JPS5814622Y2 - soldering jig - Google Patents

Description

[Detailed description of the invention] This invention relates to a soldering jig used when soldering a variable capacitor temporarily fixed to a printed wiring board using the dip soldering method, and has a simple configuration that significantly facilitates the soldering work. The purpose is to

Generally, when the variable capacitor 2 is mounted with the rotating shaft 3 facing the printed wiring board 1 side as shown in Fig. 1, the mounting foot 4 of the variable capacitor 2
When soldering or other electrical components by the immersion soldering method, molten solder may adhere to the rotating shaft 3 of the variable capacitor 2 through the through hole 5 formed in the printed wiring board 1 for inserting the operating shaft, which is extremely inconvenient. It is.

Therefore, in such a case, a separate adhesive tape is usually used, and as shown in FIG. 1, the adhesive tape 6 is applied to the printed circuit board 1 in advance to close the through hole 5, and then soldered by dip soldering. A method is adopted in which soldering is performed and the cover tape 6 is peeled off after soldering.

However, in this case, a separate adhesive tape is required, and once the adhesive tape has been applied, it is very difficult to remove it and requires manpower, resulting in very poor workability as a whole.

This proposal eliminates the above-mentioned conventional drawbacks,
The present invention provides an excellent soldering jig with a simple configuration and good workability.

The soldering jig of the present invention will be described below with reference to drawings of embodiments.

2 and 3 are a sectional side view and a rear view showing the usage of the soldering jig of the present invention, and numerals 1 to 5 in the figures indicate the same parts as shown in FIG. 1.

Reference numeral 11 shows one embodiment of the soldering jig of the present invention, which includes a shaft portion 9 having a threaded portion 8 that is screwed into a screw hole 7 formed in the rotating shaft 3 of the variable container 2, and the aforementioned shaft portion. 9, and the screw portion 8 is connected to the screw hole 7.
The lid body 10 has an outer circumferential portion that comes into pressure contact with the lower surface of the printed wiring board 1 when screwed into the lid body 10 and acts to close the through hole 5 for inserting the operating shaft.

Therefore, according to the above embodiment, the screw portion 8 of the shaft portion 9 constituting the soldering jig 11 is simply screwed into the screw hole 7 formed in the rotating shaft 3 of the variable capacitor 2 and tightened. The through hole 5 can be completely covered with the cover body part 10, and even when the mounting leg 4 and other electrical components are soldered to the printed wiring board 1 by the dip soldering method, molten solder can fill the through hole for inserting the operating shaft. There is no adhesion to the rotating shaft of the variable capacitor 2 through the capacitor 5, and good soldering work can always be performed.

According to the above embodiment, since the soldering jig is connected to the rotating shaft 3 of the variable capacitor 2 by screwing, it is extremely easy to attach and detach the soldering jig, and compared to the conventional method using adhesive tape, the soldering jig is connected to the rotating shaft 3 of the variable capacitor 2. Workability is also significantly improved.

In the embodiment, a threaded part 8 is formed on the shaft part 9 of the soldering jig 11, and this threaded part 8 is screwed into a threaded hole 7 formed in the rotating shaft 3 of the variable capacitor 2. As shown in FIG. 2, a recessed hole 12 may be formed in the shaft portion 9 and the rotating shaft 3 may be simply fitted into the recessed hole 12.

Further, in the embodiment, the lid portion 10 of the soldering jig 11 is simply formed into a flat plate shape, but it may be formed into a shape as shown in FIGS. 5 to 12.

In particular, as shown in FIG.
As shown in the figure, if the outer peripheral part of the lid part 10 is made thinner and has elasticity itself, the degree to which the through hole 5 is closed by the lid part 10 becomes stronger and the effect becomes greater.

As is clear from the examples above, the soldering jig of the present invention has a simple configuration and can perform soldering work with good workability.Moreover, solder adheres to unnecessary parts through through holes that do not require soldering. This is extremely advantageous in practice.

[Brief explanation of the drawing]

Figure 1 is an explanatory diagram explaining conventional soldering work, Figure 2 is a cross-sectional side view showing how the soldering jig of the present invention is used, Figure 3 is a rear view of the same, and Figures 4 to 12 are FIG. 7 is a cross-sectional view showing other embodiments. 1... Printed wiring board, 2... Variable capacitor, 3... Rotating shaft, 4... Mounting leg,
5... Operation shaft insertion through hole, 7... Screw hole, 8... Threaded portion, 9... Shaft portion, 10
・・・・・・Lid part, 11 ・・・Soldering jig, 1
2...Recessed hole, 13...Resin molded product.

Claims (3)

[Scope of utility model registration request] (1) A shaft portion that can be connected to the rotating shaft of a variable capacitor that is temporarily fixed to a printed wiring board, and a lid that closes a through hole for inserting an operating shaft that is formed in the printed wiring board opposite to the rotating shaft. and a soldering jig configured such that the lid portion closes the through hole when the shaft portion is coupled and fixed to the rotating shaft. (2) Scope of Utility Model Registration Claim 1: A resin molded product with high elasticity is attached to the part of the lid body that comes into contact with the printed wiring board.
Soldering jig described in section. (3) A thin wall portion is formed on the outer periphery of the lid portion, and the elastic force of the thin portion causes the outer periphery of the lid portion to be elastically pressed against the printed wiring board. The soldering jig described in item 1.