JPS58141374A - Automatic controlling method of electroless plating solution - Google Patents

Automatic controlling method of electroless plating solution

Info

Publication number
JPS58141374A
JPS58141374A JP2009082A JP2009082A JPS58141374A JP S58141374 A JPS58141374 A JP S58141374A JP 2009082 A JP2009082 A JP 2009082A JP 2009082 A JP2009082 A JP 2009082A JP S58141374 A JPS58141374 A JP S58141374A
Authority
JP
Japan
Prior art keywords
electroless
concn
water
electroless plating
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009082A
Other languages
Japanese (ja)
Inventor
「あ」 義之
Yoshiyuki Tsuru
Toshiro Okamura
岡村 寿郎
Sumiko Nakajima
澄子 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYUUSHIYOU KIGYO SHINKO JIGYODAN
Original Assignee
CHIYUUSHIYOU KIGYO SHINKO JIGYODAN
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYUUSHIYOU KIGYO SHINKO JIGYODAN filed Critical CHIYUUSHIYOU KIGYO SHINKO JIGYODAN
Priority to JP2009082A priority Critical patent/JPS58141374A/en
Publication of JPS58141374A publication Critical patent/JPS58141374A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1683Control of electrolyte composition, e.g. measurement, adjustment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
    • C23C18/405Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To decrease alkali errors and to control electroless plating solns. automatically without labor for maintenance by diluting the electroless plating soln. to be measured with a large volume of a specified ratio of water then measuring the compsn. thereof as a homogeneous soln. CONSTITUTION:A general electroless copper plating soln. contg. copper salts such as copper sulfate, complexing agents such as EDTA, reducing agents such as HCHO, and pH control agents such as NaOH is controlled automatically in the following way in the stage of measuring the compsn. of said plating soln. and replenishing the comsumed components: Said plating soln. is diluted with the tap water by which specified quality of water is obtained and which is so added thereto that the concn. ratio before and after the dilution attains 1/2-1/20. Parameters of >=1 kinds among the concn. of copper ions, pH, the concn. of HCHO, the concn. of stabilizers, the concn. of complexing agents, etc. are measured with respect to the diluted liquid. Since specified measuring conditions for samples are assured by the above-mentioned method, the errors in the measurement are decreased and the life of the measuring electrode is extended.

Description

【発明の詳細な説明】 本発明は無電解銅めう自滅の逐続運転に使用嘔nる無電
解銅め9I!液自st場方法に関するものである・ 無電解鋼めうきでは析出鋼の性能が析出速叙あるいはめ
っき液組成に大きく影替さn、6几め。
DETAILED DESCRIPTION OF THE INVENTION The present invention is an electroless copper metal 9I used for continuous operation of electroless copper metal self-destruction! This relates to the plating solution method.In electroless steel plating, the performance of the deposited steel is greatly affected by the deposition characteristics or the plating solution composition.

無電解めつき作業における作業管層には1&密さが要求
される・しかしながら、人手によるめっ1?lの分析s
Pよび消費成分の補充では連続的に長時間にわたる無電
解め一5I液の運転を安定的に行なうことσ画一でるる
。そこで無電解銅めっl!液の自動分析補充する自a’
l場方法か長藁さnている・ 1pJi図に従来の自動コントローラのブロックダイア
グ2ムを、gz図に検出部の一肖を示し7t。
The working pipe layer in electroless plating work requires a density of 1 & 1. However, manual plating? Analysis of l
For replenishment of P and consumed components, stable operation of the electroless methacrylic solution over a long period of time is essential. So electroless copper plating! Automatic analysis and replenishment of liquid a'
Figure 1 shows a block diagram of a conventional automatic controller, and diagram 7 shows a part of the detection part.

第1凶、纂2図に於て、1は検出部、2はコントロール
部、3はテンブリングポンプ、4は熱交換器、sri補
光液龜刀Ωポン1,6は信号−17に無電解めうき液槽
、8は用参蝋一体化電慣、9に鋼比色セル、10はホル
マリン検出5111はエア抜龜である・ 第2図で明らかなように、従米のコント京−りにサンプ
リングしためっき液を原液の11箇掬足している。その
究め (υ 州の場合 1)アルカリ誤!IlかX1vh(FH12以上)+0
  *アルカリのため電離の応答遮IRか運い・…)5
1にアルカリであるため電−の寿命が短かい・ (2)鋼の場合 1)a光度セルの設計に制約か多い。
In the first example, Figure 2, 1 is the detection unit, 2 is the control unit, 3 is the Tenbling pump, 4 is the heat exchanger, and SRI brightening liquid. 8 is an electrolytic solution tank, 8 is an electrolyte with integrated wax, 9 is a steel colorimetric cell, and 10 is a formalin detection 5111 is an air vent. 11 scoops of the stock solution were added to the sampled plating solution. The investigation (in the case of υ state 1) Alkaline mistake! Il or X1vh (FH12 or higher) +0
*Because of the alkali, the response of ionization is blocked by IR...)5
(1) Since it is alkaline, the life of the electric current is short. (2) In the case of steel (1) There are many restrictions on the design of the luminosity cell.

