JP3267045B2 - LED element - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
About the LED element which is fixed to the sheet of the support member.

[0002]

2. Description of the Related Art An LED for fixing an LED chip having a pair of electrodes on the same surface to a supporting member is disclosed in Japanese Patent Laid-Open No. 4-10671.
No., published in Japanese Unexamined Patent Publication No. LED described in this publication
Is shown in FIG. In this LED, since electrodes are provided on the back surface of the LED chip 1, there is no need to provide electrodes and lead wires on the light emitting surface. For this reason, there is a feature that the light emission of the LED chip can be effectively used and the light can be brightened without the light emission of the LED chip electrode or the lead wire. LED with this structure
Has a structure in which leads insulated from each other are connected to electrodes provided on the same surface. In the LED of FIG. 1, the support member is divided into two to form an electrode member 3 in order to insulate and connect the two electrodes 2 of the LED chip 1 to each other. The electrode member 3 is made of metal and has an upper end connected to the electrode 2 on the lower surface of the LED chip 1. The two electrode members 3 need to be insulated from each other. This is because the lead wire 3 is short-circuited when contact is made. For this reason, the two electrode members 3 are arranged so that there is a gap.

Further, Japanese Patent Laid-Open Publication No. Hei 5-21846 discloses an LED in which an LED chip having a pair of electrodes on the same surface is fixed to a support member. The LED described in this publication is shown in FIG. In this LED, a pair of electrodes 2 provided on the lower surface of an LED chip 1 are connected to an electrode member 3 via a conductive brazing material 4. The electrode members 3 are made of metal, and are disposed apart from each other so as not to cause a short circuit.

[0004]

As shown in FIGS. 1 and 2, it is difficult to efficiently produce a large number of LEDs in which the electrode 2 of the LED chip 1 is connected to the metal electrode member 3. 2
This is because the electrode members 3 are accurately separated and supported at a fixed interval, and the LED chips 1 are connected one by one to manufacture. Further, the LED chip 1 is
Is difficult to accurately connect the electrode 2 of the small LED chip 1 to the electrode member 3. This is because one LED chip 1 is connected to the two separated electrode members 3. When the relative positions of the two electrode members 3 are shifted,
The electrodes 2 of the LED chip 1 cannot be connected accurately.

Further, an LED having a structure shown in FIGS. 1 and 2
Is difficult to make the LED chip 1 small. This is because it is difficult for the small LED chip 1 to accurately connect the electrode 2 to the electrode member 3. In order to connect the small LED chip 1 to the electrode member 3, it is necessary to bring the two divided electrode members 3 closer to each other. When the two electrode members 3 are brought extremely close to each other, the electrode members 3 come into contact with each other and short-circuit is likely to occur. For this reason, it is difficult to make the interval between the electrode members 3 extremely narrow, and it is difficult to make the LED chip 1 small. The large LED chip 1 reduces the number of products manufactured from one wafer and increases the component cost.

The inventor prototyped an LED device having a structure shown in FIG. 3 in order to simultaneously fix a large number of LED chips to a supporting member. In this LED element, the support member 5 is formed of an insulating member 6 such as alumina. The metal electrode terminals 7 are fixed to the support member 5 as the insulating member 6 at regular intervals apart from each other. Since the LED element having this structure fixes the pair of electrode terminals 7 to the support member 5, the relative positions of the two electrode terminals 7 can be manufactured with extremely high precision. Further, since the two electrode terminals 7 do not move relative to each other, there is a feature that the two electrode terminals 7 can be prevented from being separated from the electrodes 2 of the connected LED chip 1.

The LED element having this structure is an LED chip 1
Is an ideal structure for fixing the LED chips 1 one by one at fixed positions of the support member 5, but when fixing a large number of LED chips 1 to the support member 5, all the LED chips 1 are fixed so as not to be displaced. Difficult. In particular, when a large number of LED chips 1 are pressed against the support member 5 and fixed, there is a disadvantage that the position is easily shifted. Another problem is that it is difficult to efficiently mass-produce a large number of LED chips because the LED chips are accurately arranged and fixed to a supporting member.

