JPS58124213A - Chip type variable inductance element - Google Patents

Chip type variable inductance element

Info

Publication number
JPS58124213A
JPS58124213A JP805282A JP805282A JPS58124213A JP S58124213 A JPS58124213 A JP S58124213A JP 805282 A JP805282 A JP 805282A JP 805282 A JP805282 A JP 805282A JP S58124213 A JPS58124213 A JP S58124213A
Authority
JP
Japan
Prior art keywords
collars
magnetic
coil
inductance element
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP805282A
Other languages
Japanese (ja)
Inventor
Hiroshi Hirakawa
平川 博
Osamu Fukushima
修 福嶋
Mitsuo Hoshino
星野 光雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soshin Electric Co Ltd
Sony Corp
Original Assignee
Soshin Electric Co Ltd
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soshin Electric Co Ltd, Sony Corp filed Critical Soshin Electric Co Ltd
Priority to JP805282A priority Critical patent/JPS58124213A/en
Publication of JPS58124213A publication Critical patent/JPS58124213A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain an accurate L value by molding a molding material mixed with magnetic powder between collars of a magnetic core. CONSTITUTION:A magnetic core 13 is formed of collars 12a, 12b of a rectangle provided at both ends of a coil mount 11 and the coil mount 11. Insulating layers 14a, 14b which are made of nonmagnetic material are respectively formed on the lower surfaces of the collars 12a, 12b, electrodes 15a, 15b are laminated on the lower surfaces, and both ends of a coil 16 are respectively connected to the electrodes. Then, thermoplastic resin 17 made of polyethylene or polyurethane mixed with magnetic powder having large magnetic permeability such as Mn-Zn ferrite is filled and cured between the collars 12a and 12b in such a manner that the mixture ratio of the magnetic powder with the resin is substantially at maximum 5:1 by weight and at minimum 1:5. In this case, the collars 12a and 12a of the core 12 are fixed with the resin 17 mixed with the magnetic powder having large magnetic permeability between the collars. Accordingly, the leakage magnetic flux which crosses the electrodes 15a, 15b can be prevented, and can also be prevented by the insulating layers 14a, 14b, thereby maintaining high Q characteristic.

Description

【発明の詳細な説明】 本発明は、コイル巻装部とこのコイル巻装部の両端に夫
々設けた一対の鍔部とから形成された磁心と、この磁心
の上記コイル巻装部(こ巻装したコイルとから成るチッ
プ型の可変インダクタンス素子に関するものであって、
高周波回路をプリント配線基板等(こ形成する場合に用
いて好適なものである。
Detailed Description of the Invention The present invention provides a magnetic core formed from a coil winding portion and a pair of flanges provided at both ends of the coil winding portion, and a magnetic core formed from a coil winding portion (the coil winding portion) of the magnetic core. The invention relates to a chip-type variable inductance element consisting of a coil mounted thereon,
It is suitable for use when forming high frequency circuits on printed wiring boards, etc.

従来、チップ型インダクタンス素子は第1図及び第2図
(こ示す如く、円柱状のコイル巻装部(1)とこのコイ
ル巻装部の両端に設けた円形の鍔部(2a)(2b)と
から形成された磁心(3)を具備し、この磁心(3)の
上記コイル巻装部(1)fこはコイル(4)が巻装され
ている。そして、このコイル(4)の両端は夫々前記鍔
部(2aX2b)の下面Eこ設けた電極(5aX5b)
+コ接続され、この電極(5aX5b)を半田(6a)
(6b)4c 、J:、 リフ”リント配線基板(7)
lこ半田付けしている。
Conventionally, a chip-type inductance element has a cylindrical coil winding part (1) and circular flanges (2a) (2b) provided at both ends of the coil winding part (as shown in FIGS. 1 and 2). A coil (4) is wound around the coil winding portion (1) of the magnetic core (3).Both ends of the coil (4) are the electrodes (5aX5b) provided on the lower surface E of the flange (2aX2b), respectively.
+ is connected, solder this electrode (5aX5b) (6a)
(6b) 4c, J:, Riff” lint wiring board (7)
I'm soldering it.

しかしながら、Cの構造では漏れ磁束が電極(58X5
b)を切ること(こなるので、Q値の劣化が著しい。そ
こで従来は、材質谷改良したり形状を変化させる等して
このQ特性を上げるよう番こしていたか、充分に改善が
行われず、また実装面積の増大を免れることができなか
つ1こ。
However, in the structure of C, the leakage magnetic flux is
b) Cutting (cutting) causes a significant deterioration of the Q value.Therefore, in the past, the Q characteristic was improved by improving the material valley or changing the shape, etc., or the improvement was not made sufficiently. Also, the mounting area cannot be avoided.

