JPS58138744A - Vinyl chloride resin composition - Google Patents

Abstract

PURPOSE:The titled composition that is made by adding a bisphenol type epoxy resin and a polyamide resin at a specific weight ratio, thus showing improved resistance to solvents without any adverse effects on its original good properties of the vinyl chloride resin. CONSTITUTION:100pts.wt. of a vinyl chloride resin are combined with 2-50, preferably 5-30pts.wt., in total, of an epoxy resin and a polyamide resin wherein the weight ratio of the epoxy resin to the polyamide resin is 80/20-30/70. As the vinyl cyloride resin, is preferably used a vinyl chloride paste resin produced by the emulsion polymerization or fine particle suspension polymerization. Nylon 6 or nylon 66 is preferred as a polyamide resin.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vinyl chloride resin composition from which molded articles with excellent solvent resistance can be produced.

PVC resin is used for pipes, gutters, and hoses.

Bottles, flooring, wall coverings, leather, toys, footwear.

It is used in a wide range of applications, including records, PVC steel sheets, automobile interior materials, and various industrial parts. However, molded products obtained from these vinyl chloride resins are generally used for gasoline,
benzene, toluene.

It swells when it comes into contact with solvents such as xylene, trichlene, and ketones. It is weak against so-called solvents, and its use has been limited to fields where organic solvent resistance is required. In order to improve such organic solvent resistance, polymeric plasticizers are used in combination.1 For example, a polymeric plasticizer is used in combination with vinyl chloride paste resin to create polyvinyl chloride paste. When prepared as a sol, the viscosity of the paste sol increases, and the viscosity changes greatly depending on the temperature, resulting in a paste sol that is extremely difficult to use. Furthermore, even when a polymeric plasticizer is used, it is difficult to obtain a molded article exhibiting sufficient solvent resistance. Furthermore, polymeric plasticizers are expensive and have the disadvantage of increasing the cost of molded products.

The inventor of the present invention has been intensively studying methods for improving organic solvent resistance without impairing the general properties of vinyl chloride resin, and found that a predetermined amount of bisphenol-type epoxy resin and polyamide resin was added to vinyl chloride resin. The present inventors have discovered that a composition added to the above material provides physical properties with extremely excellent solvent resistance, and has completed the present invention.

An object of the present invention is to provide a vinyl chloride resin composition that can produce molded articles with excellent organic solvent resistance. A vinyl chloride resin composition containing a total of λ to 5oxx parts of a type epoxy resin and a polyamide resin, and the epoxy resin and the polyamide resin are present in a weight ratio of ♂0/20 to 30/7θ. Achieved with things.

To explain the present invention in detail, the vinyl chloride resin used in the composition of the present invention is not particularly limited, but vinyl chloride or vinyl chloride and a comonomer copolymerizable therewith, such as ethylene, propylene, etc. , vinyl acetate, acrylic acid.

One example of the composition of the present invention is one produced by a suspension polymerization method, an emulsion polymerization method, or the like using a mixture of methyl acrylate, methacrylic acid, methyl methacrylate, styrene, etc. using a conventional method.

Particularly suitable is the use of vinyl chloride-based resins produced by emulsion polymerization or microsuspension polymerization. The paste resin may be blended with a vinyl chloride resin mixing resin having a particle size larger than that of the paste resin, if necessary, for the purpose of lowering the viscosity. When a paste resin is used as a plastisol by adding a plasticizer, it is preferable to use the resin for mixing within a range of SO weight % based on the total amount of resin components.

Examples of the bisphenol type epoxy resin used in the composition of the present invention include those having the structure of the following general formula CI), which are manufactured from bisphenol and epichlorohydrin.

In the formula, R and -R2 represent a hydrogen atom and a lower alkyl group, respectively, and R1 and R2 may be the same group.

n is O~! Indicates an integer of 2.

Bisphenol A type epoxy resins in which R1 and R1 are methyl groups are commonly used. Of course, the bisphenol type epoxy resin is not limited to that of general formula CI).

Polyamide resins which are another essential component of the composition of the present invention include 1, for example, polyamide 6 and polyamide/2 obtained by ring-opening polymerization of lactams such as ε-caprolactam and ω-laurolactam; ω-aminoundecanoic acid, etc. Polyamide ll obtained by polycondensation of aminocarboxylic acids: polyamide obtained by polycondensation of hexamethylene diamine, diamine such as adipic acid or sebacic acid, and dicarboxylic acid, <-,4゜Polyamide A-70, etc. Can be used.

Further, polyamide thorn, polyamide 7, polyamide t, polyamide thorn, etc. can also be used. Polyamide 6 or polyamide 6-6, which is widely used, is suitable from the viewpoint of easy availability.