If the position of the LED chip 1 fixed to the support member 5 shifts, the electrode 2 of the LED chip 1 cannot be accurately connected to the electrode terminal 7. Further, there is also a problem that the conductive brazing material 4 connecting the electrode 2 of the LED chip 1 to the electrode terminal 7 causes a bridge to short-circuit the electrode terminal 7.

To prevent short-circuiting of the conductive brazing material, the gap between the electrode terminals may be widened. However, if this space is widened, the space between the electrodes of the LED chip needs to be widened, and the LED chip can be downsized. Disappears. For this reason, the LED element having this structure has a drawback in that a large number of small LED chips cannot be efficiently and inexpensively mass-produced by fixing many small LED chips to the supporting member.

The present invention has been developed with the aim of further solving this drawback. An important object of the present invention is to accurately fix a large number of small LED chips to a support member,
Short of the electrode terminals is effectively prevented, to provide a LED element which can efficiently at low cost mass production.

[0011]

The LED element of the present invention comprises:
The following structure is provided to achieve the above object. LE
The D element includes an LED chip 1 having a pair of electrodes 2 on the same surface, and a support member 5 fixing a plurality of LED chips 1 in a fixed arrangement. The supporting member 5 includes an insulating member 6
And a pair of electrode terminals 7 fixed to the insulating member 6 close to each other. Electrode terminal 7 is made of conductive brazing material 4
Is connected to the electrode 2 of the LED chip 1 via the. Further, the support member 5 has a plurality of positioning fitting portions 8 into which the respective LED chips 1 are fitted and arranged at predetermined positions. The electrode terminal 7 is disposed at the bottom of the position fitting portion 8. The LED chip 1 is inserted into the positioning fitting portion 8
And the electrode 2 of the LED chip 1 is connected to the conductive brazing material 4.
Is connected to the electrode terminal 7 via the.

Further, in the LED element of the present invention, preferably, the LED chip 1 is a non-circular LED chip 1 having a non-circular outer shape, and the positioning fitting portion 8 of the supporting member 5 into which the LED chip 1 is fitted. Also has a non-circular position fitting portion 8 having a non-circular inner shape.

[0013]

[0014]

FIG. 4 is a sectional view showing a preferred embodiment of the LED element according to the present invention.
The ED chip 1 is fixed. The supporting member 5 is an insulating member 6
The pair of electrode terminals 7 are fixed to the insulating member 6 so as to approach each other. Many LEs
The D chips 1 are regularly arranged in a fixed arrangement and fixed to the support member 5. The support member 5 includes the LED chip 1
In order to arrange the LED chips at the correct positions, a positioning fitting portion 8 into which the LED chip 1 is fitted is provided. The position fitting portion 8
Here, the shape and the size are such that the LED chip 1 can be fitted therein. The LED chip 1 to be fitted into the positioning fitting portion 8
The electrode 2 is located at the electrode terminal 7 of the support member 5. Therefore, in the LED element shown in FIG. 4, a large number of LED chips 1 are fitted into the respective positioning fitting portions 8, and in this state, the LED chips 1 are pressed against the support member 5, and all the LE chips
The electrode 2 of the D chip 1 can be reliably connected to the electrode terminal 7 of the support member 5 for manufacturing.

When a large number of LED chips 1 are fitted into the positioning fitting portions 8 of the support member 5 and the electrodes 2 are connected to the electrode terminals 7, the plurality of LED chips 1 can be pressed by the rubber-like elastic member 9. it can. When a large number of LED chips 1 are pressed by the rubber-like elastic member 9, the LED chips 1 are fitted into the positioning fitting portions 8 to prevent displacement. Therefore, the LED element according to the present invention has a large number of
The LED chip 1 can be connected to the support member 5 by pressing the chip 1. At this time, many LED chips 1 are located at correct positions and are regularly arranged. For this reason, L of the present invention
The ED element has a feature that a large number of small LED chips 1 can be easily, easily, efficiently mass-produced with a high yield.