すた、一般にこの種のインダクタンス素子においては、
コイル(4)の巻き方や磁心(3)の形状等の避は離い
僅かな誤差のため、精確なL値を得ることが困難であっ
た。そこで従来は第6図及び第4図に示す如く、一方の
鍔部(2b)の側面からねじ込まれたトリマコア(8)
のねじ吟み量を調節してL値の調整を行っていたが、ト
リマコアを小さく°するにも限度かあるから、小型のも
のでは調整が困難であって小型のチップ型インダクタン
ス素子には適用でき雛かった。
Generally, in this type of inductance element,
Due to slight errors in the winding of the coil (4), the shape of the magnetic core (3), etc., it was difficult to obtain an accurate L value. Therefore, conventionally, as shown in Figs. 6 and 4, a trimmer core (8) was screwed in from the side of one flange (2b).
The L value was adjusted by adjusting the amount of screw tightening, but since there is a limit to how small the trimmer core can be made, it is difficult to adjust with a small size, so it is not applicable to small chip type inductance elements. I was able to do it.

本発明は以上のような実情−こ鑑みなされたものであっ
て、その目的は、電極を切る漏れ磁束を極力防+hl、
で、より高いQ特性を維持すると共に、L値の調整がで
きて目的に応じた精確なL値を得ることができるチップ
型可変インダクタンス素子を提供する(こある。
The present invention was made in view of the above-mentioned circumstances, and its purpose is to prevent as much as possible the leakage magnetic flux that cuts the electrodes.
To provide a chip-type variable inductance element that maintains a higher Q characteristic and can adjust the L value to obtain an accurate L value depending on the purpose.

この目的を達成するため、本発明によるチップ型可変イ
ンダクタンス素子(こおいては、磁心の鍔部間を磁性粉
を混入した成形材料でモールドすること番こより、この
中を漏れ、磁束か通り易くして電極を切る漏れ磁束を極
力防止すると共(こ、モールドした成形材料をその中に
混入した磁性粉と共をこ削り取ることによりL値の調整
を行い得るようにしたことを特徴とする。
In order to achieve this purpose, the chip-type variable inductance element according to the present invention (in this case, molding between the flanges of the magnetic core with a molding material mixed with magnetic powder) makes it easier for magnetic flux to leak through the element. It is characterized by preventing as much as possible the leakage magnetic flux that cuts the electrode (and by scraping off the molded material together with the magnetic powder mixed therein, the L value can be adjusted).

以下、本発明の一実施例7j−:第5図及び第6図に基
づき説明する。Cれらの図において、符号旧)はコイル
巻装部で、このコイル巻装部(11)の両端に設けた直
方体の鍔部(128X12b)とこのコイル巻装部(1
1+とで例えばフェライト等から成る磁心θ3)を形成
している。そして、鍔部(12aX 12b)の下面に
は例えばグラスエポキシ板のような非磁性体から成る絶
縁N (14aX14b)を夫々設け、この下面に積層
して例えは銅板などから成る電極(158X15b) 
’F設け、この電極(15aX15b) iこ前記コイ
ル巻装部aυに巻装したコイルfl131の両端を夫々
接続している。なお、上記絶縁層(14aX 14b)
の実用的な厚さは、その材質や大きさfこよっても多少
異なるが、可能性がある0、 25 ミ!J以上である
のが好ましい。
Embodiment 7j- of the present invention will be described below with reference to FIGS. 5 and 6. C (in these figures, old code) is the coil winding part, and the rectangular parallelepiped flanges (128 x 12b) provided at both ends of this coil winding part (11) and this coil winding part (1
1+ forms a magnetic core θ3) made of, for example, ferrite. Insulation N (14aX14b) made of a non-magnetic material such as a glass epoxy plate is provided on the lower surface of the flange (12aX 12b), and electrodes (158X15b) made of a copper plate or the like are laminated on the lower surface.
The electrodes (15aX15b) are connected to both ends of the coil fl131 wound around the coil winding portion aυ. Note that the above insulating layer (14aX 14b)
The practical thickness of the material varies depending on its material and size, but it may be 0.25 mm! It is preferable that it is J or more.

次(こ、符号aηは例えばMn −Znフェライトのよ
うな透磁率の大きい磁性粉を混入したポリエチレンやポ
リウレタンのような熱可塑性の樹脂で、鍔部(12aX
12b)間番ここれを注入して硬化させたものである。
Next (the code aη is a thermoplastic resin such as polyethylene or polyurethane mixed with magnetic powder with high magnetic permeability such as Mn-Zn ferrite, and the flange part (12aX
12b) This was injected and cured.

