JPS58128871A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS58128871A JPS58128871A JP57012202A JP1220282A JPS58128871A JP S58128871 A JPS58128871 A JP S58128871A JP 57012202 A JP57012202 A JP 57012202A JP 1220282 A JP1220282 A JP 1220282A JP S58128871 A JPS58128871 A JP S58128871A
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- thermal head
- film
- heat generating
- resistive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は絶縁性基板上に発熱要素、シよび電極とこれら
を保護する摩耗層からなるサーマルヘッドの分割切断を
容易にするサーマルヘッドに関す為ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head that facilitates division and cutting of the thermal head, which is composed of a heating element, a shield, an electrode, and a wear layer that protects them on an insulating substrate.
従来、一枚の絶縁性基板上に複数債のサーマルヘッドを
形成した場合の基板切断方法としては、絶縁性基板にス
ナップラインを入れた状態で所望の膜形成しサーマルヘ
ッドが完成した時点で分割する方法とダイシング装置に
よシ切断分割する方法が用いられてきた。しかしながら
、この切断分割方法ではシリアルヘッド製造の場合には
大きな問題とはならないがラインヘッドを製造しかつ、
発熱抵抗部が絶縁性基板端面近傍に位置する場合に大き
な欠点となってくる。Conventionally, when multiple thermal heads are formed on a single insulating substrate, the substrate cutting method is to form the desired film with snap lines on the insulating substrate, and then divide the thermal head once it is completed. Two methods have been used: one method involves cutting and dividing using a dicing device. However, this cutting and dividing method does not pose a big problem when manufacturing serial heads, but when manufacturing line heads,
This becomes a major drawback when the heating resistor is located near the end face of the insulating substrate.
つまり感熱記録紙との摩耗を防止する役割をはたす耐摩
耗層が非常に固いため切断面にチッピング現象が生じ第
1図に示されるようなカケ8.クラック9となって現わ
れる。このカケ8、クラック9は最悪の場合には発熱抵
抗体5近傍までおよんでしまう。In other words, the abrasion-resistant layer, which plays a role in preventing abrasion with the thermal recording paper, is extremely hard, which causes a chipping phenomenon on the cut surface, resulting in chipping as shown in Figure 1. It appears as crack 9. In the worst case, these chips 8 and cracks 9 extend to the vicinity of the heating resistor 5.
特KiIIk近ではサーマルヘッドをより高速に駆動さ
せる仁とが)l!求されているがそのため罠はヘッドに
加える印加パルス幅を短くすると共にヘッド温度を高く
しなければならない、ヘッドが加熱。In the special KiIIk vicinity, there is a technology that drives the thermal head at higher speed)l! However, in order to achieve this, it is necessary to shorten the pulse width applied to the head and increase the head temperature, causing the head to heat up.
冷却される場合に切断面に生ずるわずかなりラックが熱
応力のために進行していき、ヘッドの性能を著しく低連
させるという大きな欠点を有している。A major drawback is that the slight rack that occurs at the cut surface when cooled progresses due to thermal stress, significantly reducing the performance of the head.
本発明は上記欠点を除去するためになされ念もので切断
部に工夫をこらすことにニジ品質的に安定し喪性能のサ
ーマルヘッドを提供するものでろゐ。The present invention has been devised to eliminate the above-mentioned drawbacks, and provides a thermal head with stable quality and performance in cutting by devising a cutting section.
以下図面に従って本発明の詳細な説明する。The present invention will be described in detail below with reference to the drawings.
