JPS5813324B2 - Synthetic resin molding method and mold used therefor - Google Patents
Synthetic resin molding method and mold used thereforInfo
- Publication number
- JPS5813324B2 JPS5813324B2 JP4863479A JP4863479A JPS5813324B2 JP S5813324 B2 JPS5813324 B2 JP S5813324B2 JP 4863479 A JP4863479 A JP 4863479A JP 4863479 A JP4863479 A JP 4863479A JP S5813324 B2 JPS5813324 B2 JP S5813324B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- movable
- boss
- height
- movable mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
本発明は合成樹脂成型方法およびそれに使用する成型金
型に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a synthetic resin molding method and a mold used therein.
更に詳説すると、本発明は合成樹脂成型品のボス高さの
バラツキや成型金型の適否を一目で判断できる金型およ
びボスの成型方法を提供せんとするものである。More specifically, it is an object of the present invention to provide a mold and a method for molding a boss, which can determine at a glance variations in boss height of a synthetic resin molded product and the suitability of the mold.
従来、電子機器等のキャビネットやシャーシなどには成
型品のボスが数多く立っており、その高さ寸法がバラツ
キで高くなったり或は低くなったりする場合がある。BACKGROUND ART Conventionally, cabinets, chassis, etc. of electronic devices and the like have many molded bosses, and their heights may vary and may be higher or lower.
この原因として考えられることは成型品の金型の構造上
、何万ショットも成型する間に金型のピン等が曲がった
り、何かのはずみでピンがごくわずか動きその寸法が変
わる（即ち大きくなったり小さくなったりする）場合な
どがあげられる。Possible causes of this are the structure of the mold for the molded product, such as the pins of the mold bending during tens of thousands of shots, or the pins moving slightly due to some reason and changing their dimensions (i.e., significantly (increasing or decreasing in size).
従って成型品のボス高さを受入検査で十分チェックする
必要があり、最近のキャビネットやシャーシ等のように
ボスの数が士数本以上もあるものではボスの高さ測定が
非常にわずらわしい。Therefore, it is necessary to thoroughly check the boss height of the molded product during acceptance inspection, and measuring the boss height is extremely troublesome for products that have more than a few bosses, such as modern cabinets and chassis.
即ち簡単な目測では測定できず、正確な測定治具を必要
とする。That is, it cannot be measured by simple visual measurement and requires an accurate measurement jig.
本発明はこのような問題を解決し、ボス高さのバラツキ
を簡単な目測だけで可能にするものである。The present invention solves these problems and makes it possible to measure variations in boss height with simple visual measurement.
次に第１図と共に従来の金型および成型方法について説
明する。Next, a conventional mold and molding method will be explained with reference to FIG.
１は中央に丸孔（ビス止メ用）を有するボス、２は補強
用のリブである。1 is a boss having a round hole (for screwing) in the center, and 2 is a reinforcing rib.
従来、ボスの高さＨに第１図ｃ，ｄのようにバラツキΔ
Ｈが出た場合〔尚この原因は筒状移動金型７（後述）の
上下の故障による〕、目測でその変化を見るのは不可能
で一々その高さを測定器で測る必要があった。Conventionally, the height H of the boss has a variation Δ as shown in Fig. 1 c and d.
When H appeared [this was caused by a failure in the upper and lower parts of the cylindrical movable mold 7 (described later)], it was impossible to see the change visually, and it was necessary to measure the height each time with a measuring device. .
次に本発明について第２図、第３図および第４図と共に
説明する。Next, the present invention will be explained with reference to FIGS. 2, 3, and 4.
本発明においては、ボス１の高さＨと丁度同じ寸法を有
するボス高さ比較用基準リブ３をボス１の測面に一体成
型で設け、これによりボス１の高さを測定管理する。In the present invention, a reference rib 3 for boss height comparison having exactly the same dimension as the height H of the boss 1 is integrally molded on the measuring surface of the boss 1, and thereby the height of the boss 1 is measured and managed.
即ち一本発明においては、リブ１の高さは後述の筒状移
動金型７の上下の移動距離とは無関係となるように成型
するようにしているので、リブ１の高さは常に一定とな
る。That is, in the present invention, the height of the rib 1 is molded so that it is independent of the vertical movement distance of the cylindrical movable mold 7, which will be described later, so the height of the rib 1 is always constant. Become.