The LED device manufactured in this manner is
Many LED chips 1 are fixed to one support member 5. Also, as shown by the arrows in FIG. 4, cutting can be performed between the LED chips 1 to separate them into a large number of LEDs. 1
LE in which many LED chips 1 are fixed to a single supporting member 5
The method of manufacturing a large number of LEDs by cutting the D element can manufacture the LEDs extremely efficiently as compared with the conventional method of manufacturing LEDs one by one.

In the LED device having the structure shown in FIG. 4, the LED chip 1 is fixed to the supporting member 5 in the following steps. (1) A conductive brazing material 4 that is a low melting point metal is attached to the electrode 2 of the LED chip 1 and the electrode terminal 7 of the support member 5. (2) The LED chips 1 are fitted into a large number of positioning fitting portions 8 provided regularly on the support member 5. (3) A large number of LED chips 1 fitted into the positioning fitting portion 8
Is pressed by a rubber-like elastic member 9. LE pressed
Since the D chip 1 is fitted into the position fitting portion 8,
There is no displacement. (4) Heat while pressing a large number of LED chips 1,
The electrode 2 of the LED chip 1 is connected to the electrode terminal 7 by melting the conductive brazing material 4.

In order to separate the LED into a large number of LEDs, the support member 5 is cut in the middle of the LED chip 1 as shown by an arrow in FIG. 4 and a chain line in FIG.

[0019]

Embodiments of the present invention will be described below with reference to the drawings. However, embodiments described below are intended to illustrate the LED elements for embodying the technical idea of the present invention, the present invention does not specify the LED elements to those of the lower SL.

Further, in this specification, in order to make it easy to understand the claims, the numbers corresponding to the members shown in the embodiments will be referred to as "claims", "actions", and "actions". In the column of "Means for solving the problem". However, the members shown in the claims are
It is by no means specific to the members of the embodiment.

The LED elements shown in FIG. 4 and FIG.
An ED chip 1 and a support member 5 for fixing a plurality of LED chips 1 in a fixed arrangement are provided.

The LED chip 1 shown in FIG. 4 has a pair of electrodes 2 on the lower surface, and has a structure that emits light upward when the electrodes 2 are energized. The LED chip 1 includes, for example, GaInN
The system uses a blue light emitting LED. This LED chip 1
In this method, gold is vapor-deposited on a wafer of a GaInN-based blue light-emitting LED by electron beam vapor deposition, a pattern is formed by a lift-off technique, and this is cut into chips. The LED chip 1 is a square having a side of 350 μm square. Instead of the blue light emitting LED, any LED chip 1 having an electrode 2 on the same surface and emitting light on the surface opposite to the electrode surface can be used for the LED chip 1.

The support member 5 has a structure in which a metal electrode terminal 7 is fixed to an insulating member 6. The electrode terminals 7 are fixed to the insulating member 6 close to each other. The electrode terminal 7 is electrically connected to the electrode 2 of the LED chip 1 via the conductive brazing material 4. The conductive brazing material 4 is any brazing material that can electrically connect the electrode 2 of the LED chip 1 to the electrode terminal 7,
For example, a low melting point metal such as solder, or a metal paste obtained by kneading a conductive agent and an adhesive can be used.

The insulating member 6 is made of alumina, silica, or a heat-resistant plastic plate. Alumina insulation member 6
Has ideal properties because it is heat-resistant, can be mass-produced at low cost, and has sufficient strength. The metal electrode terminal 7 penetrates the insulating member 6 vertically and is fixed. The electrode terminal 7 is connected to the electrode 2 of the LED chip 1 at a portion exposed on the upper surface of the insulating member 6.

