JPS58148485A - Flexible circuit board with release sheet - Google Patents
Flexible circuit board with release sheetInfo
- Publication number
- JPS58148485A JPS58148485A JP3148682A JP3148682A JPS58148485A JP S58148485 A JPS58148485 A JP S58148485A JP 3148682 A JP3148682 A JP 3148682A JP 3148682 A JP3148682 A JP 3148682A JP S58148485 A JPS58148485 A JP S58148485A
- Authority
- JP
- Japan
- Prior art keywords
- release sheet
- flexible circuit
- circuit board
- adhesive
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
フレキシブル１路板の一形態としてその裏＃ｋｉに例え
ば感圧性接着材等を設けてお龜、機器に財する実装時に
ねじその他の取付は具を使用することなくその１ｉ！！
着材によってフレキシブル回路板を機器に簡便に貼着固
定するようにした奄Ｏがある。このよう″Ｉｋ形態のフ
レキシブル回路板では、実装時までに接着面を保護する
ため剥離紙或いはその他のフィルム材等からなるリリー
スシートをフレキシブル回路板裏面の接着材に貼付けて
おくのが好まし−が、反面、実装時にこのリリースシー
トを剥ぎ取る際、リリースシートが接着材端面ときっち
り一致した状態で貼付けられて−るとそのリリースシー
ト＃ｉ極めて剥がしにくいものとなり、不ｊｌ（＋場合
に社フレキシブル回路板にしわを付けるか或いはその端
縁を破損させる等の思わぬ事ｉｉｔ引き起こし１実装作
業性を低下させる要因となる。[Detailed Description of the Invention] As a form of flexible road board, for example, a pressure-sensitive adhesive or the like is provided on the back side of the road board, so that screws and other attachments can be made without using any tools when mounting on a bolt or equipment. 1i! !
There is a product called "O" which allows a flexible circuit board to be easily attached and fixed to a device using a bonding material. In such an "Ik" type flexible circuit board, it is preferable to attach a release sheet made of release paper or other film material to the adhesive on the back side of the flexible circuit board in order to protect the adhesive surface before mounting. However, on the other hand, when peeling off this release sheet during mounting, if the release sheet is pasted in a state that is exactly aligned with the edge of the adhesive, the release sheet #i will be extremely difficult to peel off, and if it is not This may cause unforeseen events such as wrinkles on the flexible circuit board or damage to its edges, resulting in a reduction in mounting work efficiency.
本発明は、上記事情を考慮し、このＩｋのリリースシー
トを備えたフレキシブル回路板の実装性Ｔ？改養するよ
う虻した製品を提供すべく、亀１図および第２図にその
一実施例を示すとおり、所ｌＩＩの回路パターンコを形
成したフレキシブル回路板１０裏ｍ虻例えば感圧性接着
材３およびその外函に剥離紙またはその他のフィルム材
からなるリリースシート事を設ける際、フレキシブル回
路板ｌの適宜端部にスリットまたＦｉ建シン属等の分離
自在な切り込み！を介して剥ぎ敢りの為の″）かみ代≦
ｖｒ延設し、該つかみ代乙の裏面の全部または一部ｆｆ
ｉで及ぶよう虻上記接着材Ｊおよびリリースシート参を
投砂るように構成したものである。切り込みｊを介して
このようなつかみ代４を設けると、フレキシブル回路板
／Ｃ）実装時ｆおいて、第３図の如く、このつかみ代≦
を折ち曲げるようにするとフレキシブル回路板／！（Ｌ
わまたは損傷を与えることなく論ａかつ高能率にリリー
スシート亭を接着材３かも飼ぎ散ることかで自機−に対
する実装作業性を格段に高め得ることとなる。In consideration of the above circumstances, the present invention has been developed to provide a flexible circuit board equipped with a release sheet of Ik. In order to provide a product that requires improvement, as shown in FIG. 1 and FIG. And when providing a release sheet made of release paper or other film material to the outer case, slits or cuts such as Fi-ken-shin can be made at the appropriate ends of the flexible circuit board so that it can be freely separated. ``) Kamiyo ≦ for stripping through
VR is extended, and all or part of the back side of the gripping material O is ff.
The adhesive material J and the release sheet are sand-cast so as to cover the area. When such a gripping allowance 4 is provided through the notch j, as shown in FIG. 3, this gripping allowance ≦
If you bend it, it becomes a flexible circuit board/! (L
By dispersing the adhesive material 3 from the release sheet in a logical and highly efficient manner without causing any damage or damage, it is possible to greatly improve the workability of mounting the adhesive on the own machine.
上記切り込みｊＦｉ、この実施４ｓによればフレキシブ
ル回路板／ｆのみ設ける如く図示されて−るが、接着材
３の資質或いＦｉ回路＆ｌの形状等によってＦｉ接着材
３の厚さの全部または−［ｆまで亘るように切り込みｊ
の深さを適宜定めることも可能である。According to this implementation 4s, only the flexible circuit board /f is shown as being provided with the cut jFi, but depending on the quality of the adhesive 3, the shape of the Fi circuit &l, etc., the entire thickness of the Fi adhesive 3 or - [Cut to extend to f]
It is also possible to set the depth appropriately.