次に本発明の金型について第４図と共に説明する。Next, the mold of the present invention will be explained with reference to FIG.
４は固定側金型（キャビテイ側金型）、５は移動側金型
（コア側金側）、６は移動側金型５の押圧プレート、７
は移動側金型５に設けられた挿通孔８に挿通される筒状
移動金型、９は筒状移動金型の固定片、１０は筒状移動
金型７の固定片９を押圧プレート１１との間で挾持する
ための挟持プレート、１２は筒状移動金型７内に挿通さ
れる挿通ピン、１３は挿通ピン１２の固定片１４を挿通
ピンの押圧プレート１５との間で挾持するための挟持プ
レートである。4 is a fixed side mold (cavity side mold), 5 is a movable side mold (core side mold side), 6 is a press plate of the movable side mold 5, 7
1 is a cylindrical movable mold inserted into an insertion hole 8 provided in the movable mold 5, 9 is a fixed piece of the cylindrical movable mold, and 10 is a pressing plate 11 that presses the fixed piece 9 of the cylindrical movable mold 7. 12 is an insertion pin inserted into the cylindrical movable mold 7; 13 is a holding plate for holding the fixing piece 14 of the insertion pin 12 between the insertion pin and the pressing plate 15; This is a clamping plate.
１２′はボス１の内径を形成するための段付ピンである
。12' is a stepped pin for forming the inner diameter of the boss 1.
第４図は合成樹脂の成型状態を示す。FIG. 4 shows the molded state of the synthetic resin.
樹脂成型後、移動側金型５よりも上方にある押圧プレー
ト６，１１ ，１５、筒状移動金型７および挿通ピン１
２等を矢印とは逆に上方に少くともボス１の高さＨより
も高く固定側金型５から引き離す。After resin molding, the press plates 6, 11, 15, the cylindrical movable mold 7 and the insertion pin 1 located above the movable mold 5
2, etc., upwardly in the opposite direction of the arrow and separated from the stationary mold 5 at least higher than the height H of the boss 1.
その際、挾持プレート１３と押圧プレート１５とを上方
に移動させて挿通ピン１２を移動側金型５から上方に引
き上げると共に筒状移動金型７の挾持プレート１０およ
び押圧プレート１１と移動側金型５の押圧プレート６と
の間隔が図示の間隔よりも狭くなるよう挾持プレート１
０および押圧プレート１１を抑圧プレート６に対し矢印
向きに相対的に移動させ、筒状移動金型７の下方端にて
ボス１の上端縁を下方に押し下げ、ボス１を移動側金型
５から離脱させる。At that time, the clamping plate 13 and the pressing plate 15 are moved upward to pull the insertion pin 12 upward from the movable mold 5, and the clamping plate 10 and the pressing plate 11 of the cylindrical movable mold 7 and the movable mold are 5 and the pressing plate 6 so that the distance between the holding plate 1 and the pressing plate 6 is narrower than that shown in the figure.
0 and the pressing plate 11 relative to the suppressing plate 6 in the direction of the arrow, and push down the upper edge of the boss 1 at the lower end of the cylindrical movable mold 7 to remove the boss 1 from the movable mold 5. make them leave.
本発明においては、移動側金型５の内周壁にボス１の高
さと丁度同じ高さのボス高さ比較用基準リブ３の成型用
凹溝１６が設けてあり、移動側金型５は常に固定側金型
４と当接しており、筒状移動金型７の移動距離とは全く
無関係である。In the present invention, a concave groove 16 for molding the reference rib 3 for boss height comparison, which is exactly the same height as the height of the boss 1, is provided on the inner circumferential wall of the movable mold 5, and the movable mold 5 is always It is in contact with the stationary mold 4 and is completely unrelated to the moving distance of the cylindrical movable mold 7.
従って挿通ピン１２の移動のバラツキにより、ボスの高
さＨが第３図ｂ，ｃの如くバラツくと、段差ΔＨができ
るため、一目でボス高さの良否を判定できる。Therefore, if the height H of the boss varies as shown in FIGS. 3b and 3c due to variations in the movement of the insertion pin 12, a step ΔH is created, so that it is possible to judge at a glance whether the boss height is good or bad.