The insulating member 6 serving as the supporting member 5 includes a plurality of L
In order to cleanly arrange and fix the ED chips 1 in a fixed arrangement, a positioning fitting portion 8 is provided which is opened on the upper surface. LE
The D chip 1 is accurately positioned by being fitted into the position fitting portion 8 of the insulating member 6. The position fitting portion 8 is 350 μm
□ is set to 400 μm so that the LED chip 1 can be accurately positioned and fitted. The inner shape of the positioning fitting portion 8 is designed to be slightly larger than the outer shape of the LED chip 1 so that the LED chip 1 can be fitted without displacement. For example, the gap between the outer periphery of the LED chip 1 and the inner periphery of the position fitting portion 8 is 10 to 200 μm, preferably 20 μm.
１５０150 μm, more preferably 30-100 μm. When the position fitting portion 8 is reduced, L
The ED chip 1 can be accurately fitted without displacement. However,
If the positioning fitting portion 8 is too small, there is a disadvantage that it takes time to fit the LED chip 1 into the positioning fitting portion 8. The inner shape of the positioning insertion part 8 is designed so that the LED chip 1 can be inserted efficiently and the position does not shift. The positioning fitting portion 8 is designed to have a depth that allows the LED chip 1 to be fitted and disposed at a fixed position. The preferred depth of the positioning fitting portion 8 is slightly deeper than the thickness of the LED chip 1 or slightly shallower than the thickness of the LED chip 1.

In the support member 5 shown in FIG. 4, a concave portion is formed in the insulating member 6 to form a positioning fitting portion 8. The positioning fitting portion 8 can have any shape that allows the LED chip 1 to be fitted and disposed at a fixed position. For example, although not shown, a convex portion may be formed around the LED chip, and a positioning fitting portion may be formed inside the convex portion.

As shown in FIG. 4 and FIG.
The LED element having a square shape with the positioning fitting portion 8 is LE
There is a feature that the D chip 1 can be arranged in an accurate position at an accurate position and fixed to the support member 5. Square positioning insert 8
FIGS. 6 to 8 show a state in which the square LED chip 1 is fitted into the LED chip 1. LED chip 1 shown in these figures
Is fixed to the support member 5 in an accurate posture without rotating at the position fitting portion 8 because of the rectangular shape.

Further, as shown in FIGS. 9 and 10, the rectangular LED chip 1 can be fitted into the elliptical positioning fitting portion 8 so that the posture of the LED chip 1 can be made accurate and fixed. As described above, when the LED chip 1 and the positioning fitting portion 8 are formed in a non-circular shape so that the LED chip 1 cannot be rotated inside the positioning fitting portion 8, the posture of the LED chip 1 is specified and supported. There is a feature that it can be fixed to the member 5.

When the LED chip 1 is inserted into the positioning insertion portion 8, the electrode terminals 7 are arranged at the bottom of the positioning insertion portion 8 so that the electrodes 2 of the LED chip 1 are connected to the electrode terminals 7. Fixed to the insulating member 6. A reservoir for the conductive brazing material 4 is provided between the pair of electrode terminals 7. As shown in FIG. 4, when the electrode 2 of the LED chip 1 is connected to the electrode terminal 7, the reservoir recess allows the conductive brazing material 4 to flow therethrough.
Short-circuit of the conductive brazing material 4 is prevented. The insulating member 6 of FIG. 4 is used to more reliably prevent a short circuit.
A partition is provided at the bottom of the storage recess. The partition walls have a feature of partitioning the conductive brazing material 4 flowing into the storage recess to more reliably prevent a short circuit.

After the LED chip 1 is fitted into the position fitting portion 8 of the support member 5 and the electrode 2 is connected to the electrode terminal 7, it is molded with plastic so as to cover the opening of the position fitting portion 8. . The plastic mold 10 penetrates between the positioning fitting portion 8 and the LED chip 1 to completely seal the opening of the positioning fitting portion 8. The plastic mold 10 having this shape securely fixes the LED chip 1 to the support member 5 and protects the LED chip 1 in an embedded state.

