JPS58123743A - Method for deburring lead frame side - Google Patents

Method for deburring lead frame side

Info

Publication number
JPS58123743A
JPS58123743A JP566982A JP566982A JPS58123743A JP S58123743 A JPS58123743 A JP S58123743A JP 566982 A JP566982 A JP 566982A JP 566982 A JP566982 A JP 566982A JP S58123743 A JPS58123743 A JP S58123743A
Authority
JP
Japan
Prior art keywords
lead frame
deburring
frame
sides
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP566982A
Other languages
Japanese (ja)
Other versions
JPS6351389B2 (en
Inventor
Yuji Miura
三浦　雄二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP566982A priority Critical patent/JPS58123743A/en
Publication of JPS58123743A publication Critical patent/JPS58123743A/en
Publication of JPS6351389B2 publication Critical patent/JPS6351389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding

Abstract

PURPOSE:To automate a deburring process by a method wherein a lead frame with its sides burred is transmitted to be pressed to the points of deburring tools. CONSTITUTION:A resin-sealed body 4 containing a semiconductor element is formed on a lead frame 2. The frame 2 has burrs 6 on its sides. The frame 2 is pressed and held in grooves 10a of grooves rolls 10 and is inserted between belts 11 or the like when it is transmitted. The burrs 6 are under pressure exerted by the grooves 10a of the rolls 10. The lead frame 2 comes out of the pressing section and the burred sides thereof meet the points 12a of the rotatably provided deburring tools 12 for deburring.

Description

【発明の詳細な説明】 発明の技術分野 本発明は、リードフレームの側面パリ取り方法に関する
。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a method for deburring the side surfaces of a lead frame.

発明の技術的背景 ＤＩＰ　（Ｄｕａｌ　Ｉｎ−１ｉｎｅ　Ｐａｃｋａｇｅ
）と称せられる半導体装置は、素子を封止した樹脂封止
体の両貴“部から外部リードを外部に垂下した構造を有
している。而して、リードフレームを樹脂封止する際に
、リードフレームと樹脂封止金製の間に形成される隙間
によって、成製後の樹脂封止体の片側であるダート側に
パリを発生する。このようなパリは、後の工程で所望の
処理を施すために、樹脂封止体の側面の形状を利用して
位置決め等をする際に極めて不都合である。このため従
来は、リードフレームに樹脂封止を施して硬化し友後に
手作業によってパリを除し、完全にパリを除したものを
次工程に供給していた。Technical background of the invention DIP (Dual In-1ine Package)
) has a structure in which external leads hang down to the outside from both sides of a resin-sealed body in which an element is sealed. Due to the gap formed between the lead frame and the resin-sealed metal, burrs are generated on one side of the molded resin-sealed body, which is the dirt side. This is extremely inconvenient when positioning, etc. is performed using the shape of the side surface of the resin-sealed body for processing.For this reason, in the past, resin-sealing was applied to the lead frame, hardened, and then manually removed. The paris was removed, and the product from which the paris was completely removed was supplied to the next process.

背景技術の問題点 しかしながら、手作業によって樹脂封止体の側部のパリ
を除去するものでは、多くの作業時間を必要とし、パリ
取り工程の前後の種々の作業工程を連結して自動化を達
成できない欠点があった。Problems with the Background Art However, manually removing the deburrs from the sides of resin-sealed bodies requires a lot of work time, and it is difficult to achieve automation by linking various work processes before and after the deburr removal process. There was a drawback that it could not be done.

発明の目的 本発明は、・青すｘＲや作業を自動化してパリ取り工程
の前後の工程を連結して各々の工程の自動化によって著
しく作業性を向上させることができるリードフレームの
側面パリ取り方法を提供することをその目的とするもの
である。。Purpose of the Invention The present invention provides a method for deburring the side surface of a lead frame, which can automate the blue xR and work, connect the processes before and after the deburring process, and significantly improve work efficiency by automating each process. Its purpose is to provide. .

