JPS58110100A - Device for packaging electronic part - Google Patents

Device for packaging electronic part

Info

Publication number
JPS58110100A
JPS58110100A JP21380181A JP21380181A JPS58110100A JP S58110100 A JPS58110100 A JP S58110100A JP 21380181 A JP21380181 A JP 21380181A JP 21380181 A JP21380181 A JP 21380181A JP S58110100 A JPS58110100 A JP S58110100A
Authority
JP
Japan
Prior art keywords
chuck
electronic component
electronic components
lower chuck
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21380181A
Other languages
Japanese (ja)
Inventor
浜野 明
山村 正己
毅 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21380181A priority Critical patent/JPS58110100A/en
Publication of JPS58110100A publication Critical patent/JPS58110100A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container Filling Or Packaging Operations (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はコイル製品等の電子部品で特に端子板の面が凹
凸のある電子部品を多連で整列させて箱詰めする装置に
関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for arranging and boxing multiple electronic components such as coil products, especially electronic components whose terminal boards have uneven surfaces.

従来は、コンベア等によ9第2図の如く並べられた電子
部品0)を箱詰めする場合は、第3図の如く、吸盤(至
)等の吸引力を利用して1偏又は多連で箱詰めする方式
が一般的である。ところが、電子部品ωの端子板に第1
図の如く凹凸がある場合は。
Conventionally, when packing electronic components arranged on a conveyor, etc., as shown in Figure 2, they are packaged in single or multiple rows using the suction force of a suction cup, etc., as shown in Figure 3. Packing in boxes is common. However, there is a first error on the terminal board of electronic component ω.
If there are irregularities as shown in the figure.

吸盤(乃等の吸引力を利用出来ない、又、メカニズムに
よる保持方法として、第4図に示す様に揺動可能な一対
の保持パー(3) +41で保持する方法があるが、こ
の方法によると、第2図のコンベアとから取出す際に、
l1lI!l1合せの方向(Y方向)で保持パー(至)
(41が電子部品と接触して不都合を生じる。一方、第
5図に示すように、第2図におけるX方向に相対接近離
間移動する保持ビニS材(61+71で保持する方法は
、樹脂成形箱(6)に接触しない程度の高さから電子部
品0)を落下させるため、多連時の整列性に問題が生じ
る。
As a holding method in which the suction force of a suction cup or the like cannot be used, or by a mechanism, there is a method of holding with a pair of swingable holding pars (3) +41 as shown in Fig. 4. When taking it out from the conveyor shown in Figure 2,
l1lI! Hold par (to) in the direction of l1 alignment (Y direction)
On the other hand, as shown in Fig. 5, the holding vinyl S material (61 + 71) that moves relatively toward and away from the X direction in Fig. Since the electronic component 0) is dropped from a height that does not touch the electronic component 0), a problem arises in alignment when multiple electronic components are connected.

本発明は、これらの欠点を解消し、端子板面に凹凸があ
る電子部品を多連で整列した状態で箱詰めできる装置の
提供を目的とする。
SUMMARY OF THE INVENTION The present invention aims to eliminate these drawbacks and provide an apparatus that can package electronic components having uneven terminal board surfaces in multiple arrays in a box.

本発明は、この目的を達成するものとして、端子ピンを
植設した電子部品の端子ヒレ」゛保持する相対的に接近
離間可能なとチャックと下チャックを備え、下チャック
を端子ピンの軸心方向に移動可能に構成し、電子部品の
端子ピンを上チャックと下チャックで挾持して電子部品
を保持し1箱詰め時には下チャックを移動させることに
より′に、子部品1静かに箱内に入れる様にした電子部
品の箱詰め装置を提供する。
To achieve this object, the present invention includes a chuck and a lower chuck that can be moved toward and away from each other to hold the terminal fin of an electronic component in which a terminal pin is implanted, and the lower chuck is centered around the axis of the terminal pin. The terminal pin of the electronic component is held between the upper chuck and the lower chuck to hold the electronic component, and when packing a single box, the lower chuck is moved to gently place the child component 1 into the box. To provide a boxing device for electronic components with various types.

以下1本発明の一実施例を第6図乃至第8図に基づき詳
細に説明する。第6図において1図示されていないモー
ターおよびギヤーにょ9回転されるギヤー11と連動す
るカムI、・−が設けられ、回転するカム(l曽はカム
フォロア休りの取付いた第1昇降杆(S)をスプリング
(1!Ia)の付勢力に抗して昇降させ、この第2昇降
杆(組に連結されたとチャツプ(川のシリコンゴム−を
と下動させる0回転するカム〇4はカムフオローアシl
の取付いた第2昇降杆(8)をスプリング(llb)の
付勢力に抗して昇降させ、この第1昇降杆(8)に連結
された下チャック−を1下動させる。以102つの動作
を組み合せ、上チャック囲の下降と下チャック・jの1
昇によ多電子部品α)の端子ビンを保紳する。その際、
◆連の電子部品■の端子ビンに”ηビン位置、ビン曲が
9等のばらつきがあり、それらを吸収するためシリコン
ゴム1121ft設けである。シリンダー−は前述の上
チャック(ill 、下チャックー等のユニツ)Ht−
h下動させ、コンベア(lη上より電子部品ωを持ちと
げるためのものである。シリンダー00は持ちとげられ
た電子部品(1) ffiコンベア0TIJニーから相
詰め位置へ移動させるためのものである。またAil記
下チャック03は前記ユニット(財)に支点中まわりに
揺動可能に設けられた揺動体−に装着されており、シリ
ンダーによりこの揺動体(社)を揺動させることにより
前記チャック(l11から離間する方向に端子ビンの軸
心方向に移動せしめられる。
An embodiment of the present invention will be described in detail below with reference to FIGS. 6 to 8. In FIG. 6, there are provided cams I, . ) is raised and lowered against the biasing force of the spring (1! Ia), and the cam 〇4, which rotates 0 and moves down the second lifting rod (silicon rubber) connected to the second lifting rod, is the cam follower assembly.
The second lifting rod (8) to which is attached is raised and lowered against the biasing force of the spring (llb), and the lower chuck connected to the first lifting rod (8) is moved down one step. By combining the above 102 operations, lowering the upper chuck surround and lowering the lower chuck j.
At the same time, protect the terminal pins of multiple electronic components α). that time,
◆There are variations in the terminal pins of the series electronic parts ■ such as 9 in the position and the bend of the pins, and 1121 ft of silicone rubber is provided to absorb these variations.The cylinders are equipped with the aforementioned upper chuck (ill, lower chuck, etc.). Units) Ht-
Cylinder 00 is for moving the electronic component ω from above the conveyor (lη). Cylinder 00 is for moving the lifted electronic component (1) ffi from the conveyor 0TIJ knee to the phase filling position. In addition, the Ail chuck 03 is attached to a rocking body which is provided in the unit (incorporated) so as to be able to swing around a fulcrum, and by swinging this rocking body (corporate) with a cylinder, the chuck can be rotated. (It is moved in the axial direction of the terminal bin in the direction away from l11.

