JPS5811773A - Plating method of nonconductive member - Google Patents

Abstract

PURPOSE:To form a metallic layer which is satisfactory in its adherence property to a nonconductive member, by executing a chemical etching treatment of an ABS resin coating film on the surface of the nonconductive member, and after that, executing electroless metallic plating. CONSTITUTION:As for a nonconductive member, plastic moldings, woodworking goods, china and porcelain, glass products, etc. are applicable. As for ABS resin, that of 20-30% butadiene is suitable, and it is melted in an organic solvent of methyl ethyl ketone, etc. within a range in which its concentration becomes about 20-80%, is applied thinly on an area to be plated, of the nonconductive member, and a coating film of about 10-100mum is formed by volatilizing the solvent. To the formed coating film, such pretreatments as chemical etching, neutralization, sensitizing treatment, rinsing, activating treatment, formalin treatment, etc., are executed in order, and after that, electroless metallic plating is executed. Also, as necessary, it is also possible to form a metallic layer on the metallic layer formed by the electroless plating, by means of electric plating.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of plating non-conductive members, and in particular, to a non-conductive member that can form a plating layer with good adhesion to a container on a plastic molded product that is difficult to plate. This invention relates to a method of plating a member.

AB8 (acrylonitrile-butadiene-styrene)
The resin is used as a base resin for plastic molded products that require a metal surface because many fine pores are formed on the surface by chemical etching with strong acids and the plating layer has excellent adhesion by electroless plating. It is commonly used.

However, λB8 resin is expensive compared to, for example, vinyl chloride resin, and using ABS resin as a base resin solely for the purpose of plating increases the cost of the product, which is undesirable. If a layer needs to be formed, it is necessary to mask the area to be plated, and a step of removing the mask is required after plating.

On the other hand, it is also known to improve the adhesion of the plating layer by applying liquid honing to mechanically roughen the surface of plastic molded products that are difficult to plate. The problem was that the surface became too rough and the plated surface lacked gloss.

The present invention has been made to address this problem, and is made by applying an ABS resin solution to the area to be plated on a non-conductive member, drying it, and applying AB8 resin. ! a film is formed, and then the AB8
The object of the present invention is to provide a plating method capable of forming a metal layer with good adhesion to a non-conductive member, which comprises chemically etching a resin coating film and then performing electroless metal plating.

Non-conductive members to which the present invention can be applied include plastic molded products, woodwork, ceramics, glass products, and any other material that can be coated with AB8 resin solution. Plastic molded products with good adhesive properties, such as hard vinyl chloride resin molded products, are suitable.

The AB8 resin solution used in the present invention is prepared by adding AB8 resin to an organic solvent such as methyl ethyl ketone at a concentration of 2.
It is dissolved in a range of 0 to 80%, and it is also possible to use it as a thermosetting type by mixing phenol resin, epoxy resin, etc. as necessary.

The AB8 resin to be used is suitably in the range of about 20 to 30% Butashev.

In addition, a viscosity modifier, a thixotropic agent, and other additives may be added to the solution as necessary.

In carrying out the present invention, first, the surface of a non-conductive member to be plated is cleaned by a conventional method.

At this time, AB8 like polyethylene and polypropylene
For plastic molded products that have poor adhesion to resin, the surface may be mechanically roughened by liquid honing, etc., or treated with corona discharge, strong acid, etc. (secondarily, polar groups are introduced to the surface to improve adhesion). You can do it like this.

Next, the above-mentioned ABS resin solution is applied thinly to the area to be plated of the non-conductive member to be plated, and an appropriate heat treatment is performed to volatilize the solvent and form an AB8 coating film.

The coating method can be any method such as dipping, brushing, spraying, etc. In particular, when it is necessary to apply plating in a pattern, screen printing can also be used.

The thickness of the coating film is desirably about 10 to 100 μm when dry, but it may be thicker than this.

In the present invention, the thus formed
After applying B8 resin, the same chemical etching treatment and neutralization as conventionally performed when plating AB8 resin molded products are carried out, followed by sensitivity imparting treatment, activation treatment, formalin treatment, electroless metal treatment, etc. Plating, such as electroless copper plating and electroless nickel plating, is performed to form a metal layer with good adhesion on the surface. Note that, if necessary, a metal layer may be further formed by electroplating on the metal layer formed by electroless plating.

As explained above, in the present invention, an ABS resin coating film capable of forming an electroless metal plating layer with good adhesion is formed on the area to be plated of a non-conductive member, and this AB8 resin proboscis film is coated with an electroless metal plating layer. Since a metal plating layer is formed, it is possible to form a metal plating layer with good adhesion to any non-conductive material that has poor adhesion to the metal plating layer due to electroless metal plating. If the film is selectively formed, complex characters, figures, etc.
Plating of turns can also be done easily.

Next, the second embodiment will be described.

Example: AB8 resin (manufactured by Ube Cycon Co., Ltd., butadiene content 25
%) of 40% methyl ethyl ketone solution and heated at 60°C.
It was dried in a drying chamber to form an ABS resin coating approximately 15 microns thick.

Next, on the hard vinyl chloride resin plate on which this ABS resin coating was formed, the treatment according to the known electroless metal plating method 2, that is, the following treatments, was applied to the surface of the AB8 coating to a thickness of about 2.0 mm.
A copper plating layer of µm was formed.

Neutral sum (10% NaOH)
Room temperature formalin treatment 10% formalin solution at room temperature A copper plating layer was formed by electroplating on the electroless copper plating layer formed over several seconds or more so that the total thickness of the plating layer was 60 seconds. After blowing compressed air onto the copper plating layer formed in this way and air-drying it, A
A test was conducted on the adhesion of the copper plating layer on the B8 coating. The test result was 1.5 Krd (by the beer ring method), and it had the same adhesion force as a copper plating layer to a normal ABS molded product.

On the other hand, the copper plating layer formed on the hard vinyl chloride resin surface without the AB8 coating by electroless plating and electroplating as in the example was easily peeled off by hand rubbing.

Claims (1)

[Claims] 1. Applying an AB8 resin solution to the area to be plated on a non-conductive member, drying it to form an AB8 resin coating film, then chemically etching the AB8 resin coating film, and then performing electroless metal plating. Characteristic method of plating non-conductive materials.