この場合、磁性粉と樹脂との混合比は目的(こ応して可
変であるか、実用上の見地から見れば、重量比で最大(
iぼ5:1位、最小はぼ1:5位であってよい。
In this case, the mixing ratio of magnetic powder and resin may be variable depending on the purpose (or, from a practical point of view, the maximum weight ratio (
The minimum value may be 5:1, and the minimum value may be 1:5.

以上のように構成されたチップ型可変インダクタンス素
子、はその電極(15aX15b)がプリント配線基板
(7)上の所定のパターン上lこ半田(18aX18b
)で半田付けされると共に、そのコイル(16)の両端
が前述のよう(こ電極(158X15b)に夫々接続さ
れる。この場合、磁心(131の鍔部(12aX12b
)間は前記の通り透磁率の大きい磁性粉を混入した樹脂
aηで固められているから、漏れ磁束はこの部分を通ろ
うとする。従って、電極(15aX15b)を切る漏れ
磁束は上記樹脂ar、の存在をこよって極力防止される
上に、前記非磁性の絶縁層(143X14b)によって
も極力防止されるから、一層高いQ特性を維持すること
ができる。
The chip type variable inductance element configured as described above has its electrodes (15a x 15b) soldered (18a x 18b) on a predetermined pattern on the printed wiring board (7).
), and both ends of the coil (16) are connected to the electrodes (158X15b) as described above.In this case, the flange (12aX12b) of the magnetic core (131)
) is solidified with resin aη mixed with magnetic powder having high magnetic permeability as described above, so leakage magnetic flux tends to pass through this part. Therefore, leakage magnetic flux cutting through the electrode (15aX15b) is prevented as much as possible by the presence of the resin ar, and also by the non-magnetic insulating layer (143X14b), thus maintaining even higher Q characteristics. can do.

また、樹脂(17)はレーザートリミング等により、そ
の中ζこ含まれる透磁率の大きい磁性粉と共蛋こ、例え
ば溝(IcJのようlこ削り取ることができる。従って
、メーターでL値を読みながら樹脂α7)を削り取るこ
とをこより、所望の精確なL値のチップ型可変インダク
タンスを得ることかできる。
In addition, the resin (17) can be cut out by laser trimming or the like to remove co-blocks with the magnetic powder with high magnetic permeability contained therein, such as grooves (IcJ). Therefore, read the L value with a meter. However, by scraping off the resin α7), it is possible to obtain a chip-type variable inductance with a desired accurate L value.

更(こまた、コイル(16)は樹脂αηの中【こ埋め込
まれているから、フィルは樹脂1こより保護きれて破損
することがない。また、コイル巻装部(lI)と鍔部(
12aX 12b)とから成る磁心(1階は樹脂αηに
よって一体1こ固められているから、折れ易い磁心が樹
脂ζこよって補強される。
Furthermore, since the coil (16) is embedded in the resin αη, the fill is protected from the resin and will not be damaged.
12aX 12b) (The first floor is solidified as one piece with resin αη, so the easily broken magnetic core is reinforced by resin ζ.

以上説明したように、本発明のチップ型可変インダクタ
ンス素子によれは、電極を切る漏れ磁束か極力防止され
るから、高いQ特性を維持することができると共lこ、
樹脂で一体に固められているから脆弱な磁心やコイルか
補強される。また、樹脂を削り取ることにより、所望の
精確なL値及びQ値のチップ型可変インダクタンス素子
を得ることができる。従って、チップ型可変インダクタ
ンス素子の小型化が促進され、混成集積回路やプリント
配線基板への部品の実装置こおいても、小型化、軽量化
及び低価格化が更に一層増進されて有利である。
As explained above, the chip-type variable inductance element of the present invention prevents leakage flux that cuts the electrodes as much as possible, so it is possible to maintain high Q characteristics and
Because it is solidified with resin, it strengthens the weak magnetic core and coils. Furthermore, by scraping off the resin, a chip-type variable inductance element with desired accurate L and Q values can be obtained. Therefore, the miniaturization of chip-type variable inductance elements is promoted, and even in the actual equipment of components for hybrid integrated circuits and printed wiring boards, miniaturization, weight reduction, and cost reduction are further promoted, which is advantageous. .