以との構成において、コンベア071Eで整列された電
子部品0)を箱Q21に箱詰めするには、コンベア(1
71Lの電子部品(1)の端子ビンを1述の如くとチャ
ック(11)と下チャック(l31で保持し1次いでシ
リンダtJ−にてユニット(財)全体’th昇させて電
子部品(1) lr:持ちEげ、シリンダ(161にて
箱詰め位置り方にもたらし、その後シリンダ時によりユ
ニツ)124i下降させて、第7図の如く電子部品(1
)を和@の収容空間に位置せしめる。その後下チャック
−がシリンダー−により支点(ハ)まわりに1円弦運動
せしめられ、電子部品(1)は第8図のように箱(ハ)
に収まる。
In the above configuration, in order to pack the electronic components 0) arranged on the conveyor 071E into the box Q21, the conveyor (1
Hold the terminal pin of the 71L electronic component (1) with the chuck (11) and the lower chuck (131) as described in 1, and then raise the entire unit (goods) using the cylinder tJ- to lift the electronic component (1). lr: Lift the cylinder (161) to the boxing position, then lower the cylinder (124i) to place the electronic components (1) as shown in Figure 7.
) is located in the accommodation space of W@. Thereafter, the lower chuck is moved by the cylinder around the fulcrum (C) in a circular motion, and the electronic component (1) is placed in the box (C) as shown in Figure 8.
fits in.

以との方法を用いれば、多連で繁多11シた状■での電
子部品を箱詰めすることができる。
By using the method described above, it is possible to package electronic components in multiple series, often in the form of 11 sheets.

本発明の電子部品の箱詰め装置によれば、以との説明か
ら明らかな様に、端子板面に凹凸がある電子部品であっ
ても多連で整列した状態で箱詰めでき、箱詰修業の能率
が大巾に向トし、工業的価値が大である。
According to the electronic component boxing device of the present invention, as is clear from the explanation below, even electronic components with uneven terminal board surfaces can be packed in multiple series in an aligned state, increasing the efficiency of packaging training. It is suitable for large-scale use and has great industrial value.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は電子部品の外観図、第2図はコンベアに並べら
れた電子部品の平面因、第3図乃至第5図は従来の箱詰
め装置O概略説明図、第6図は本発明に係る箱詰装置の
概略構成を示す斜視図、第7図、第8因は動作説明図で
ある。 (1)・・・電子部品、 (ill・−とチャック、錦
−シリコンゴム、Q3−・−下チャック、−−箱、−−
支点、−・−揺動体 代理人   森  本  義  弘 第1図 Yち句
Fig. 1 is an external view of electronic components, Fig. 2 is a plan view of electronic components arranged on a conveyor, Figs. A perspective view showing a schematic configuration of the packaging device, FIG. 7, and the eighth factor are operation explanatory diagrams. (1)...Electronic parts, (ill・- and chuck, brocade silicone rubber, Q3-・-lower chuck, --box, --
Fulcrum, - - Oscillating body agent Yoshihiro Morimoto Figure 1 Ychi phrase

Claims (1)

【特許請求の範囲】 ! 端子ビyを植設した電子部品の端子ピンを保持する
相対的に接近離間可能な1チヤツクと下チャックを備え
、下チャックを端子ピンの軸心方向に移動可能に構成し
てなる電子部品の箱め 帆装置。
[Claims]! An electronic component comprising a chuck and a lower chuck that can be moved relatively toward and away from each other to hold a terminal pin of an electronic component in which a terminal pin y is implanted, and the lower chuck is configured to be movable in the axial direction of the terminal pin. Box sail device.
JP21380181A 1981-12-23 1981-12-23 Device for packaging electronic part Pending JPS58110100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21380181A JPS58110100A (en) 1981-12-23 1981-12-23 Device for packaging electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21380181A JPS58110100A (en) 1981-12-23 1981-12-23 Device for packaging electronic part

Publications (1)

Publication Number Publication Date
JPS58110100A true JPS58110100A (en) 1983-06-30

Family

ID=16645265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21380181A Pending JPS58110100A (en) 1981-12-23 1981-12-23 Device for packaging electronic part

Country Status (1)

Country Link
JP (1) JPS58110100A (en)

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