5illlは本発明の一実施例を示すサーマルヘッドの
構成断両略図でToシ、1は熱的良導体よりなる絶縁性
基板で通常アルマナセラミックが使用される。2は絶縁
性基板1上に形成されたガラスグレーズ層である。この
グレーズ層2は発熱抵抗体5で発生する熱を蓄熱する役
目をもってシシ、この犀皐をコントロールすることで熱
バランスが変化するという重畳な役目をもっている。4
線電極でめりOu−ムuToるいはMなどで厚みは1〜
5μmである。5社発熱体5の熱酸化を防止する丸めの
酸素しf断の役割をする際化防止膜であり8102など
が使用される。6は感熱記録紙と接触する丸めの摩耗劣
化を防止するための耐摩耗層であり、〒13偽ヤsIC
などOI!い膜が用いられ厚みも4〜6μ−@変必要と
される。10は本発明のポイントである薄膜との密着を
悪くする破損でめシ、本実施例では油性のペイントが使
用された。この破膜10上にスパッタ装置などにシいて
膜形成した場合、スパッタ熱の影響で破1110自体が
剥離状態となシ、その上に形成される膜である酸化防止
l[11、耐摩耗層12は密着が不十分の壕ま
積層されていく。5 is a schematic cross-sectional view of the structure of a thermal head showing an embodiment of the present invention. 1 is an insulating substrate made of a good thermal conductor, and Almana ceramic is usually used. 2 is a glass glaze layer formed on the insulating substrate 1. This glaze layer 2 has the role of storing the heat generated by the heating resistor 5, and has the overlapping role of changing the heat balance by controlling this glaze layer. 4
Thickness is 1 to 1 with wire electrode.
It is 5 μm. It is an anti-oxidation film that acts as a round oxygen cutoff to prevent thermal oxidation of the heating element 5, and 8102 or the like is used. 6 is an abrasion-resistant layer for preventing abrasion and deterioration of the rolls that come into contact with the thermal recording paper;
Such as OI! A thick film is used and a thickness of 4 to 6 μm is required. No. 10 indicates damage that impairs adhesion to the thin film, which is the key point of the present invention. In this example, oil-based paint was used. When a film is formed on this ruptured film 10 using a sputtering device, the ruptured film 1110 itself will not peel off due to the influence of the sputtering heat, and the oxidation preventive film formed thereon [11, wear-resistant layer] No. 12 is laminated even in the trenches where the adhesion is insufficient.
従って破膜10上に形成された膜は非常にもろい膜とな
っている。9はダイシングのブレード(a石)であり、
切断分割するためのものである。Therefore, the membrane formed on the ruptured membrane 10 is a very fragile membrane. 9 is a dicing blade (a stone);
It is for cutting and dividing.
このブレード9で切断する場合にスパッタ膜11.11
2は非常に密着性が悪くもろいため従来第1図、第2図
に示されるよう猪チッピング現象を起させずに切断でき
ることが可能となった。When cutting with this blade 9, the sputtered film 11.11
Since the material No. 2 has very poor adhesion and is brittle, it has become possible to cut the material without causing the chipping phenomenon as shown in FIGS. 1 and 2.
sI4図は切断後の切断面であるが切断面に取り残され
た酸化防止膜11、耐摩耗層12は超音波洗浄で簡単に
除去することができ切断面も実にす 1つきりした
形状になり、発熱抵抗体が絶縁性基板端面近くに位置す
るラインヘッドにおいては特に信頼性を向上させる効果
を有している。Figure sI4 shows the cut surface after cutting, but the anti-oxidation film 11 and wear-resistant layer 12 left behind on the cut surface can be easily removed by ultrasonic cleaning, and the cut surface has a slim shape. This is particularly effective in improving reliability in a line head in which the heating resistor is located near the end surface of the insulating substrate.
以上のように本発明によれば一つの絶縁性基板から複数
個のラインヘッドを分離する場合に切断面がシャープで
あるため外部環境からの悪影響を受けることがない信頼
性の高い、高寿命のサーマルヘッドを提供するものであ
る。As described above, according to the present invention, when a plurality of line heads are separated from one insulating substrate, the cut surface is sharp, so it is possible to achieve high reliability and long life without being adversely affected by the external environment. It provides a thermal head.
第1図は従来のサーマルヘッドの切断状態を示す断面図
である。第2図は切断分割後の断面図である。第3図は
本発明の実施例での断面、図でめシ、第4図は分割後の
断面図である。
1・・・絶縁性基板 2・・・グレーズ3・・・
発熱抵抗体 5・・・量化防止膜4・・・電極
7・・・カケ部8・・・クランク
?・・・ブレード10・・・被膜 11・
・・際化防止膜12・・・耐摩耗層 6・・・
耐傘耗層以 上
答1図
第7回
3 /FIG. 1 is a sectional view showing a conventional thermal head in a cut state. FIG. 2 is a sectional view after cutting and dividing. FIG. 3 is a cross-sectional view of an embodiment of the present invention, and FIG. 4 is a cross-sectional view after division. 1... Insulating substrate 2... Glaze 3...
