JPS58112022U - mold stress cone - Google Patents

mold stress cone

Info

Publication number
JPS58112022U
JPS58112022U JP848182U JP848182U JPS58112022U JP S58112022 U JPS58112022 U JP S58112022U JP 848182 U JP848182 U JP 848182U JP 848182 U JP848182 U JP 848182U JP S58112022 U JPS58112022 U JP S58112022U
Authority
JP
Japan
Prior art keywords
stress cone
mold stress
reinforcing material
mold
embedded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP848182U
Other languages
Japanese (ja)
Inventor
横山 秀敏
Original Assignee
昭和電線電纜株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昭和電線電纜株式会社 filed Critical 昭和電線電纜株式会社
Priority to JP848182U priority Critical patent/JPS58112022U/en
Publication of JPS58112022U publication Critical patent/JPS58112022U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のケーブル接続部の一部を示す縦断面図、
第2図、第3図はそれぞれ本考案の一実施例を示す縦断
面図と端面図である。         −1・・・ケ
ーブル、2・・・絶縁層、3・・・半導電層、4・・・
絶縁補強体、5・・・半導電層、6・・・モールドスト
レスコーン、7・・・補強材。
Fig. 1 is a vertical cross-sectional view showing a part of a conventional cable connection part;
FIGS. 2 and 3 are a longitudinal sectional view and an end view, respectively, showing an embodiment of the present invention. -1...Cable, 2...Insulating layer, 3...Semiconducting layer, 4...
Insulating reinforcement body, 5... Semiconductive layer, 6... Mold stress cone, 7... Reinforcement material.

Claims (1)

【実用新案登録請求の範囲】 1 絶縁補強体の円錐状傾斜面にゴム質の半導電層スト
レスコーンを一体形成したモールドストレスコーンにお
いて、前記半導電層内に補強材を埋入して成ることを特
徴とするモールドストレスコーン 2 補強材は金属板または金属線から成る実用新案登録
請求の範囲第1項記載のモールドストレスコーン。 3 補強材は円周方向に分割されて埋入される実用新案
登録請求の範囲第1項又は第2項記載のモールドストレ
スコーン。
[Claims for Utility Model Registration] 1. A molded stress cone in which a rubber semiconductive layer stress cone is integrally formed on the conical inclined surface of an insulating reinforcing body, in which a reinforcing material is embedded in the semiconductive layer. Mold stress cone 2 characterized by: The mold stress cone according to claim 1, wherein the reinforcing material is made of a metal plate or a metal wire. 3. The molded stress cone according to claim 1 or 2 of the utility model registration claim, in which the reinforcing material is divided and embedded in the circumferential direction.
JP848182U 1982-01-25 1982-01-25 mold stress cone Pending JPS58112022U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP848182U JPS58112022U (en) 1982-01-25 1982-01-25 mold stress cone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP848182U JPS58112022U (en) 1982-01-25 1982-01-25 mold stress cone

Publications (1)

Publication Number Publication Date
JPS58112022U true JPS58112022U (en) 1983-07-30

Family

ID=30021171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP848182U Pending JPS58112022U (en) 1982-01-25 1982-01-25 mold stress cone

Country Status (1)

Country Link
JP (1) JPS58112022U (en)

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