(3)  HCHOの場合(亜amソーダによる分析)
1)州と同様 (4)その他1)配管系にめっきが析出し易−0という
問題かめ一57t。
(3) In the case of HCHO (analysis using ammonium soda)
1) Same as the state (4) Others 1) Plating easily deposits on the piping system - 0 problem Kame 1 57t.

本発明はこのような点に鑑みて7!1n72.もので、
アルカリ誤差の少ない、保守に手間のかからない無電解
鋼めっき液の自動管m方法に関するtのである。
In view of these points, the present invention has been developed based on 7!1n72. Something,
This article relates to an automatic tube m method for electroless steel plating solution that has few alkaline errors and requires no maintenance.

本発明は無電解めっ1!液の組成を連続的に調定しかつ
消費されに成分を連続的に補充する無電解めっき猷の自
動管m方法に於て、llR4足し工りとする無電解めっ
き液をサンプリングし1人量の一足割會の水′t−加え
て希釈した#kに均質な溶液とし1m11足を行うこと
t%像とするtのでめるO すなわち本発明は、摺足しようとする無電解めっII液
を水で一定の111曾に希釈し、混酋攪件に1り均質な
溶液とし、しかる後に無電解鋼め−)!!液の組成t−
m足丁ゐCとを骨黴とするものである・ 本発明に於て希釈率の限界に、a元板セル等の検出器の
限界に1って足筐るか、使用めっき鎖の緩衝点を考慮し
、希釈率と1Iatoil[巌性を維持するK tx 
s希釈後と希釈前の#A藏比か1/2〜1/20の関に
あるの力息望ましい・オ尺、1會攪拌は必ずしも機械的
なものKよる必INはなく、mv6ts長くすることに
エフ、拡f/ILjJ象を利用して均質な溶液を侍てt
工い◎希釈に用iる永は、蒸留水套るirjイオン父換
水、精顧水である必豪に必ずしもなく一足の水質が得ら
れる水道水で十分でめる・ 本発明に於てに、調定しようとする無電解め−)き液を
水で一定の割合で希釈し、鋼イオン濃度、田、ホルマリ
ン論度、安定剤搬度、錯化剤濃度等のうちの−mな−し
、そn以上のパラメーターが11wji!さnる・ 不発明に訃ける無電解鋼めつ11液はと<K%殊な配合
のtのではなく銅塩、錨化剤塾還元剤jiPjび−関葺
剤とから成るーIRの無電解鋼めっき液が用−られる・
銅塩としては、懺綾鋼、ハロゲン化鋼、硝酸鋼、酢酸鋼
等が、錯化剤としては、エチレンジアミン四酢酸s”t
シェル塩等が還元剤としてはホルマリン、パフホルムア
ルデヒド等が、田調整剤としては水識化ナトvウム等が
使用さnる◎ 本発明を実施するKは、無電解鋼めっl!液と希釈水と
を一定比にサンプリングする手段、訃↓びめつき液と希
釈水會攪拌混曾して均一な筐体とする手設置−肩゛シ、
嘔らにめ−)1!液這@に必要なバ2メータt−#J足
し、轟該バ2メータを必Il!な範囲内に維持する手段
とからなる無電解銅めりき液自動分析補充i!i電によ
り行うことか出来る・ 以上MS!明したように、不@明では、一定しLうとす
る無電解めりき液1tス童の一足割付の水(例えに水道
水)の添加に!り−足の1II1足条汗か朔株さnるt
め、III定−差の減少測定電極の寿命か改畳される・ すなわち1本発明では、具体的Kに1次の効果か達成さ
れる◎…では、(リアルカリ−Mか小さくなり、(2)
応答速度か速くなる・また、(3)電極の寿命か2〜5
倍嬌び九争鋼の場合は、(1)吸光度セルの厚さを厚く
できる。(2)光源を弱いtOK変えられるなどの効果
−1JXありた・他には(1)合戦されたために、:2
ントロ一ラ内部での鋼の析#1かなくなp1エツチング
などの操作が不要になつ几・偉)テンプリンダ液量が減
っ几ため、めっ自戒のくみ出し量か減少し九〇 以下余白 実施fllI CaSO4・5HmO10g/J EDTA       30 g/l …        12.0 HCHO(57%)   4mi/j NaCN       !!OW@/JGAFAC−R
E610   (L25111/JS 度      
72℃ め−)き面積     1dm’/j 全めうき液jl     2004 上紀めッ1に液の成分のうS)、CuSO4”5H*O
を州、HCHOに関して、W43図に示したコントロー
ラによって希釈率115で自動分析、補光し、NaCN
、EDTA、GAFAC−RE610 (界面活性剤)
は手作業によって分析・補充を行ないながら、24時間
めり自演を連続運転した・ 筐九コントp−2に1って補充さrtyt成分も2時間
に1回の開会で田λ−J、夕、吸光々変針等にエフ手分
析を行1つ九〇 第S@に於て、3μサンプリングボン1.4は熱交換器
s  7rX無電解めっき偕、8は用参照一体化電極、
9は鋼比色セル、10はHCHO横出部、11はエア抜
L12框高速攪拌機、15に水タンクである。
The present invention is electroless plating! In the automatic tube method for electroless plating, which continuously adjusts the composition of the solution and continuously replenishes the components after consumption, the electroless plating solution to be added to 1R4 was sampled and the amount for one person was Add a drop of water to the diluted #k to make a homogeneous solution and add 1ml of water to make a t% image. The solution is diluted with water to a constant concentration of 111%, stirred to make a homogeneous solution, and then mixed with electroless steel. ! Liquid composition t-
In the present invention, due to the dilution rate limit, the limit of the detector such as the a base plate cell, or the buffer of the plating chain used. Considering these points, the dilution rate and 1Iatoil [K tx to maintain stability]