The LED elements shown in FIGS. 4 and 5 are manufactured by the following steps. (1) Gold is vapor-deposited on a wafer of a GaInN-based blue light-emitting LED by electron beam vapor deposition, a pattern is formed by a lift-off method, and this is cut into chips to produce an LED chip 1. It goes without saying that the LED chip 1 to be used can be any one having the electrode 2 on the same surface.

(2) As shown in FIG. 5, a supporting member 5 having positioning fitting portions 8 regularly arranged at a constant pitch is prepared. The electrode terminals 7 of the support member 5 are plated with solder, and the conductive brazing material 4 is adhered thereto.

(3) The position fitting portion 8 of the support member 5 has L
The ED chips 1 are fitted one by one. LED chip 1
The electrode 2 is fitted into the positioning fitting portion 8 as a posture for connecting to the electrode terminal 7.

(4) The support members 5 in which the LED chips 1 have been fitted into all the positioning fitting portions 8 are carried into a vacuum crimping machine and lined up. After the vacuum crimping machine is evacuated, the temperature is raised to about 200 ° C. As shown in FIG. 11, pressure-bonded via a rubber-like elastic member 9,
Cool while maintaining the crimped state. Rubber-like elastic member 9 is LE
The pressure for pressing the D chip 1 is adjusted to ² kg / cm ² . In this state, the conductive brazing material 4 is melted, and the electrodes 2 of the LED chip 1 are connected to the electrode terminals 7.

(5) After cooling to room temperature, plastic is molded in a state where the opening of the positioning fitting portion 8 is closed. The plastic of the plastic mold 10 is optimally an epoxy resin. This is because the light transmittance is high and the light has sufficient intensity. However, a silicone resin or the like can be used instead of the epoxy resin.

Thus, an LED element in which a large number of LED chips 1 are fixed to one support member 5 is manufactured.
The LED element thus manufactured is divided into LED elements.
And In this case, as shown by a chain line in FIG. 5, the support member 5 is cut at the boundary of the positioning fitting portion 8.

A large number of LED chips 1 are mounted on one support member 5.
Is fixed to produce an LED element, which is
Can be manufactured so efficiently that the LED chip 1 is mounted on the electrode member 3 and the lead wire 3 is connected.

[0038]

LED element of the present invention according to the present invention has a feature that the number of LED chips can be fixed precisely disposed to the support member. This is because the supporting member is composed of an insulating member and an electrode member, and the electrode member is fixed to the insulating member, and a positioning fitting portion for fitting and positioning the LED chip in the insulating member is provided. LED to be inserted into the positioning insertion part
In the state where the chips are arranged on the support member,
Even when the electrodes of the LED chip are connected to the electrode members of the support member, there is no displacement. Furthermore, LED
A pair of electrode terminals are arranged at the bottom of the positioning insertion portion so that when the chip is inserted into the positioning insertion portion, the electrodes of the LED chip are connected to the electrode terminals. For this reason, when the LED chip is fitted into the positioning fitting portion of the insulating member, the LED
The chip is placed in place and the LED is
The electrodes of the chip are accurately connected to the electrode terminals. Therefore, the LED element of the present invention has a feature that a large number of small LED chips can be fixed easily and easily at an accurate position of the support member without any positional displacement.

[0039] Further LED element of the present invention, the electrodes of the LED chip can be accurately connected to the electrode terminals, there is a feature that can prevent the adverse effects of short circuit. This is because the electrodes of the LED chip can be accurately arranged on the electrode terminals. When the relative position between the electrode terminal and the electrode of the LED chip is shifted, the electrode may be in a bridge state and the electrode terminal may be short-circuited. However, the LED element of the present invention has the advantage that the electrodes and the electrode terminals can be arranged at accurate relative positions, so that there is no adverse effect and the electrodes of the LED chip can be accurately connected to the electrode terminals. In particular, the LED of the present invention
The device reduces the size of the LED chip,
Even if the integration degree is increased by fixing the D chip to one support member, there is an excellent feature that the yield does not decrease. This is because a small LED chip can be accurately arranged and fixed in the position fitting portion of the support member. Therefore, the LE of the present invention
D element is a high LED element integration density, simply and easily, yet realizing the excellent features that can be inexpensively mass-produced. Further, the method of dividing the LED element into one LED has a feature that extremely efficient and highly accurate LEDs can be mass-produced at low cost.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of a conventional LED.