発明の櫃要 本発明は、リードフレームの片側端面に付着したパリを
押圧しながらリードフレームを次工程に移送し、このリ
ードフレームの移送中に抑圧され九片側端面のパ９に／
４り取り刃の刃先部を圧接せしめることによ）、パリ取
）作業を自動化し走り−ド７レームの側面パリ取シ方法
である。Summary of the Invention The present invention transfers the lead frame to the next process while pressing the pads attached to one end surface of the lead frame.
This is a method for deburring the side surface of a running frame by automating the deburring process by pressing the cutting edge of the burr blade into contact with each other.

発明の実施例 本発明の実施例につ−て図面を参照して説明する。第１
図（６）は、片側端面Ｋ　Ａ　ＩＪが付着したリードフ
レームの平面図、同図（至）は、同リードフレームの正
面図である。図中１は、リードフレーム２を構成する枠
体である。枠体ＩＫは、外部リード１となる部分を露出
した状態で半導体素子（図示せず）を封止した樹脂對止
体４が形成されて−る。枠体ＩＫよって輪郭形状が決定
されたり−Ｐフレーム２の側面５には、ΔすＣが付着し
ている。Embodiments of the Invention Examples of the present invention will be described with reference to the drawings. 1st
Figure (6) is a plan view of the lead frame to which one end face K A IJ is attached, and Figure (6) is a front view of the lead frame. In the figure, 1 is a frame that constitutes the lead frame 2. As shown in FIG. The frame IK is formed with a resin encapsulant 4 in which a semiconductor element (not shown) is sealed with a portion that will become the external lead 1 exposed. The outline shape is determined by the frame body IK, and ΔusC is attached to the side surface 5 of the P frame 2.

このような構造をし九リードフレーム２を第２図（６）
及び同図＠に示す如く、Δす６の部分を所定圧で押圧す
るように１　リードフレーム２の幅とほぼ等しい間隔で
回転自在に対設した溝付ｐ−ラＪ　ＩＩ　、　Ｉ　ＯＣ
）周面に形成されたＶ＠ＪＯａ＋１０＆でリードフレー
ム１０両側部を把持するようにして挾持せしめる。Figure 2 (6) shows nine lead frames 2 with this structure.
As shown in the same figure @, grooved p-ra JII, IOC are rotatably arranged opposite each other at intervals approximately equal to the width of the lead frame 2 so as to press the Δspace 6 with a predetermined pressure.
) Clamp both sides of the lead frame 10 with the V@JOa+10& formed on the circumferential surface.

ここで、溝付ｐ−ツｘＯ，１０の数としては、リードフ
レーム２の両側面５．５に付着し九／ｆ９ＩＯ量、付着
強度等に応じて適宜設定するのが望まし−。Ｖ溝ＪＯａ
、２４１ｍの深さ及び形状は、Δす５の材質、リードフ
レーム２の肉厚等に応じて適宜設定するのが望ましい。Here, it is desirable that the number of the grooved P-ts xO,10 be set appropriately depending on the amount of 9/f9IO attached to both side surfaces 5.5 of the lead frame 2, the adhesion strength, etc. V groove JOa
, 241 m are preferably set appropriately depending on the material of the Δs 5, the wall thickness of the lead frame 2, etc.

溝付ローラ１０．１ａの材質としては、超硬合金、セラ
電ツタス等を使用するのが望ましい。溝付口−’）Ｉａ
、１０は、その使用頻度に応じて新しいものと取替える
のが望ましい。溝付口ｉうＪ　＃　、　Ｊ　ａｆｌｃよ
る具りＣへの押圧力は、対向する溝付四−ツ１０，１０
の押圧ばねの強さを図示しないレバー中ばね等の手ｉＲ
Ｋよって変化させて所定値に設定する。As the material of the grooved roller 10.1a, it is preferable to use cemented carbide, Ceradentsutasu, or the like. Grooved mouth-')Ia
, 10 are preferably replaced with new ones depending on the frequency of use. The pressing force of the grooved openings 10 and 10 on the fittings C by the grooved openings 10 and 10
The strength of the pressure spring of the lever (not shown) is determined by hand iR.
K and set to a predetermined value.