s After dilution and before dilution # A ratio between 1/2 and 1/20 is desirable, 1 hour stirring is not necessarily mechanical, but mv 6ts long. In particular, using the expanded f/ILjJ phenomenon to prepare a homogeneous solution,
◎The water used for dilution is not necessarily distilled water, IRJ ion exchange water, or careful water, but tap water can be used to obtain sufficient water quality.In the present invention , dilute the electroless glazing solution to be prepared with water at a certain ratio, and determine the concentration of steel ions, concentration of formalin, stabilizer transport, complexing agent concentration, etc. And the parameters above n are 11 wji! The electroless steel solution 11, which is uninventive, consists of a copper salt, an anchoring agent, a reducing agent, and a roofing agent, rather than a special combination of IR. Electroless steel plating solution is used.
Copper salts include cypress steel, halogenated steel, nitrate steel, acetate steel, etc., and complexing agents include ethylenediaminetetraacetic acid s"t.
Formalin, puffed formaldehyde, etc. are used as reducing agents, and water-containing sodium, etc. are used as reducing agents.K in the present invention is electroless steel plating! Means for sampling liquid and dilution water at a fixed ratio, manual installation for stirring and mixing the liquid and dilution water to form a uniform casing,
Oeranime-) 1! Add the necessary bar 2 meters t-#J to liquid crawling @, and make sure to add Todoroki bar 2 meters! Electroless copper plating solution automatic analysis replenishment i! What can be done with i-den? That's all MS! As mentioned above, at Fumiaki, we add 1 ton of electroless polishing liquid to a child's daily dose of water (for example, tap water)! ri-foot 1II1 foot striations
Therefore, the lifetime of the measuring electrode is changed.In other words, in the present invention, a first-order effect is achieved on the concrete K. )
The response speed will be faster. Also, (3) The life of the electrode will be 2-5.
In the case of Baitobi Kusou Steel, (1) the thickness of the absorbance cell can be made thicker; (2) Effects such as being able to change the light source to weak tOK - 1JX ・Others include (1) Due to the battle: 2
Analysis of steel inside the controller #1 is eliminated, so operations such as p1 etching are no longer necessary.) The amount of Templiner liquid is reduced, so the amount of pumping is reduced and the margin is less than 90%. CaSO4・5HmO10g/J EDTA 30 g/l...12.0 HCHO (57%) 4mi/j NaCN! ! OW@/JGAFAC-R
E610 (L25111/JS degrees
72℃ Me-) area 1 dm'/j Total filtration liquid jl 2004 The liquid components S), CuSO4"5H*O
With regard to HCHO, the controller shown in Figure W43 automatically analyzes and supplements NaCN at a dilution rate of 115.
, EDTA, GAFAC-RE610 (surfactant)
While analyzing and replenishing by hand, we operated continuously for 24 hours.・The rtyt component was replenished once every two hours, and the RTYT component was also refilled once every two hours. In the 90th S@, 3 μ sampling tube 1.4 is a heat exchanger 7rX electroless plating, 8 is a reference integrated electrode,
9 is a steel colorimetric cell, 10 is an HCHO side outlet, 11 is an air vent L12 stile high speed stirrer, and 15 is a water tank.