FIG. 2 is a sectional view showing an example of a conventional LED.

FIG. 3 is a cross-sectional view of an LED element previously developed by the present inventors.

FIG. 4 is a sectional view of an LED element according to an embodiment of the present invention.

FIG. 5 is a plan view of an LED element according to an embodiment of the present invention.

FIG. 6 is a perspective view showing a manufacturing process of an LED element according to another embodiment of the present invention.

FIG. 7 is a plan view of the LED element manufactured by the method shown in FIG. 6;

8 is a plan view of the LED element manufactured by the method shown in FIG.

FIG. 9 is a plan view of an LED device according to another embodiment of the present invention.

FIG. 10 is a plan view of an LED device according to another embodiment of the present invention.

FIG. 11 is a sectional view showing a manufacturing process of the LED element shown in FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... LED chip 2 ... Electrode 3 ... Electrode member 4 ... Conductive brazing material 5 ... Support member 6 ... Insulating member 7 ... Electrode terminal 8 ... Position fitting part 9 ... Rubber-like elastic member 10 ... Plastic mold

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-64-42183 (JP, A) JP-A-53-42557 (JP, A) JP-A-4-171949 (JP, A) JP-A 52-42 75994 (JP, A) JP-A-5-267719 (JP, A) JP-A-63-204754 (JP, A) JP-A-55-54965 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 33/00 H01L 21/60

Claims (9)

(57) [Claims] 1. An LED having a pair of electrodes (2) on the same surface
A chip (1), the LED chip (1) with a fixed to that support (5), said supporting member (5), the insulating member (6) and said <br/> insulating member (6 ) , Penetrating up and down, approaching each other and insulating members (6)
And a pair of electrode terminals are fixed (7) to said support member (5), the LED chip (1) position-decided insertions that female-position-decided in position by fitting the ( 8), and the electrode (2) of the LED chip (1) is provided with the pair of electrodes.
A part that is exposed on the bottom surface of the position fitting part (5) of the terminal (7).
Connected through a conductive brazing material (4),
The recess of the conductive brazing material (4) is formed between the electrode terminals (7).
And a partition wall is provided at the bottom of the storage recess.
D element. The LED chip (1) is a non-circular LED chip having a non-circular outer shape, and the inner shape of a positioning fitting portion (8) of a support member (5) into which the LED chip (1) is fitted is also non-circular. The LED element according to claim 1, wherein the LED element is a circular non-circular position fitting portion. 3. The insulating member (6) is made of alumina, silicon,
Mosquito, characterized by heat-resistant plastic plate
The LED device according to claim 1. 4. The LED chip (1) is a blue light emitting LED.
The LED element according to claim 1. 5. The conductive brazing material (4) has a low melting point such as solder.
Metal or metal paste obtained by kneading a conductive agent and an adhesive
The LED element according to claim 1, wherein 6. A support member (5) having a recess formed in an insulating member (6).
The L according to claim 1, wherein the L is formed into a positioning fitting portion (8).
ED element. 7. An LED chip (1) is provided on a support member (5).
Forming a convex part around the
The LED element according to claim 1, wherein the LED element is formed. 8. An LED chip (1) and a positioning fitting portion (8).
The LED element according to claim 1, wherein the LED element has a rectangular shape. 9. An LED chip is provided at a position fitting portion (8) of the support member (5).
Insert the electrode (1) and connect the electrode (2) to the electrode terminal (7).
To cover the opening of the fixed fitting portion (8) .
2. A plastic mold (10) according to claim 1.
LED element.