JPS58124997U - radiator structure - Google Patents

radiator structure

Info

Publication number
JPS58124997U
JPS58124997U JP2012682U JP2012682U JPS58124997U JP S58124997 U JPS58124997 U JP S58124997U JP 2012682 U JP2012682 U JP 2012682U JP 2012682 U JP2012682 U JP 2012682U JP S58124997 U JPS58124997 U JP S58124997U
Authority
JP
Japan
Prior art keywords
electronic devices
heat
radiator structure
radiator
above electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012682U
Other languages
Japanese (ja)
Inventor
崇博 今井
角井 康弘
Original Assignee
株式会社ケンウッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ケンウッド filed Critical 株式会社ケンウッド
Priority to JP2012682U priority Critical patent/JPS58124997U/en
Publication of JPS58124997U publication Critical patent/JPS58124997U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案による一実施例を示す要部の斜視図、
第2図は第1図の要部を示す断面図である。 1・・・電源部、2・・・ファイナル部、3,4・・・
放熱器、5・・・熱結合部。   。
FIG. 1 is a perspective view of the main parts showing one embodiment of this invention;
FIG. 2 is a sectional view showing the main part of FIG. 1. 1...Power supply section, 2...Final section, 3, 4...
Heat sink, 5...thermal coupling part. .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 通信機等の電子機器において、上記各電子機器の有する
熱源部が同時に発熱しない場合、上記各、    電子
機器に設けた放熱器を熱伝導性の良い導体により一熱結
合することにより、各電子機器の放熱器が有するみかけ
上の放熱容量を大きくするよう構成したことを特徴とす
る放熱器構造。
In electronic devices such as communication devices, if the heat sources of each of the above electronic devices do not generate heat at the same time, each electronic device can be heated by thermally coupling the heat sinks installed in each of the above electronic devices with a conductor with good thermal conductivity. A radiator structure characterized by being configured to increase the apparent heat radiation capacity of the radiator.
JP2012682U 1982-02-16 1982-02-16 radiator structure Pending JPS58124997U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012682U JPS58124997U (en) 1982-02-16 1982-02-16 radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012682U JPS58124997U (en) 1982-02-16 1982-02-16 radiator structure

Publications (1)

Publication Number Publication Date
JPS58124997U true JPS58124997U (en) 1983-08-25

Family

ID=30032300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012682U Pending JPS58124997U (en) 1982-02-16 1982-02-16 radiator structure

Country Status (1)

Country Link
JP (1) JPS58124997U (en)

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