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のチップ型インダクタンス素子の正面図、
第2図は第1図蒼こ示すインダクタンス素子の正面図、
第6図は従来のチップ型可変インダクタンス素子の正面
図、第4図は第6図に示すインダクタンス素子の側面図
、第5図は本発明の一実施例を示すチップ型可変インダ
クタンス素子の正面図、第6図は第5図に示すインダク
タンス素子の(1111面図である。 な石図面に用いられている符号tこおいて、(lυ・・
・・・・・・・・・・・・・・・・コイル巻装部(12
aX12b)−・・鍔部 (13)・・・・・・・・・・・・・・・・・・磁心(
旧・・・・・・・・・・・・・・・用コイルである。 代理人 土星 勝 〃  常包芳男 〃  杉浦俊貴
Figure 1 is a front view of a conventional chip-type inductance element.
Figure 2 is a front view of the inductance element shown in Figure 1.
FIG. 6 is a front view of a conventional chip-type variable inductance element, FIG. 4 is a side view of the inductance element shown in FIG. 6, and FIG. 5 is a front view of a chip-type variable inductance element showing an embodiment of the present invention. , FIG. 6 is a (1111 plane view) of the inductance element shown in FIG.
・・・・・・・・・・・・・・・ Coil winding part (12
aX12b)--Flame (13)...Magnetic core (
This is a coil for the old... Agent Masaru Saturn〃 Yoshio Tsunekako〃 Toshiki Sugiura

Claims (1)

【特許請求の範囲】[Claims] コイル巻装部とこのコイル巻装部の両端に夫々設けた一
対の鍔部とから形成された磁心と、この磁心の上記コイ
ル巻装部に巻装したコイルとから成り、上記鍔部間を磁
性粉を混入した成形材料でモールドしたことを特徴とす
るチップ型可変インダクタンス素子。
It consists of a magnetic core formed from a coil winding part and a pair of flanges provided at both ends of the coil winding part, and a coil wound around the coil winding part of the magnetic core, and a coil is wound between the flanges. A chip-type variable inductance element characterized by being molded with a molding material mixed with magnetic powder.
JP805282A 1982-01-21 1982-01-21 Chip type variable inductance element Pending JPS58124213A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP805282A JPS58124213A (en) 1982-01-21 1982-01-21 Chip type variable inductance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP805282A JPS58124213A (en) 1982-01-21 1982-01-21 Chip type variable inductance element

Publications (1)

Publication Number Publication Date
JPS58124213A true JPS58124213A (en) 1983-07-23

Family

ID=11682555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP805282A Pending JPS58124213A (en) 1982-01-21 1982-01-21 Chip type variable inductance element

Country Status (1)

Country Link
JP (1) JPS58124213A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179011U (en) * 1984-05-07 1985-11-28 株式会社トーキン small inductor
JPH01199418A (en) * 1988-02-03 1989-08-10 Murata Mfg Co Ltd Chip coil
JPH11238634A (en) * 1997-12-17 1999-08-31 Taiyo Yuden Co Ltd Planar mounting type coil component
WO2005045858A1 (en) * 2003-11-05 2005-05-19 Tdk Corporation Coil device
JP2005150470A (en) * 2003-11-17 2005-06-09 Taiyo Yuden Co Ltd Chip inductor and method for manufacturing the same
JP2006253394A (en) * 2005-03-10 2006-09-21 Taiyo Yuden Co Ltd Chip-like winding-type coil component
JP2006286807A (en) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd Chip-type of wound coil component and its manufacturing method
US7215232B2 (en) 2004-09-30 2007-05-08 Taiyo Yuden Co., Ltd. Surface mount coil component and surface mount coil component mounted substrate
JP2007311525A (en) * 2006-05-18 2007-11-29 Nec Tokin Corp Inductance element
US7551053B2 (en) 2003-11-05 2009-06-23 Tdk Corporation Coil device

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60179011U (en) * 1984-05-07 1985-11-28 株式会社トーキン small inductor
JPH01199418A (en) * 1988-02-03 1989-08-10 Murata Mfg Co Ltd Chip coil
JPH11238634A (en) * 1997-12-17 1999-08-31 Taiyo Yuden Co Ltd Planar mounting type coil component
WO2005045858A1 (en) * 2003-11-05 2005-05-19 Tdk Corporation Coil device
WO2005045859A1 (en) * 2003-11-05 2005-05-19 Tdk Corporation Coil device
US7551053B2 (en) 2003-11-05 2009-06-23 Tdk Corporation Coil device
US7746207B2 (en) 2003-11-05 2010-06-29 Tdk Corporation Coil device
JP2005150470A (en) * 2003-11-17 2005-06-09 Taiyo Yuden Co Ltd Chip inductor and method for manufacturing the same
US7215232B2 (en) 2004-09-30 2007-05-08 Taiyo Yuden Co., Ltd. Surface mount coil component and surface mount coil component mounted substrate
JP2006253394A (en) * 2005-03-10 2006-09-21 Taiyo Yuden Co Ltd Chip-like winding-type coil component
JP2006286807A (en) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd Chip-type of wound coil component and its manufacturing method
JP2007311525A (en) * 2006-05-18 2007-11-29 Nec Tokin Corp Inductance element

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