JPS58130583A - Manufacture of light emitting diode lamp - Google Patents
Manufacture of light emitting diode lampInfo
- Publication number
- JPS58130583A JPS58130583A JP58001534A JP153483A JPS58130583A JP S58130583 A JPS58130583 A JP S58130583A JP 58001534 A JP58001534 A JP 58001534A JP 153483 A JP153483 A JP 153483A JP S58130583 A JPS58130583 A JP S58130583A
- Authority
- JP
- Japan
- Prior art keywords
- emitting diode
- conducting wires
- light emitting
- tape
- wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 4
- 239000000057 synthetic resin Substances 0.000 claims abstract description 4
- 239000012212 insulator Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000238557 Decapoda Species 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は非常に小型の発光ダイオードランプの製造方法
に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing very compact light emitting diode lamps.
第１図は従来の小型の発光ダイオードランプの一部を示
す図である。ｊ１１図（ａ）は薄い金属板を工噌チング
加工によって形成された金属フレーム（１）を示す斜視
図であり、一対の対向したリード線（２）（３１が形成
されている。第１５０（ｂ）は第１図（８）のリード線
（２１（３）間にＰＮ接合面（４）に平行な面に電極（
５１ｆ６）を有する発光ダイオ−トチリプ（７）をその
電極（５）（６１がリード線＋２１（３１に接触するよ
うに挿入した平面図である。第１図（Ｃ）（ｄ）は第１
図（ｂｌのＡ−Ａ断面図である。FIG. 1 is a diagram showing a part of a conventional small-sized light emitting diode lamp. Figure j11 (a) is a perspective view showing a metal frame (1) formed by machining a thin metal plate, and a pair of opposing lead wires (2) (31) are formed.No. 150 ( b) is the lead wire (21 (3) in Figure 1 (8) between which the electrode (
51f6) is inserted so that its electrode (5) (61) contacts the lead wire +21 (31).
Figure (This is a sectional view taken along line A-A of bl.
第１図に於いて、発光ダイオ−トチリプ（７）の厚さ、
たて、横の寸法は約０．５ Ｘ Ｉ Ｘ Ｏ，３ミリメ
ートルのもので、これに対してリード線＋２１＋３１の
厚さも０．３ミリメートル程度の薄いものを使用するの
で、金属フレーム（１）を薄くシ、対向するリード線（
２）（３１の間を最小０．５ミリメートル以下としなけ
ればならず、金属フレーム（１）の加工か難しいだけで
なく、歩留りが悪い。さらに発光ダイオ−トチリプ（７
）をリード線（２＋ （３１の間に挿入する際には、リ
ード線＋２１（３１が細長く脆弱なので、対向面が不整
いとなって第１図Ｔｄ）となりやすく、チ噌プ（７）を
第１図（Ｃ）の図に示す状態に挾持する事は難しい。リ
ード線（２１（３１が多少でもずれると、発光ダイオー
ドチップ（７）が長方形であるため接触が小さくなり、
蝦ぺ−スト等の導電接着網やインジウム等の半田金属に
よって電気的、機械的に固着する事が離しい。In Figure 1, the thickness of the light emitting diode chip (7),
The vertical and horizontal dimensions are approximately 0.5 X I Thinly connect the opposing lead wires (
2) (The distance between 31 must be at least 0.5 mm or less, which not only makes it difficult to process the metal frame (1) but also has a low yield. Furthermore, the distance between the light emitting diode chips (7
) When inserting the lead wire (2 + (31) between the lead wire +21 (31 is long and thin, the facing surface is likely to be uneven and Td in Figure 1), and the tip (7) It is difficult to hold it in the state shown in Figure 1 (C).If the lead wires (21 (31) are even slightly shifted, the contact will be small because the light emitting diode chip (7) is rectangular.
Electrically and mechanically fixed with a conductive adhesive network such as shrimp paste or solder metal such as indium.