In the composition of the present invention, in which a vinyl chloride resin is mixed with an epoxy resin and a polyamide resin, the mixing ratio of the epoxy resin and the polyamide resin to the vinyl chloride resin is such that the epoxy resin and polyamide resin in total amount! -20 parts by weight, preferably in the range of 5 to 30 parts by weight.

Moreover, the mixing ratio of the epoxy resin and the polyamide resin needs to be in the range of IO/20 to 30/70 by weight.

If the total mixing ratio of epoxy resin and polyamide resin to vinyl chloride resin is less than 2 parts by weight, organic solvent resistance cannot be imparted, and if it exceeds SO parts by weight, the vinyl chloride resin itself The characteristics of the paste sol are impaired, and when it is made into a paste sol, viscosity increases, etc., which impairs the molding and processing workability of the paste sol. Further, when the epoxy resin is used in an amount larger than the total weight of the polyamide resin, no improvement effect on the solvent is observed, and on the contrary, when the amount is less than 30%, problems such as deterioration of thermal stability occur. In the composition of the present invention, it is presumed that the bisphenol-type epoxy resin and polyamide resin probably react for some reason during the thermoforming process.

In the composition of the present invention, a commonly used plasticizer can be used in combination with the vinyl chloride resin.

When preparing paste sol from paste resin, addition of a plasticizer is essential. Plasticizers include diptyl phthalate and diheptyl phthalate.

Phthalate ester plasticizers such as dicoethylhexyl phthalate, diisodecyl phthalate, butyl lauryl phthalate, tridecyl phthalate, butyl benzyl phthalate, butyl phthalyl butyl glycolate, trimellitate tri-2-11: tylhexyl, etc. trimellitic acid ester plasticizers, tricresyl phosphate, phosphate ester plasticizers such as tri-2-ethylhexyl phosphate, tri-n-butyl citrate, dicoethylhexyl adipate, butyl benzyl adipate, dicoethylhexyl sebacate, acetyl Examples include fatty acid ester plasticizers such as methyl ricinoleate, which may be used singly or in combination of two or more. It goes without saying that the plasticizer is not limited to those mentioned above.

Therefore, the amount of plasticizer used is determined by the amount of plasticizer used when the purpose is a hard vinyl chloride resin molded product.
It is used in a range of 30 parts by weight or less based on the weight part, and in the case of preparing a paste sol from a paste resin, the range is 30 to 100 yen. It is used in an amount of 0 parts by weight, preferably 10 to 2θQ parts by weight.

The compositions of the invention may be used depending on the intended use of the composition.

In addition to the above essential ingredients, 1. For example, heat stabilizers, antioxidants,
Appropriate amounts of ultraviolet absorbing type, one colorant, one blowing agent, filler, etc. can be added, and these additives are usually used in combination. In addition, if one composition is plastisol,
A part of the plasticizer may be replaced with a diluent such as texanol isobutyrate or dodecylbenzene, and an organosol may be used.

The compositions of the present invention are manufactured and used as follows. For example, predetermined amounts of vinyl chloride resin, epoxy resin, polyamide resin, and other additives as necessary are added to a Banbury mixer, a V-type blender, a one-box mixer, a Henschel mixer, a kneader, a roll mill, etc. It is produced by putting it into a mixer such as a kneading extruder, mixing or kneading it uniformly, and then leaving it as is or making it into pellets. The composition is produced into a molded article using various molding machines such as an extruder, an injection molding machine, a calender roll mill, and a single-rotation molding machine.

When the composition is made into plastisol, paste resin, epoxy resin, polyamide resin, plasticizer, and other additives as necessary are placed in a high-speed stirring mixer, and the plastisol is produced by uniformly stirring and mixing. be done. The composition includes:
A desired molded product is manufactured by methods such as coating, dipping, slush molding, single rotation molding, and cast molding.

Whichever molding method is adopted, the molding conditions are in the temperature range of 130 to 300°C, preferably 160-2°C.
Suitably, it is carried out in a temperature range of 30°C. 130℃
If it is below, gelation and melting of the paste sol will be insufficient, and if it is above 300°C, it will cause deterioration of the vinyl chloride resin.

According to the composition of the present invention, by using a bisphenol-type epoxy resin and a polyamide resin in combination with a vinyl chloride resin, the properties of the vinyl chloride resin are impaired without using an expensive polymeric plasticizer. It is possible to improve the organic solvent resistance of the vinyl chloride resin without causing any damage. Accordingly, one composition of the present invention is gasoline, trichlene.

It has extremely high utility value as a molding material for flooring and wall materials in factories that handle toluene, ketones, etc., and as a material for printing soft PVC rolls.

Claims (1)

[Claims] (1) A vinyl chloride resin contains a total of 2 to 50 parts by weight of a bisphenol-type epoxy resin and a topolyamide resin based on 100 parts by weight of the resin, and the epoxy resin and polyamide resin have a weight ratio of IO/20. A vinyl chloride resin composition characterized by being present in a ratio of ~30/70