コントローラによる組成のl11持楕IjLは±1θ%
以内で6カ、全く問題がなく、析出鋼の8II!を充分
なものか得らrL 7t oまた、コントローラ内部に
鋼の析出は全く見らtしなかりた・夾&N2 実施?l1IK示し九めつき敵全便用し、原液と1/2
0希釈の場合の州電離出力の変化を11!察した。その
鰯来、原液で0所電極の出力か基準1直から10%以上
ずれて24時間に2回出力aai*を行なわなけれにな
らなかったのに対し、V20希釈液では24時間内でに
田力IIII豊の必豊かなス〉為っ几0
The l11 ellipse IjL of the composition by the controller is ±1θ%
Within 6 points, no problems at all, 8II of precipitation steel! Also, no steel precipitation was observed inside the controller. l1IK shows the enemy's entire stool, and the undiluted solution and 1/2
Change in state ionization output in case of 0 dilution is 11! I guessed it. With the undiluted solution, the output of the 0-position electrode deviated by more than 10% from the standard 1 shift, and the output aai* had to be performed twice in 24 hours, whereas with the V20 diluted solution, the output at the 0-position electrode deviated by more than 10% from the standard 1st shift, whereas with the V20 diluted solution, the III.

【図面の簡単な説明】[Brief explanation of the drawing]

#G1図框従来従来動クントμm2の10ツク図、第2
図は従来の検出部のブロック図、第5@lr[本発明の
検出sOブ■ツク図である。 符号の説明 1 検出s         2 コントロール鄭5 
サンプリングポンプ  4 熱交換機5 補充液添加ポ
ンプ   6(II号編線7無電解りっき僧    8
F1(−参照一体化電檀9 鋼比色セル     10
  HCHO検出部11エア抜!       12 
 a16m攪拌機15 水タンク −3(
#G1 Diagram 10 diagram of conventional conventional Kundt μm2, 2nd
The figure is a block diagram of a conventional detection unit, and a block diagram of a detection system according to the present invention. Explanation of symbols 1 Detection s 2 Control 5
Sampling pump 4 Heat exchanger 5 Replenisher addition pump 6 (No. II braided wire 7 Electroless filter 8
F1 (-Reference integrated Dendan 9 Steel colorimetric cell 10
HCHO detection part 11 air bleed! 12
a16m stirrer 15 water tank-3 (

Claims (1)

【特許請求の範囲】 1、無電解め一5Il液のl1IiIitf:遜続的に
摺電しかり消gRされ九成分を連続的に補充する無電解
め9き液の自動管場方ff1K於て、l1lj! L 
! 5とする無電解め一51液tナングリングし、ス童
の一定術酋の水t′加えて希釈した後に均質な溶液とし
摺電を行うCとt*黴とする無電解め−5き液の自動管
層方法・ 2、希釈後と希釈前の鎖度比が1/2−1/20でめる
臀軒請求のa凶!1項記載の無電解めっき液の自動管層
方法・ 4 希釈水が水道水でめる籍許晴求の範囲馬1機又は第
2JJI記教の無電解めり自滅の自動管層方法◎
[Claims] 1. In an automatic tube station for an electroless liquid that is sequentially applied and erased and continuously refilled with nine components, l1lj! L
! 5 Electroless Meat 51 liquid t Nangling, add a certain amount of water t' to dilute it, make a homogeneous solution and apply electric current C and t* Electroless Meat 5 liquid Automatic pipe layering method 2. A disadvantage of the buttock claim where the chain ratio after dilution and before dilution is 1/2-1/20! Automatic tube layering method for electroless plating solution as described in Section 1 4. Automatic tube layering method for electroless plating self-destruction according to the range of 1 machine or 2nd JJI report where the dilution water is tap water ◎
JP2009082A 1982-02-10 1982-02-10 Automatic controlling method of electroless plating solution Pending JPS58141374A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009082A JPS58141374A (en) 1982-02-10 1982-02-10 Automatic controlling method of electroless plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009082A JPS58141374A (en) 1982-02-10 1982-02-10 Automatic controlling method of electroless plating solution

Publications (1)

Publication Number Publication Date
JPS58141374A true JPS58141374A (en) 1983-08-22

Family

ID=12017403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009082A Pending JPS58141374A (en) 1982-02-10 1982-02-10 Automatic controlling method of electroless plating solution

Country Status (1)

Country Link
JP (1) JPS58141374A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128572A (en) * 1979-03-21 1980-10-04 Siemens Ag Monitor apparatus for electroless copper precipitating bath

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128572A (en) * 1979-03-21 1980-10-04 Siemens Ag Monitor apparatus for electroless copper precipitating bath

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