JPS58142558A - Semi-fixed inductor for hybrid integrated circuit - Google Patents

Abstract

PURPOSE:To provide a fixed inductance between electrodes by a method wherein one end of a spiral formed micro strip wire MSL by metal which is coated with solder and can be soldered is bridged to an electrode pad, and the other end to an electrode by a wire. CONSTITUTION:An Ag-Pd layer 11 is adhered on a circuit substrate 1 in the thickness approx. 10mum and patterned into a spiral form, and Sn-Pb solder is superposed in approx. 200mum. One electrode and 2b' is connected to one end of the obtained MSL11, and the other electrode pad 2a' is bridged 12 to a point of the MSL by a Cu wire by soldering. By this constitution, the inductance increases more, as the interval of the MSL goes narrower, and the bridging wire 11 becomes a part thereof resulting in the remarkable increase of integration degrees. The inductance of high accuracy can be obtained, and accordingly the adjustment and setting are extremely easy by the change of the junction point.

Description

[Detailed description of the invention] [Departure @O technology fee] The present invention relates to semi-fixed inductors for hybrid integrated circuits.

[Technical capacity of invention]

Semi-constant Inmecta's first conventional product made of ridged O-solder connections
The WJt9 shown in Figure 2 was used. That is, the one shown in Fig. 1 is placed on the circuit board (1).
Pairs of electrode pads (2m) individually led from the track wiring,
(2b), to which a nine-metal coil (3) whose inductance is adjusted to a predetermined value is connected. What is shown in FIG. 2 is nine electrode pads (21') formed in the same manner as on the ridge.

Microstrip lines (hereinafter abbreviated as M8L) (hereinafter abbreviated as M8L) meander and approach each other in a mirror-like relationship with each other (2b').
4m) and (4b) are provided, and their closest parts are parallel to each other), and a metal shortener (5) is provided in this part to adjust the inductance between the two electrodes to the desired value. In other words, the installation position of the shortper is selected so that

Background technology for ridges [In the case of coils, it largely depends on the inner diameter of the coil, the number of turns, the pitch, and the thickness of the wire. In addition, for M8L that uses a shortper, the material, thickness, back surface condition of the circuit board, width, thickness of MAL,
It has an effect that largely depends on the spacing between adjacent twins and the shape and dimensions of the shortper.

[Problems with background technology]

Inductors using ridged coils have difficulty controlling inductance accuracy. The inductor based on M8LK cannot have a high degree of integration, and the range of inductance settings for each type of combination of M8L and short bar is narrow.

In particular, in the case of M8LK, since the current flowing in each adjacent line is in the opposite direction, the inductance decreases as the distance between adjacent lines becomes smaller. The present invention provides a modified semi-rigid inductor structure that overcomes the problems in the ridge background art.

[Summary of the invention]

The semi-fixed inductor for a one-component integrated circuit according to the present invention has a spiral 0M8L made of a metal coated with solder and solder-coated with a pair of electrodes, and one end of the M8L. On the other hand, a wire that can be soldered is connected to one point on MaL via a bridge made of expanded ribbon to form a predetermined inductance between the pair of electrodes.

[Embodiments of the invention]

Next, the above will be explained in detail with reference to Figure #13. Note that the nine circuit boards and the pair of electrode knots described in the background art remain the same, so the same reference numerals are attached to the drawings and the explanation thereof will be omitted. In the figure, al) is M8L formed of Mug-Pd, and K At -P on the circuit board (1)
After depositing the layer D to a thickness of 10JIII, it was turned into a spiral shape as shown in the figure, and the exposed surface was coated with a 5npb solder layer to a thickness of 200mm. One electrode/set (2b') of the electrode pads (2m'), (2b') is connected to one end of the above MAL, and the other electrode A pad (2m') is made of a solderable metal, e.g. copper. It is formed of a wire or ribbon and is soldered to one point on M8L (19) with a nine-bridge a. As a result of the above, a predetermined inductance is inserted into both electrodes/parameters, and the solder joint By changing the points, the magnitude of the inductance can be adjusted as desired.

Incidentally, it has recently been found that the inductor for the output circuit of the RF amplifier Molière requires considerable precision, so this method is also applied thereto.

〔Effect of the invention〕

According to this invention, when the line spacing of M8L is small, the inductance becomes large and the bridge also becomes a part of the inductor, so the integration degree can be increased by 50 to 100 in the conventional M8L using a shortper. .

The manufacturing precision of current M8L bridges results in extremely high precision inductors. As an example, when forming an inductor of 3 Q aH, the conventional coil type could only obtain ±10, but according to the present invention, it can be suppressed to ±5- or less. Since the selection range of solder joint points of the bridge for M8LK can be widened, the inductance setting range can be widened even with a combination of one type each of M8L and bridge. Furthermore, the MIIL is rounded and coated with solder, which has the advantage that the inductance can be adjusted and set very easily as described above.

[Brief explanation of drawings]

1 and 2 are perspective views of an inductor according to the background art, and FIG. 3 is a perspective view of an inductor according to an embodiment of the present invention. In addition, the same reference numerals in the figures indicate the same parts or parts corresponding to butterflies, respectively. 1 Circuit board 2m', 2b' Pair of electrodes/signatures 11
Microstrip line (MJiL) 12
Prizuri Patent Attorney Inoue - Male

Claims (1)

[Claims] A circuit board has a pair of electrode pads individually led from the one-way wiring, and four metal spiral O-mic split lines coated with solder and capable of being connected by nine solders,
One of the electrodes/e-rad is the one mentioned above! One end of the micro-split line (Kt) and the other end are formed into a wire or ribbon that can be connected by solder, and connected to one point on the micro-split line via a bridge to form a predetermined inductance between the pair of electrodes. 9 Semi-fixed inductors for hybrid integrated circuits.