JPS58117355U - Tools for attaching and detaching integrated circuits, etc. - Google Patents
Tools for attaching and detaching integrated circuits, etc.Info
- Publication number
- JPS58117355U JPS58117355U JP1438282U JP1438282U JPS58117355U JP S58117355 U JPS58117355 U JP S58117355U JP 1438282 U JP1438282 U JP 1438282U JP 1438282 U JP1438282 U JP 1438282U JP S58117355 U JPS58117355 U JP S58117355U
- Authority
- JP
- Japan
- Prior art keywords
- tools
- attaching
- integrated circuits
- integrated circuit
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案によるIC着脱用具の構造を示す斜視図
、第2図はIC装置のモールド本体挾持前の側面図、第
3図はIC装置のモールド本体を挾持して引き抜き終っ
た状態を示す図である。
図において1は鉤部、2は突起、3はIC装置モールド
本体、4はIC装置のピン、5はIC装置が実装されて
いるソケット又はプリント板、6は本体部、61は本体
の先端部(鉤部と突起を含゛む)、11は歯を示す。W
は自然状態のときに対 向する歯先の最短間隔、W′は
IC装置モールド本体の幅、Hは突起の中間位置を定め
る高さ、H′はIC装置モールド本体の厚みの寸法を示
す。Fig. 1 is a perspective view showing the structure of the IC attachment/detachment tool according to the present invention, Fig. 2 is a side view of the IC device before the mold body is clamped, and Fig. 3 shows the IC device after the mold body is clamped and pulled out. FIG. In the figure, 1 is a hook part, 2 is a protrusion, 3 is an IC device mold body, 4 is a pin of the IC device, 5 is a socket or printed board on which the IC device is mounted, 6 is a main body part, and 61 is a tip end of the main body. (Including hooks and protrusions), 11 indicates teeth. W
is the shortest distance between opposing tooth tips in the natural state, W' is the width of the IC device mold body, H is the height that determines the intermediate position of the protrusion, and H' is the thickness of the IC device mold body.
Claims (1)
う弾性体よりなる板状本体部と、該本体部の先端に対向
して集積回路等の下面に入り込むように形成された鉤部
と、前記本体部の中間に前記集積回路等の上部に当接し
得る突起が対向して突設されてなることを特徴とする集
積回路等の着脱用具。A plate-shaped main body made of an elastic material that has a U-shape and holds an integrated circuit, etc. at its tip, and a hook part formed to face the tip of the main body and enter the bottom surface of the integrated circuit, etc. and an attachment/detachment tool for an integrated circuit, etc., characterized in that protrusions that can come into contact with the upper part of the integrated circuit, etc. are provided in the middle of the main body to face each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1438282U JPS58117355U (en) | 1982-02-04 | 1982-02-04 | Tools for attaching and detaching integrated circuits, etc. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1438282U JPS58117355U (en) | 1982-02-04 | 1982-02-04 | Tools for attaching and detaching integrated circuits, etc. |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58117355U true JPS58117355U (en) | 1983-08-10 |
Family
ID=30026854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1438282U Pending JPS58117355U (en) | 1982-02-04 | 1982-02-04 | Tools for attaching and detaching integrated circuits, etc. |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58117355U (en) |
-
1982
- 1982-02-04 JP JP1438282U patent/JPS58117355U/en active Pending
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