JPS58112022U - mold stress cone - Google Patents
mold stress coneInfo
- Publication number
- JPS58112022U JPS58112022U JP848182U JP848182U JPS58112022U JP S58112022 U JPS58112022 U JP S58112022U JP 848182 U JP848182 U JP 848182U JP 848182 U JP848182 U JP 848182U JP S58112022 U JPS58112022 U JP S58112022U
- Authority
- JP
- Japan
- Prior art keywords
- stress cone
- mold stress
- reinforcing material
- mold
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cable Accessories (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のケーブル接続部の一部を示す縦断面図、
第2図、第3図はそれぞれ本考案の一実施例を示す縦断
面図と端面図である。 −1・・・ケ
ーブル、2・・・絶縁層、3・・・半導電層、4・・・
絶縁補強体、5・・・半導電層、6・・・モールドスト
レスコーン、7・・・補強材。Fig. 1 is a vertical cross-sectional view showing a part of a conventional cable connection part;
FIGS. 2 and 3 are a longitudinal sectional view and an end view, respectively, showing an embodiment of the present invention. -1...Cable, 2...Insulating layer, 3...Semiconducting layer, 4...
Insulating reinforcement body, 5... Semiconductive layer, 6... Mold stress cone, 7... Reinforcement material.
Claims (1)
レスコーンを一体形成したモールドストレスコーンにお
いて、前記半導電層内に補強材を埋入して成ることを特
徴とするモールドストレスコーン 2 補強材は金属板または金属線から成る実用新案登録
請求の範囲第1項記載のモールドストレスコーン。 3 補強材は円周方向に分割されて埋入される実用新案
登録請求の範囲第1項又は第2項記載のモールドストレ
スコーン。[Claims for Utility Model Registration] 1. A molded stress cone in which a rubber semiconductive layer stress cone is integrally formed on the conical inclined surface of an insulating reinforcing body, in which a reinforcing material is embedded in the semiconductive layer. Mold stress cone 2 characterized by: The mold stress cone according to claim 1, wherein the reinforcing material is made of a metal plate or a metal wire. 3. The molded stress cone according to claim 1 or 2 of the utility model registration claim, in which the reinforcing material is divided and embedded in the circumferential direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP848182U JPS58112022U (en) | 1982-01-25 | 1982-01-25 | mold stress cone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP848182U JPS58112022U (en) | 1982-01-25 | 1982-01-25 | mold stress cone |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58112022U true JPS58112022U (en) | 1983-07-30 |
Family
ID=30021171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP848182U Pending JPS58112022U (en) | 1982-01-25 | 1982-01-25 | mold stress cone |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58112022U (en) |
-
1982
- 1982-01-25 JP JP848182U patent/JPS58112022U/en active Pending
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