第２図は本発明の実施例を示す図で、第２図件）はテー
プ状電線（８）を示す斜視図である。テープ状電線（８
）は多数の細い導電線（９）をテープ状の絶縁体ααに
よって保持しているもので、一般に基板間のコネクター
として用いられているものである。図に於けるテープ状
電線（８）は部分的にテープ状の絶縁体ααを設けてい
るもので、使用番こ際して点線の位置で切断する。第２
図（ｂ）は第１図と同様に一対の導電線（９）間に発光
ダイオ−トチ叩プ（７）をその電極＋５１＋６１か接触
するように挿入したものである。テープ状の絶縁体αＯ
が導電線（９）を強固に保持しているので、発光ダイオ
−トチ呼プ（７）を挿入する前に導電線（９）を一部折
曲げて導電線（９）間をせまくしてもそのままの状態が
維持されるので、発光ダイオ−トチリプ（７）は確実に
挾持される。また導電線（９）の断面が円形であるため
導電線（９）が多少ずれても間隔さえ適切であれば常に
第２図（Ｃ１と同一構成になるので、導電接着剤または
半田金属で固着する作業が容易であり、固着面積αυが
広くとれる。電気的、機械的番こ固着した後に発光ダイ
オ−トチ・リプ（７）及び発光ダイオ−トチリプ（７）
を挾持している導電線（９）の一部分を透明な合成樹脂
でモールドする。FIG. 2 is a diagram showing an embodiment of the present invention, and FIG. 2 is a perspective view showing a tape-shaped electric wire (8). Tape-shaped electric wire (8
) has a large number of thin conductive wires (9) held by a tape-shaped insulator αα, and is generally used as a connector between boards. The tape-shaped electric wire (8) in the figure is partially provided with a tape-shaped insulator αα, and is cut at the dotted line position when used. Second
In FIG. 1(b), a light emitting diode tip (7) is inserted between a pair of conductive wires (9) so that the electrodes +51+61 are in contact with each other, as in FIG. 1. Tape-shaped insulator αO
holds the conductive wires (9) firmly, so before inserting the light emitting diode chip (7), bend some of the conductive wires (9) to narrow the gap between the conductive wires (9). Since the light emitting diode tip (7) is maintained in the same state, the light emitting diode tip (7) is securely held. In addition, since the cross section of the conductive wire (9) is circular, even if the conductive wire (9) is slightly misaligned, as long as the spacing is appropriate, it will always have the same configuration as Figure 2 (C1), so it can be fixed with conductive adhesive or solder metal. The work is easy and the fixing area αυ can be widened.After the electrical and mechanical fixing, the light emitting diode chip lip (7) and the light emitting diode chip lip (7) can be attached.
A part of the conductive wire (9) holding the is molded with transparent synthetic resin.
モールドする場合にはテープ状絶縁体ααによって連結
されている多数組の発光ダイオ−トチ・リプ（７）と導
電線（９）との組合せを同時にエポキシ樹脂材番こ浸漬
する事によって多数組のランプを形成することができる
。モールド後もテープ状の絶縁体！１０）Ｇζよって多
数のランプが連結されているので点灯チェｖりや保管及
び運搬に非常に便利である。使用特番こはテープ状の絶
縁体叫を各ランプ間で切断して用いる事ができ、な詔各
ランプの一対の４電線（９）は絶縁体叫によって一体化
されているので。In the case of molding, multiple sets of light emitting diode strips (7) and conductive wires (9) connected by tape-shaped insulators αα are simultaneously dipped in epoxy resin. A lamp can be formed. Tape-like insulation even after molding! 10) Since a large number of lamps are connected by Gζ, it is very convenient for checking lighting, storing and transporting. This special code can be used by cutting the tape-shaped insulator between each lamp, since the pair of 4 electric wires (9) of each lamp are integrated by the insulator.
従来のランプの根元に於ける短絡及び断線はなくなる。Short circuits and breaks at the base of conventional lamps are eliminated.
またテープ状の絶縁体αＣの一片に穴又は切欠きを予め
設けておく事によってランプをネジ等で固定する場合の
取付具とする事ができる。Further, by providing a hole or notch in advance in one piece of the tape-shaped insulator αC, it can be used as a fixture for fixing a lamp with a screw or the like.
上記例では導電線（９）は２本組でテープ状の絶縁体に
よって保持されているが、各導電線（９）を均一な間隔
で構成しても良いし、１本毎に太さを変えたり、一対の
導゛鑞線（９）の一方のテープ状の絶縁体頭上にマーク
をつける事によって導電線（９）の極性を示すことがで
きる。In the above example, the conductive wires (9) are held in pairs by a tape-like insulator, but the conductive wires (9) may be configured with uniform spacing, or each conductive wire (9) may have a different thickness. The polarity of the conductive wire (9) can be indicated by changing the conductive wire (9) or by placing a mark on the tape-like insulator head of one of the pair of conductive wires (9).
また上記例では導電線（９）間と発光ダイオ−トチリプ
（７）の厚さとが異なっているが、同一寸法のテープ状
電線を形成する事によってより簡便にランプを製造する
ことができる。Further, in the above example, the thickness between the conductive wires (9) and the thickness of the light emitting diode tip (7) are different, but by forming tape-shaped wires of the same size, the lamp can be manufactured more easily.