次いで、リードフレーム２を上下方向から対向するベル
）７７、ＪＪ等の移送手段で挾持して火工＠に向けて移
送する。Next, the lead frame 2 is held by vertically opposing transfer means such as bells 77 and JJ and transferred toward the pyrotechnic site.

次に、溝付ローラ１０，１０のＶ溝１０＆。Next, the V groove 10& of the grooved rollers 10,10.

１０ａでパリＣを押圧し良状態で、ベルト１１゜１１に
より溝付ローラ１８，１０を設けた抑圧部から導出され
て来たり−ＩＰ７レーム２の両側面に、第３図（２）及
び同図（２）に示す如く、回転自在に対設され九Δす取
ｐ刃１１．１１の刃先部ＪｊａｔＪｊ＆を圧接せしめる
。3 (2) and the same as shown in FIG. As shown in FIG. 2, the cutting edge portions JjatJj& of the nine Δ slotted p blades 11.11 are rotatably arranged opposite each other and pressed against each other.

ここで、パリ＊ｂ刃１１．１１をリードフレーム２に圧
接する圧力は、濤付讐−ツＪ　Ｏ，１０の場合と同様に
図示しないレバーやばね等の手段により、対向するパリ
取）刃１１．１：ｌの押圧ばねの強さを変化させて所定
値に設定する。Here, the pressure that presses the paring blade 11.11 against the lead frame 2 is applied to the opposing paring blade by means such as a lever or a spring (not shown), as in the case of the cutting edge JO, 10. 11.1: Change the strength of the pressure spring 1 and set it to a predetermined value.

パリ取り刃１２の刃先部１１８は、円柱状の／寸す取り
刃形成素材に刃先角ｒが鈍角になるように切欠面を形成
して作る。刃先角ｒを鈍角に設定するのは、パリーの除
去に伴ってリードフレーム２の側面１が損傷されるのを
防止ずみと共に、刃先部１２１の摩耗による欠損を抑え
るえめである。なお、刃先角ｒとは、１８０°からパリ
０刃１２の外周面とリードフレーム２の側面５で形成さ
れたすくい角に９０°を加えた角αと、リードフレーム
２０側面５とパリ取シ刃１２の切欠面とで形成され九逃
げ角βを引いたものである。パリ取〉刃１２の材質とし
ては、超硬合金やセラ？、クス等を使用するのがＪｉｌ
ｔし−。ｔた、ΔすＩＲ６処理Ｏｓ１度に応じてパリ取
〉刃ｘｘ、ｘｘを上下動させて常に新しい刃先部１１畠
、１２畠がソー１’フレーム２の側面に圧接するように
する。The cutting edge portion 118 of the deburring blade 12 is made by forming a notch surface in a cylindrical/sizing blade forming material so that the cutting edge angle r becomes an obtuse angle. The purpose of setting the cutting edge angle r to be an obtuse angle is to prevent the side surface 1 of the lead frame 2 from being damaged due to the removal of the parry, and to suppress chipping of the cutting edge portion 121 due to wear. Note that the cutting edge angle r is the angle α obtained by adding 90° to the rake angle formed by the outer peripheral surface of the paring zero blade 12 and the side surface 5 of the lead frame 2 from 180°, and the angle α obtained by adding 90° to the rake angle formed by the outer circumferential surface of the paring zero blade 12 and the side surface 5 of the lead frame 20, and the side surface 5 of the lead frame 20 and the paring plate It is formed by the notch surface of the blade 12, minus the nine clearance angle β. Is the material of the paring blade 12 cemented carbide or ceramic? , etc. is used.
t-. The deburring blades xx and xx are moved up and down according to the IR6 treatment Os1 degree so that the new cutting edge portions 11 and 12 are always pressed against the side surface of the frame 2 of the saw 1'.

