JPS58110370U - Segment type diamond cutting wheel - Google Patents

Segment type diamond cutting wheel

Info

Publication number
JPS58110370U
JPS58110370U JP11370381U JP11370381U JPS58110370U JP S58110370 U JPS58110370 U JP S58110370U JP 11370381 U JP11370381 U JP 11370381U JP 11370381 U JP11370381 U JP 11370381U JP S58110370 U JPS58110370 U JP S58110370U
Authority
JP
Japan
Prior art keywords
diamond cutting
type diamond
recesses
cutting wheel
segment type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11370381U
Other languages
Japanese (ja)
Inventor
植野　雅宣
Original Assignee
呉レヂノイド株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 呉レヂノイド株式会社 filed Critical 呉レヂノイド株式会社
Priority to JP11370381U priority Critical patent/JPS58110370U/en
Publication of JPS58110370U publication Critical patent/JPS58110370U/en
Pending legal-status Critical Current

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  • Polishing Bodies And Polishing Tools (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

シ　　　第１図は本考案＆千係る切断砥石の一部を切欠
いｎ　　た正面図、第２図”は第１図のＩ−Ｉ線断面図
であ２　　る。 コ　　　１・・・・・・円盤、２・・・・・・凹所、３
・・・・・・貫通孔、４・・・ｌ　　・・・セグメント
チップ。Fig. 1 is a partially cutaway front view of the cutting wheel according to the present invention, and Fig. 2 is a sectional view taken along the line I-I of Fig. 1.・Disc, 2...Concavity, 3
...Through hole, 4...l...Segment chip.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 円周上に適当間隔で切込凹所２を形成した日歩１の切込
凹所間の周縁部に１乃至数個の適当形士をなす貫通孔３
を穿設し、ダイヤモンド砥粒と４属粉末の混合物を凹所
間の上記円盤周縁部に貫Ｍ孔３を覆うように充填して所
定形状に加圧成形しこれを焼成して焼結し、基部が貫通
孔を通してＰ盤周縁に一体的に結合されるセグメントチ
ップ補を形成したセグメントタイプのダイヤモンド切断
雷　　砥石。One to several through-holes 3 formed in an appropriate shape are formed on the peripheral edge between the notch recesses 1 in which recesses 2 are formed at appropriate intervals on the circumference.
A mixture of diamond abrasive grains and Group 4 powder is filled in the circumference of the disk between the recesses so as to cover the through-M hole 3, and the mixture is press-formed into a predetermined shape and fired to sinter. , a segment-type diamond cutting lightning whetstone in which the base formed a segment tip complement that is integrally connected to the periphery of the P plate through a through hole.
JP11370381U 1981-07-29 1981-07-29 Segment type diamond cutting wheel Pending JPS58110370U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11370381U JPS58110370U (en) 1981-07-29 1981-07-29 Segment type diamond cutting wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11370381U JPS58110370U (en) 1981-07-29 1981-07-29 Segment type diamond cutting wheel

Publications (1)

Publication Number Publication Date
JPS58110370U true JPS58110370U (en) 1983-07-27

Family

ID=30101213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11370381U Pending JPS58110370U (en) 1981-07-29 1981-07-29 Segment type diamond cutting wheel

Country Status (1)

Country Link
JP (1) JPS58110370U (en)

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