また、金型修正の際にも、段差ΔＨを測定することによ
りどれだけボス高さが変化したかが判るので、それに合
わせて金型を修正できる。Furthermore, when modifying the mold, it is possible to determine how much the boss height has changed by measuring the step difference ΔH, so the mold can be modified accordingly.
第１図は従来の成型方法を示す図面、第２図および第３
図は本発明の合成樹脂成型方法を示す図面、第４図は本
発明の合成樹脂成型金型を示す図面である。
１・・・・・・ボス、２・・・・・・補強用リブ、３・
・・・・・ボス高さ比較用基準リブ、４・・・・・・固
定側金型、５・・・・・・移動側金型、６，１１ ，１
５・・・・・・押圧プレート、７・・・・・・筒状移動
金型、８・・・・・・挿通孔、１０，１３・・・・・・
挾持プレート、１２・・・・・・挿通ピン。Figure 1 is a drawing showing the conventional molding method, Figures 2 and 3
The figure is a drawing showing the synthetic resin molding method of the present invention, and FIG. 4 is a drawing showing the synthetic resin molding die of the present invention. 1...Boss, 2...Reinforcement rib, 3.
...Standard rib for boss height comparison, 4...Fixed side mold, 5...Moving side mold, 6, 11, 1
5... Pressing plate, 7... Cylindrical moving mold, 8... Insertion hole, 10, 13...
Clamping plate, 12...Insertion pin.
Claims (1)
移動側金型に設けられた挿通孔に挿通され且つ該移動側
金型とは無関係に移動する移動区間を有する筒状移動金
型と、該移動側金型内に挿通される挿通ピンとを備え、
前記移動側金型の内周壁に標準ボス高さと同じ高さを有
する比較用基準リブの成型用凹溝を設けた合成樹脂成型
金型によりボスおよび該ボスの高さ比較用基準リブを成
型することを特徴とする合成樹脂成型方法。 ２ 固定側金型と、該金型に当接する移動側金型と、該
移動側金型に設けられた挿通孔に挿通され且つ該移動側
金型とは無関係に移動する移動区間を有する筒状移動側
金型と、該移動側金型内に挿通される挿通ピンとを備え
、前記移動側金型の内周壁に標準ボス高さと同じ高さを
有する比較用基準リブの成型用凹溝を設けることを特徴
とする合成樹脂成型金型。[Claims] 1. A stationary mold, a movable mold that abuts the mold, and a mold that is inserted into an insertion hole provided in the movable mold and moves independently of the movable mold. a cylindrical movable mold having a movable section, and an insertion pin inserted into the movable mold,
A boss and a reference rib for height comparison of the boss are molded using a synthetic resin molding mold provided with a concave groove for molding a reference rib for comparison having the same height as the standard boss height on the inner peripheral wall of the movable mold. A synthetic resin molding method characterized by: 2. A cylinder having a fixed mold, a movable mold that comes into contact with the mold, and a moving section that is inserted into an insertion hole provided in the movable mold and moves independently of the movable mold. A movable side mold having a shape, and an insertion pin inserted into the movable side mold, and a concave groove for molding a reference rib for comparison having the same height as a standard boss height on an inner peripheral wall of the movable side mold. A synthetic resin molding die characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4863479A JPS5813324B2 (en) | 1979-04-19 | 1979-04-19 | Synthetic resin molding method and mold used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4863479A JPS5813324B2 (en) | 1979-04-19 | 1979-04-19 | Synthetic resin molding method and mold used therefor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55139236A JPS55139236A (en) | 1980-10-30 |
| JPS5813324B2 true JPS5813324B2 (en) | 1983-03-12 |
Family
ID=12808797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4863479A Expired JPS5813324B2 (en) | 1979-04-19 | 1979-04-19 | Synthetic resin molding method and mold used therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5813324B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890799A (en) * | 1982-11-01 | 1983-05-30 | 三洋電機株式会社 | Synthetic resin cabinet for electronic device |
-
1979
- 1979-04-19 JP JP4863479A patent/JPS5813324B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55139236A (en) | 1980-10-30 |
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