JPS58133933U - リ−ドフレ−ム搬送機構 - Google Patents

リ−ドフレ−ム搬送機構

Info

Publication number
JPS58133933U
JPS58133933U JP1982029701U JP2970182U JPS58133933U JP S58133933 U JPS58133933 U JP S58133933U JP 1982029701 U JP1982029701 U JP 1982029701U JP 2970182 U JP2970182 U JP 2970182U JP S58133933 U JPS58133933 U JP S58133933U
Authority
JP
Japan
Prior art keywords
lead frame
transport mechanism
frame transport
abstract
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982029701U
Other languages
English (en)
Inventor
柳原　臣吾
山口　耕二
白山　正海
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982029701U priority Critical patent/JPS58133933U/ja
Publication of JPS58133933U publication Critical patent/JPS58133933U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のリードフレームの平面図、第２図は従来
のリードフレーム搬送機構の説明用断面図、第３図は本
考案の一実施例によるリードフレーム搬送機構の説明用
断面図。 １．１’、１′、１″・・・・・・リードフレーム、１
゜２．３・・・・・・リード先端部、４・・・・・・タ
イバー、５・・・・・・リード、６・・・・・・枠体、
７・・・・・・スプロケットホール、８・・・・・・マ
ガジン、８′・・・・・・マガジン切欠部、９・・・・
・・レール、１０・・・・・・送りつめ、１１・・・・
・・磁石、１２・・・・・・ねじ、ａ・・・・・・磁石
とレールのスリット。

Claims (1)

    【実用新案登録請求の範囲】
  1. 鉄系のリードフレームを間欠移送するリードフレーム搬
    送機構において、リードフレームをガイドするレールに
    磁石をとりつけたことを特徴とするリードフレーム搬送
    機構。
JP1982029701U 1982-03-03 1982-03-03 リ−ドフレ−ム搬送機構 Pending JPS58133933U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982029701U JPS58133933U (ja) 1982-03-03 1982-03-03 リ−ドフレ−ム搬送機構

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982029701U JPS58133933U (ja) 1982-03-03 1982-03-03 リ−ドフレ−ム搬送機構

Publications (1)

Publication Number Publication Date
JPS58133933U true JPS58133933U (ja) 1983-09-09

Family

ID=30041477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982029701U Pending JPS58133933U (ja) 1982-03-03 1982-03-03 リ−ドフレ−ム搬送機構

Country Status (1)

Country Link
JP (1) JPS58133933U (ja)

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