocks are applied to the electronic component series.Furthermore, even in the section that supplies the electronic component series on the shelves to the automatic insertion machine,
An external force such as vibration or shock is applied. therefore,
Even if such an external force is applied, the parallel lead type electronic component 2 held by the electronic component chain must not be deformed and must be held on the holding band 1 in an accurate posture. However, In reality, in a conventional electronic component series, when an external force is applied, the electronic components 2 held on the holding band 1 come into contact with each other, or the holding band 1 made of cardboard or the like swells. Accidents occurred in which external forces were applied from various directions to individual parallel lead type electronic components 2, deforming and damaging the lead strands 4. As a result, automatic insertion machines often failed to insert the electronic components into printed circuit boards. 99.99% insertion rate for etc.
That is extremely mgi. In particular, recently, high-density printed circuit boards have been put into practical use.
The allowable range for deformation and distortion of the lead bundle 4 has become narrower than ever before. Therefore, it is generally desired in the electronic component industry to further reduce the deformation and distortion of the lead bundle 4.

Therefore, the main object of the present invention is to satisfy the above-mentioned needs and to improve the lability of electronic components based on external forces. The shape and distortion are IJII
An object of the present invention is to provide an electronic component series having a structure that can be reduced in terms of energy consumption.

Simply put, the present invention provides an electronic component chain in which several slits are distributed in the longitudinal direction of the retaining strip and are cut inward from the longitudinal edge of the retaining strip. It is. In this specification, the term "slit" means
It should be pointed out that this range broadly includes notches with a width of substantially zero to a width of considerable width.

Other objects and features of the invention will become more apparent from the following detailed description with reference to the drawings.

The third all is a partially cut-out flat W showing an embodiment of the present invention.
Ja1, and the first one shown for the conventional electronic component series.
FIG. Referring to FIG. 3, the feature of this embodiment is that a plurality of slits 18 are formed in the center of each electronic component 12 in the vicinity of the feed hole 16 in the longitudinal direction of the holding band 11 made of, for example, cardboard. Both ends 1111a along
It is formed by being cut inward from 11b. That is, notches 18 are formed on both sides of each electronic component 12. The rest of the structure is the same as that of the conventional electronic component series shown in FIG. 1, so corresponding parts will be given corresponding reference numerals and explanations thereof will be omitted. In this embodiment, the slits 18 are provided on both sides of each electronic component series 12, and the retaining bands 11
The slit 1 extends inward from both end edges 11a and 11b.
8 is formed, each electronic component 12 can be moved in different directions in each slit 18 - toward the front or the back of the paper in FIG. That is, the parallel lead type electronic component 12 positioned between each slit 18 is moved together with the retaining band 11 and the adhesive tape 15 using the remaining retaining band 11 and adhesive tape 16 in the area where the slit 18 is formed as a fulcrum. , and can be moved independently of the surrounding parallel lead type electronic components 12. Therefore, even if an external force is applied to each parallel lead type electronic component 12 from a different direction, each parallel lead type electronic component 12 held on the holder l111 can move independently.
Therefore, deformation and weighting of the lead wires 14 of the parallel type electronic component 12 held on the holding band 11 can be avoided. 2 and 4 are diagrams for explaining the advantages of this embodiment, and FIG. 2 shows the allowable change when an external force is applied to the conventional electronic component series shown in FIG. 1. A side 1111irMall indicating the distortion range,
FIG. 4 is a side sectional view showing the allowable amount am in the embodiment shown in FIG. 3 when an external force is applied from the same direction.

In addition, in FIGS. 2 and 4, 1! The cross-sectional hatching of the electronic component series has been removed to facilitate the solution. As is clear from No. 21, X
When an external force is applied from the direction, the allowable strain of the parallel lead type electronic component is approximately 1- in the X direction. On the other hand, the fourth! As is clear from II, in this embodiment, since the profitable parallel lead type electronic component 12 can move independently in each slit bar as described above, the allowable deformation when an external force is applied from the X direction is The size is approximately 4 mm. That is, the permissible ll! of this example under the same conditions! It will be understood that the distortion is about four times the allowable variable in conventional electronic component series.

In this case, the width of the holding band 1 is 18-1, and the width of the slit 1 is 18-1.
The length of 8 is 4-.

In the above embodiment, the slits 18 were formed on both sides of each parallel lead type electronic component 12, but the slits 18 & should not be formed between all the parallel lead type electronic components 12. In other words, the slit in this invention is not included in the retaining band 11.
The slits 18 may be formed to be appropriately distributed along the lengthwise edge, for example, the slits 18 may be formed for each of two or three parallel lead type electronic components 12. It is not necessary to form it between the 12 adjacent electronic parts. However, it is preferable for the slit 18 to be formed for each parallel lead type electronic component 12 in order to withstand external forces. Also, slit 1
8 does not need to be formed on both end edges along the length direction of the retention band 11, and may be formed only on at least one end edge.

At this time, from the point of view of the effect of absorbing external force, it is preferable that the slit 18 be formed at the edge of the tip end of the lead wire.
For example, a slit having substantially no width may be formed, which is not the case as shown in FIG. In short, the parallel lead type electronic component 12 held on the electronic component series
Or some parallel lead type electronic components 12,
Any shape and length may be used as long as the slits can be moved independently and fitted into each other. In the above embodiment, the holding means for holding the parallel lead type electronic component 12 on the holding band 11 is Adhesive tape 15
However, the electronic component series to which the present invention is applied is not limited to this, and it goes without saying that holding means such as slits formed in the longitudinal direction of the holding band may also be used.

As described above, according to the present invention, a plurality of slits cut inward from the longitudinal edge of the retention band are formed and distributed in the longitudinal direction of the retention band. Individual electronic components held can move independently,
Therefore, it is possible to obtain an electronic component series with excellent resistance to external forces. For this reason, the shocks applied during packaging, transportation and automatic insertion of electronic components, or! It can effectively absorb external forces such as motion, and it is possible to automatically insert a shaped layer that maintains a good posture into, for example, a printed circuit board, increasing the insertion rate of parallel lead type electronic components to 99.9%.
It is threatened that the achievement of 99% or more has been achieved.

[Brief explanation of the drawing]

#11111 is a partially cutaway plan view showing an example of a conventional electronic component series. Figure 2 is the first! ! FIG. 11 is a schematic llll1iIiii1 diagram for explaining the range of allowable *distortion in the series of electronic components shown in FIG. FIG. 3 is a partially cutaway plan view showing one embodiment of the present invention, and is a view corresponding to FIG. 1 showing a conventional electronic component series. FIG. 4 is an sg #IWi cross-section diagram for explaining the allowable distortion in the embodiment shown in FIG. 3, and is a diagram corresponding to FIG. 2. As shown in the figure, 11 is a retaining band, 118.11b is an edge along the length of the retaining band, 12 is a parallel lead type electronic component, 14 is a lead wrap, 15 is an adhesive tape as a holding means, and 18 is a slit. shows. Patent applicant Murata Manufacturing Co., Ltd.

Claims (1)

[Claims] An electronic device comprising a flexible retaining band and a plurality of parallel lead type electronic components distributed in the length direction of the retaining band and held with lead wraps extending in the width direction of the retaining band. In the parts series, a plurality of slits cut inward from an edge along the longitudinal direction of the retaining band are formed and distributed in the longitudinal direction of the retaining band. Part series.