Heat generating resistor 5... anti-quantification film 4... electrode
7...Crack part 8...Crank
? ...Blade 10...Coating 11.
... Anti-aging film 12 ... Wear-resistant layer 6 ...
Umbrella wear-resistant layer or higher Answer 1 Figure 7 No. 3 /
Claims (1)
ための摩耗層からなるサーマルヘッドにおいて、切断部
にあらかじめ密着性の悪い物質をコーティングしである
ことを特徴とするサーマルヘッド。A thermal head consisting of a heating element and electrodes on an insulating substrate, and a wear layer for protecting them, characterized in that the cutting part is coated in advance with a substance with poor adhesion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57012202A JPS58128871A (en) | 1982-01-28 | 1982-01-28 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57012202A JPS58128871A (en) | 1982-01-28 | 1982-01-28 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58128871A true JPS58128871A (en) | 1983-08-01 |
Family
ID=11798809
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57012202A Pending JPS58128871A (en) | 1982-01-28 | 1982-01-28 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58128871A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62208961A (en) * | 1986-03-11 | 1987-09-14 | Alps Electric Co Ltd | Thermal head |
JPS62233266A (en) * | 1986-04-02 | 1987-10-13 | Fuji Xerox Co Ltd | Manufacture of thermal head |
JPH08336995A (en) * | 1996-01-11 | 1996-12-24 | Alps Electric Co Ltd | Thermal head |
-
1982
- 1982-01-28 JP JP57012202A patent/JPS58128871A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62208961A (en) * | 1986-03-11 | 1987-09-14 | Alps Electric Co Ltd | Thermal head |
JPH0588195B2 (en) * | 1986-03-11 | 1993-12-21 | Alps Electric Co Ltd | |
JPS62233266A (en) * | 1986-04-02 | 1987-10-13 | Fuji Xerox Co Ltd | Manufacture of thermal head |
JPH0635186B2 (en) * | 1986-04-02 | 1994-05-11 | 富士ゼロックス株式会社 | Method of manufacturing thermal head |
JPH08336995A (en) * | 1996-01-11 | 1996-12-24 | Alps Electric Co Ltd | Thermal head |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0646464B1 (en) | Ink ejecting device having a multi-layer protection film for electrodes | |
CA2351199A1 (en) | Structure of piezoelectric element and liquid discharge recording head, and method of manufacture therefor | |
CN1968820B (en) | Thermal head and manufacturing method thereof | |
JPS58128871A (en) | Thermal head | |
JP4319645B2 (en) | Thermal print head and manufacturing method thereof | |
JPH03205165A (en) | Thermal head | |
JP4207504B2 (en) | Inkjet head | |
JPH09123504A (en) | Thermal head and manufacture thereof | |
JPH10305605A (en) | Glazed substrate, thermal print head, and manufacture for thermal print head | |
KR100888521B1 (en) | Thermal head and manufacturing method thereof | |
JP2004154969A (en) | Thermal head and its manufacturing process | |
JPH11277780A (en) | Thermal head and manufacture thereof | |
JP2006156863A (en) | Semiconductor device and manufacturing method therefor | |
JPH0380434B2 (en) | ||
JPH03222760A (en) | Thermal head and manufacture thereof | |
JPH08167115A (en) | Coil electrode structure for driving thin-film magnetic head and its formation | |
JPH05330110A (en) | Production of thermal head | |
JP2001310298A (en) | Method of separating electronic element | |
JPS6017708B2 (en) | thin film thermal head | |
JP2003182127A (en) | Thermal head | |
JPH08112923A (en) | Thermal head | |
JPH07276642A (en) | Printing head for ink jet and its manufacture | |
JPH01280570A (en) | Thermal head | |
JPH09226162A (en) | Thermal head and its production | |
JP2003341119A (en) | Method for fabricating recording head |