上述の如く、本発明は少なくとも２本の導電線をテープ
状の絶縁体によって保持してテープ状電線とし、ＰＮ接
合面に平行な面に電極を有して上記テープ状電線の一対
の導電線間にその電極面が接触するように発光ダイオ−
トチ・リプを挿入し、電極と導電線とを電気的ｉＣ接続
した後、発光ダイオ−トチリプ及び発光ダイオ−トチリ
プを挾持している＃ｌ電線の部分を透明な合成樹脂体で
被覆してなるもので、製透しやすいだけでなく、電気的
機械的に安定したものが得られる。As described above, the present invention provides a tape-shaped electrical wire by holding at least two conductive wires with a tape-shaped insulator, and a pair of electrically conductive wires of the tape-shaped electrical wire having an electrode on a plane parallel to the PN junction surface. Place the light emitting diode so that its electrode surfaces are in contact with each other.
After inserting the conker lip and making an electrical IC connection between the electrode and the conductive wire, the light emitting diode chip and the part of the #l electric wire holding the light emitting diode chip are covered with a transparent synthetic resin body. It is not only easy to make, but also electrically and mechanically stable.
第１図は従来例を示す図、第２図は本発明の実施例に係
る発光ダイオードランプを示す図である。
図に於いて、（７）は発光ダイオ−トチリプ、（８）は
ｉ−プ状電線、（９）は導電線、叫はテープ状の絶縁体
である。
外１名FIG. 1 is a diagram showing a conventional example, and FIG. 2 is a diagram showing a light emitting diode lamp according to an embodiment of the present invention. In the figure, (7) is a light emitting diode chip, (8) is an I-shaped electric wire, (9) is a conductive wire, and (9) is a tape-like insulator. 1 other person
Claims (1)
て保持してテープ状電線とし、ＰＮ接合面に平行な面に
電極を有して上記テープ状電線の一対の導電線間にその
電極面が接触するように発光ダイオ−トチリプを挿入し
、電極と導電線とを電気的に接続した後、発光ダイオ−
トチリプ及び発光ダイオ−トチリプを挾持している導電
線の部分を透明な合成樹脂体で被覆する事を特徴とする
発光ダイオードランプの製造方法。1) At least two conductive wires are held by a tape-shaped insulator to form a tape-shaped electric wire, and an electrode is provided on a plane parallel to the PN junction surface, and the electrode surface is placed between the pair of conductive wires of the tape-shaped electric wire. Insert the light-emitting diode chip so that they are in contact with each other, and after electrically connecting the electrode and the conductive wire, insert the light-emitting diode
1. A method for manufacturing a light emitting diode lamp, characterized in that a light emitting diode lamp and a portion of a conductive wire holding the light emitting diode tip are covered with a transparent synthetic resin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58001534A JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58001534A JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58130583A true JPS58130583A (en) | 1983-08-04 |
| JPS5847876B2 JPS5847876B2 (en) | 1983-10-25 |
Family
ID=11504182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58001534A Expired JPS5847876B2 (en) | 1983-01-07 | 1983-01-07 | Manufacturing method of light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5847876B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100090332A1 (en) * | 2008-10-09 | 2010-04-15 | Joinset Co., Ltd. | Ceramic chip assembly |
-
1983
- 1983-01-07 JP JP58001534A patent/JPS5847876B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100090332A1 (en) * | 2008-10-09 | 2010-04-15 | Joinset Co., Ltd. | Ceramic chip assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5847876B2 (en) | 1983-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3267045B2 (en) | LED element | |
| ATE65346T1 (en) | PLATED CONTACT ELEMENT. | |
| US5438481A (en) | Molded-in lead frames | |
| JPH06177435A (en) | Light-emitting diode and its mounting method | |
| JPH0335782B2 (en) | ||
| SE8603128L (en) | SOCKET FOR CHIPS WITHOUT CONNECTING WIRES | |
| JPH0218972A (en) | Right angle light emitting diode assembly having snap retaining characteristics | |
| US4340266A (en) | Connector system | |
| JP2565091B2 (en) | Semiconductor device and manufacturing method thereof | |
| US4780098A (en) | Conductive lead arrangement | |
| IT1173777B (en) | INTEGRATED CIRCUIT MODULE AND PROCEDURE FOR MANUFACTURING IT | |
| US4087150A (en) | Quick connect wiring system for breadboard circuits | |
| US3558994A (en) | Electrical component supporting structure with improved mounting and electrical connector means | |
| US3668604A (en) | Strip-type dip receptacle | |
| US3641401A (en) | Leadless ceramic package for integrated circuits | |
| JPS58130583A (en) | Manufacture of light emitting diode lamp | |
| US3843951A (en) | Connection of an electrical component to a flexible circuit | |
| JP2000196153A (en) | Chip electronic component and manufacture thereof | |
| JPS58218149A (en) | Lead frame for diode sealed with resin | |
| JPH11144505A (en) | Rear combination lamp | |
| JPH09214002A (en) | Surface packaged led device and its fabrication method | |
| JPH0236241Y2 (en) | ||
| GB1518397A (en) | Light emitting diode mounting | |
| KR890004203B1 (en) | Oscillator manufacturing method of it | |
| JPS5920764Y2 (en) | connection device |