JPS58126996A - Plating method - Google Patents

Abstract

PURPOSE:To form a Ni plating layer of uniform thickness and excellent external appearance in Ni plating on the surface of stainless steel by placing the stainless steel material that forms a cathode in a wire netlike anode of Ni and electrically conducted. CONSTITUTION:As pretreatment, stainless steel material, an object to be plated, is degreased by an organic solvent, polished with diatomaceous earth powder that does not contain soap, washed by supersonic water washing and strike plated. This stainless steel material 3 is made a cathode immersing it in a Ni plating bath 4, covered with Ni wire netting that works as an anode, energized and plated. As the area of the anode 5 is large, current density can be made small. Adverse effects of impurities due to rise of bath voltage become less and scorching and unevenness of luster are eliminated. Thus, a Ni plating layer of uniform thickness excellent in appearance and adhesion can be formed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating method for performing nickel plating on a stainless steel substrate. More specifically, the present invention relates to a plating method capable of obtaining a nickel plating layer with good adhesion on a stainless steel substrate.

Stainless steel is usually used for bolts of structural parts, etc., which require high strength and are constantly submerged in water and do not want to rust. As this stainless steel material, martensitic material (stys 4o3) is used from the viewpoint of strength, but this has the disadvantage of being prone to rust due to its corrosion resistance. Therefore, attempts have been made to nickel plate the stainless steel base to improve its corrosion resistance.

FIG. 1 is an explanatory diagram for explaining a conventional plating method for applying nickel plating to a stainless steel base. In this plating method, a flat anode 5 connected to an anode bus bar 1 and a plated product 3 connected to a cathode bus bar 1 are placed facing each other in a plating solution and plated.

However, this plating method has the drawback that the adhesion of the nickel plating layer to the stainless steel base is poor, and blistering and peeling are likely to occur, making it difficult to obtain a sound surface plating layer. In addition, as a general tendency of nickel plating, scorching and smearing are likely to occur during uniform electrodeposition. In order to have corrosion resistance, the thickness of the plating layer needs to be about 20 μm, but! In the method shown in Figure J1, the thin area is at least 10 μm for a target of 20 μm.
One thick spot was 25 μm, making it impossible to obtain a uniform plating layer.

Here, the present invention aims to provide a plating method that provides good adhesion, provides a uniform plating layer, and provides a beautiful finish.

The method according to the present invention includes degreasing, polishing, and ultrasonic water washing of an article to be plated, and then placing the article in an anode configured to cover the article with a nickel wire mesh, and plating the article. It is a feature.

First, in establishing the method of the present invention, various studies were conducted according to the following plating process.

(i) Degreasing of the product to be plated + (11) Polishing → G11) Pickling → Gy) Water washing (W) Strike Metsky 9 (W) Plating.

In this step, (1) to (1) are the pretreatment steps, which are carried out to remove dirt from the surface of the product to be plated.

(7) Strike plating is a process in which thin plating is applied quickly and in a short period of time as a base plating in order to provide plating with good adhesion, and (B) plating is a process in which plating is performed to a predetermined thickness.

As a result of examining the plating layers obtained under various conditions in these steps, the following points became clear.

(1) Pretreatment involves degreasing, polishing with soap-free diatomaceous earth powder, and performing ultrasonic water washing before plating. During this time, the product to be plated is always kept wet to prevent it from drying out before being transferred to the next process.

('li) Pre-treatment pickling causes stains and unevenness and causes poor adhesion, so the results were better when it was not carried out.

In the G'+'0 plating process, it is best to use a nickel wire mesh for the anode so as to cover the object to be plated from the surrounding area, and to place the anode so that it surrounds the object to be plated in the plating solution, in order to make the plating thickness uniform. be.

Based on the above study results, a plating method according to the present invention including the following steps was established.

(i) Degreasing: Degreasing with an organic solvent.

(ii) Polishing: Polishing with diatomaceous earth powder that does not contain soap.

G11) Ultrasonic water washing test 2 Iku plating (wood bath) (V) Plating... Nickel gold copper is used as the anode.

In each of these steps, it is necessary that the product to be plated is not allowed to dry while being carried into the next step.

Table 1 shows the conditions for strike plating and the plating process.

FIG. 2 is a configuration explanatory diagram showing a plating process.

In the plating process, as shown in the figure, the article 3 to be plated is placed in a plating solution 4 so as to be surrounded by an anode 5 made of a nickel wire mesh. When plating is performed by such a method, the anode area becomes large, so the current density can be lowered, and therefore the adverse effects of impurities due to an increase in bath voltage are reduced, and scorching and uneven gloss can be eliminated.

As explained above, according to the method of the present invention, it has become possible to obtain a plating layer with good adhesion on a stainless steel material. The adhesion was determined by bending test (1
80', 5 times), heating and rapid cooling test (150C → room temperature)
Confirmed by. Also, the thickness is uniform (18 with a 20μ target)
~25μ), it became possible to obtain a plated layer with a beautiful finish.

[Brief explanation of drawings]

Figure 1 is an explanatory diagram for explaining the conventional plating method.
(A) is a perspective view, (A) is a sectional view taken along the line A--A in FIG. ) is a sectional view taken along line AA' in figure (a). 1... Anode busbar, 2... Cathode busbar, 3...
・Product to be plated, 4... Plating solution, 5... Anode. Representative Patent Attorney Masatoshi Sato

Claims (1)

[Claims] (1) After going through the steps of degreasing the stainless steel product → coating with soap-free diatomaceous earth powder → ultrasonic washing → strike plating, cover the plated product with a nickel wire mesh. A plating method in which nickel plating is performed on the steel/resist material by placing it in a structured anode.