い→１れＫしても、値上の如き剥ぎ取りつかみ代を備え
るリリースシート付７レキシプル■路板によれに、こ０
種の７レキシプルａｍ＊の機器に対する実装作業性を著
しく良好【する一方、リリースシートを剥ぎ取った接着
材面がその剥ぎ取り開始個所をも含めてしわなど％なく
極めて清浄な状態となるので、剥ぎ敗勢端縁Ｏ接着力を
も他Ｏ部分と同＊ｉｃ＊ｒｍ［’＆Ｌ得る等、この種の
フレキシブル回路板に適用してその実用上の効果は著し
一部（′がある。→ Even if it is 1 K, it is 7 Lexiple with a release sheet that has a peeling grip that is above the price.
The workability of mounting on the type 7 lexiple am* device is extremely good [while the surface of the adhesive material from which the release sheet is peeled off is extremely clean with no wrinkles or wrinkles, including the area where the release sheet starts to be peeled off. When applied to this type of flexible circuit board, its practical effects are remarkable, such as obtaining the same adhesive force at the peeling edge O as the other O parts.
第１図は、本発明のψ実施例によるリリースシー）を備
えたフレキシブル回路板の概念的な部分Ｉｌｒｍ１１Ｉ
威図、第一図はその概念的な部分斜視図、＃！３図＃！
ｉ同じくその使用態様図である・
／ 、、、、、 ７レキシブル回路板λ ９１０
１． 回路パター ン
３ ・・・・・ 接 着 材亭 ００１０．
リリースシート
ｊ 、、、、、切り込み
４１１０．、つかみ代
出願人 日本メクシロン株式金社FIG. 1 shows a conceptual part Ilrm11I of a flexible circuit board with a release sea according to the ψ embodiment of the present invention.
The first figure is a conceptual partial perspective view, #! Figure 3 #!
i is also a diagram of its usage. / , , , 7 Flexible circuit board λ 910
1. Circuit pattern 3...Adhesive material 0010.
Release sheet j ,,,,,notch 4110. , Applicant: Nippon Mexilon Co., Ltd. Kinsha
Claims (1)
Ｅ接着材外面にリリースシートを有するよう？＆７レキ
シプル回路＆において、上記接着材およびリリースシー
トと共（該７し午シブル回路板虻切り込みを介して上記
リリースシートの＃Ｉｔ取りつかみ代を付設するように
構成して表るリリースシートを備えた７レキシプルー踏
板。Providing adhesive material on the back side of the flexible circuit boardxclII
Does the adhesive have a release sheet on its outer surface? &7 Lexiple circuit&, together with the adhesive and the release sheet (7) includes a release sheet configured to attach a gripping allowance of the release sheet through the notch in the flexible circuit board. 7 Lexipuru treads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3148682A JPS58148485A (en) | 1982-02-27 | 1982-02-27 | Flexible circuit board with release sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3148682A JPS58148485A (en) | 1982-02-27 | 1982-02-27 | Flexible circuit board with release sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58148485A true JPS58148485A (en) | 1983-09-03 |
Family
ID=12332594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3148682A Pending JPS58148485A (en) | 1982-02-27 | 1982-02-27 | Flexible circuit board with release sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58148485A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217879U (en) * | 1988-07-21 | 1990-02-06 | ||
| JPH03206680A (en) * | 1990-01-09 | 1991-09-10 | Sumitomo Electric Ind Ltd | Flexible printed circuit substrate and its manufacture |
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
| WO2009098765A1 (en) * | 2008-02-07 | 2009-08-13 | Sumitomo Bakelite Co., Ltd. | Circuit board |
| US7882708B2 (en) | 2002-07-31 | 2011-02-08 | Behr Gmbh & Co. Kg | Flat pipe-shaped heat exchanger |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS507267A (en) * | 1973-05-28 | 1975-01-24 |
-
1982
- 1982-02-27 JP JP3148682A patent/JPS58148485A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS507267A (en) * | 1973-05-28 | 1975-01-24 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217879U (en) * | 1988-07-21 | 1990-02-06 | ||
| JPH03206680A (en) * | 1990-01-09 | 1991-09-10 | Sumitomo Electric Ind Ltd | Flexible printed circuit substrate and its manufacture |
| US7882708B2 (en) | 2002-07-31 | 2011-02-08 | Behr Gmbh & Co. Kg | Flat pipe-shaped heat exchanger |
| JP2007220784A (en) * | 2006-02-15 | 2007-08-30 | Sumitomo Bakelite Co Ltd | Adhesive substrate, manufacturing method of circuit substrate, and circuit board |
| JP4692317B2 (en) * | 2006-02-15 | 2011-06-01 | 住友ベークライト株式会社 | Adhesive substrate, circuit board manufacturing method, and circuit board |
| WO2009098765A1 (en) * | 2008-02-07 | 2009-08-13 | Sumitomo Bakelite Co., Ltd. | Circuit board |
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