このようにパリ６の付着し九リードフレーム２０両側面
５．５に溝付−−２１ｍ、１０を押圧することによシパ
リＣを除去し中すｉ状態に押し潰しておき、小さな２９
ｇ％はこの段階で除去してしまう。次−で、ベルト１１
．１１等でリードフレーム１を次工程に向けて移送する
と共に、押し潰されたパリｇＫ、ｅす取シ刃１２゜１１
を圧接することくよ）、・極めて容易にパリＣの自動除
去を行うことかでＩＩ、１１゜その結果、このＡ９１１
にり工程の前後の工程を一連に自動化させて作業性を著
しく向上させることができる。In this way, the lead frame 20 with grooves 6 on both sides 5.5 is removed by pressing the lead frame 20 with grooves 21m and 10, crushed into a medium state, and a small 29
g% is removed at this stage. Next, belt 11
．． 11 etc., the lead frame 1 is transferred to the next process, and the crushed holes gK, e slotting blade 12° 11
II. 11゜As a result, this A911
Work efficiency can be significantly improved by automating a series of processes before and after the nipping process.

発明の詳細 な説明した如く、・本発明に係るリードフレームの１１
面Δり取９方法によれば、パリ取）作業を自動化してパ
９ＪＩＥｊ）工程の前後の工程を連結して各々の工程の
自動化によって着しく作業性を向上させることができる
等顕著な効果を奏するものである。As described in detail of the invention, 11 of the lead frame according to the present invention
According to the surface delta chamfering method 9, it has remarkable effects such as automating the deburring process and connecting the processes before and after the process and automating each process to improve work efficiency. It is something that plays.

【図面の簡単な説明】[Brief explanation of drawings]

第１Ｅ（２）は、ΔすＯ付着したリードフレーム同図（
２）は、同パリ取〕部の平面図である。 １−枠体、２−リードフレーム、１−外部リード、４−
・樹脂封止体、１・−側面、−一パリ、ト、１：Ｗ−Δ
す＊ｂ刃、１１ａ−刃先部。 出願人代理人　　弁理士　鈴　江　武　彦１：：：１ 第１図 （８） １９３1E(2) is the lead frame with ΔSO attached (
2) is a plan view of the paring section. 1-frame body, 2-lead frame, 1-external lead, 4-
・Resin sealing body, 1・-side, -1 par, 1: W-Δ
S*b blade, 11a-blade tip. Applicant's agent Patent attorney Takehiko Suzue 1:::1 Figure 1 (8) 193

Claims (1)

【特許請求の範囲】[Claims] リードフレームの側面に形成され九パリを押圧する工程
と、前記パリを押圧した状態で前記リードフレームを次
工程に移送する工程と、移送中の押圧された前記パリに
パリ取シ刃の刃先部を圧接せしめる工程とを具備するこ
とを特徴とするリードフレームの側面パリ取り方法。A process of pressing nine holes formed on the side surface of the lead frame, a step of transferring the lead frame to the next process with the holes pressed, and a cutting edge of a deburring blade on the pressed holes during transfer. A method for removing burr from a side surface of a lead frame, comprising the steps of:
JP566982A 1982-01-18 1982-01-18 Method for deburring lead frame side Granted JPS58123743A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP566982A JPS58123743A (en) 1982-01-18 1982-01-18 Method for deburring lead frame side

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP566982A JPS58123743A (en) 1982-01-18 1982-01-18 Method for deburring lead frame side

Publications (2)

Publication Number Publication Date
JPS58123743A true JPS58123743A (en) 1983-07-23
JPS6351389B2 JPS6351389B2 (en) 1988-10-13

Family

ID=11617504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP566982A Granted JPS58123743A (en) 1982-01-18 1982-01-18 Method for deburring lead frame side

Country Status (1)

Country Link
JP (1) JPS58123743A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE43443E1 (en) * 1992-03-27 2012-06-05 Renesas Electronics Corporation Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two
CN114227273A (en) * 2021-12-20 2022-03-25 广东富盛达智能科技有限公司 Trimming and surface treatment device for middle frame of mobile phone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE43443E1 (en) * 1992-03-27 2012-06-05 Renesas Electronics Corporation Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two
CN114227273A (en) * 2021-12-20 2022-03-25 广东富盛达智能科技有限公司 Trimming and surface treatment device for middle frame of mobile phone

Also Published As

Publication number Publication date
JPS6351389B2 (en) 1988-10-13

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