JPS5810813A - Condenser - Google Patents

Condenser

Info

Publication number
JPS5810813A
JPS5810813A JP10983481A JP10983481A JPS5810813A JP S5810813 A JPS5810813 A JP S5810813A JP 10983481 A JP10983481 A JP 10983481A JP 10983481 A JP10983481 A JP 10983481A JP S5810813 A JPS5810813 A JP S5810813A
Authority
JP
Japan
Prior art keywords
film
adhesive
capacitor
glue
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10983481A
Other languages
Japanese (ja)
Other versions
JPH0252420B2 (en
Inventor
荒木 康正
久米 信行
恵 三浦
一志 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP10983481A priority Critical patent/JPS5810813A/en
Publication of JPS5810813A publication Critical patent/JPS5810813A/en
Publication of JPH0252420B2 publication Critical patent/JPH0252420B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/14Organic dielectrics
    • H01G4/145Organic dielectrics vapour deposited
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/32Wound capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明はプラスチックフィルムコンデンサ又は、絶縁紙
コンデンサ(以下総称してフィルムコンデンサ)の誘電
体及び保護材料に関するもので、その目的とするところ
は誘電1体相互間又は保護材料相互間の密着性及び誘電
体と電極の密着性を良くし、コンデンサの短絡や誘電正
接悪化の防止、絶縁抵抗の低下を防止し静電容量のバラ
ツキが少なく高性能となると共に作業性が従来と比較し
て低下することのないようにしようとするものである。
Detailed Description of the Invention The present invention relates to a dielectric material and a protective material for a plastic film capacitor or an insulating paper capacitor (hereinafter collectively referred to as a film capacitor), and its purpose is to protect the dielectric materials between one dielectric material or the protective material. It improves the adhesion between each other and the adhesion between the dielectric and the electrodes, prevents short circuits of the capacitor, deterioration of the dielectric loss tangent, and decreases in insulation resistance, resulting in less variation in capacitance, higher performance, and easier workability than before. The aim is to ensure that there is no decline compared to the

プラスチックフィルム又は、金属化プラスチックフィル
ム又は、絶縁紙又は、金属化絶縁紙(以下総称してフィ
ルム)を使用するフィル上コンデンサにおいては、捲回
もしくは積層した素子をカロ熱と加圧により成型して成
るが、従来のフィルムを使用したコンデンサでは、成型
後でも誘電体相互間又は、保護フィルム相互間、及び誘
電体と電極との密着が不完全であった。
For on-fill capacitors that use plastic film, metallized plastic film, insulating paper, or metallized insulating paper (hereinafter collectively referred to as film), the wound or laminated elements are molded by heat and pressure. However, in capacitors using conventional films, even after molding, the adhesion between the dielectrics or between the protective films, and between the dielectrics and the electrodes was incomplete.

密着が不完全である場合には、次のような常客がみられ
る。
When close contact is incomplete, the following types of regular customers are seen.

(1)金属溶射によるメタリコン工程において、メタリ
コン粒子がフィルム間隙へ侵入し、コンデンサが短絡す
る0 (2) メタリコン工程において、素子側面をメタリコ
ン粒子が流れないように、素子にマスキングを行なうが
、メタリコン後、このマスキングを除去する際に保護フ
ィルムの剥離が発生肱後工程における作業性及び外観上
の問題となる。
(1) In the metallicon process using metal spraying, metallicon particles enter the film gap and short-circuit the capacitor. (2) In the metallicon process, the device is masked to prevent metallicon particles from flowing along the sides of the element, but Later, when this masking is removed, peeling of the protective film occurs, which poses problems in terms of workability and appearance in the subsequent process.

本発明は上記のような従来の問題を解決したもので、誘
電体フィルム、もしくは保護フィルムとして表面に常温
では非粘着で、且つ60°C以上で粘着性を有する糊(
例えば、変成エーテル型ポリエステル樹脂)をコーティ
ングしたフィルムを使用し、熱成型時の熱でフィルム相
互間又はフィルムと電極が密着するようにしたものであ
る。岡、常温でも粘着性を有する糊を使用するとフィル
ム巻取り工程等、熱成型以前の工程において著しく作業
性及び歩留シを低下させる。
The present invention solves the above-mentioned conventional problems, and uses glue (which is non-adhesive at room temperature and adhesive at temperatures above 60°C) to be used as a dielectric film or protective film on the surface.
For example, a film coated with a modified ether type polyester resin (modified ether type polyester resin) is used, and the heat during thermoforming brings the films into close contact with each other or the film and the electrode. However, if a glue that is sticky even at room temperature is used, workability and yield will be significantly reduced in the film winding process and other processes prior to thermoforming.

糊が粘着性を有する最低温度の設定は、第1図に示すよ
うに熱成型以前の工程の作業性(縦軸)が従来のフィル
ムを使用した場合と比較して粘着力発生温度〔横軸)を
60°Cとした場合に同一となるので、この値を選んだ
。尚(イ)は従来フィルム使用時の作業性100%の線
を示す。
The setting of the lowest temperature at which the glue becomes sticky is determined by the workability of the process before thermoforming (vertical axis) as shown in Figure 1, compared to the case where conventional film is used. ) was set to 60°C, so this value was chosen. Note that (a) shows the line of 100% workability when using conventional film.

第2図は本発明の一実施例で、捲回型コンデンサの素子
(1)に対する外周保護フィルム<2)の材料として、
本発明の常温非粘着で且つ、60°Cで粘着性を有する
糊(3)を表面にコーティングしたフィルムを使用した
場合の図である。第3図はメタリコン工程におけるマス
キングを除去した後のフィルム剥離状態を示す図で、(
1)は素子、(31は常温非粘着で且つ6000で粘着
性を有する糊を示す。
FIG. 2 shows an embodiment of the present invention, in which the material for the outer periphery protective film <2) for the element (1) of a wound capacitor is
It is a figure when using the film whose surface was coated with the glue (3) of the present invention which is non-adhesive at room temperature and adhesive at 60°C. Figure 3 is a diagram showing the state of film peeling after removing the masking in the metallcon process.
1) indicates an element, and (31 indicates a glue that is non-adhesive at room temperature and tacky at 6000).

以上のように本発明の常温非粘着で且つ60°C以上で
粘着性を有する糊を表面にコーティングしたフィルムを
保護フィルムとして使用すれば、フィルム剥離が大幅に
低減され、後工程における作業性及び外観上の歩留に大
きく貢献するようになった。すなわち、保護フィルム剥
離の発生率は従来のフィルムを使用した場合は5.8%
だったのに対し、本発明の糊を表面にコーティングした
フィルムを使用した場合0.02%に低減された。又、
この常温非粘着で且つ60°C以上で粘着性を有する糊
を巻始め部保護フィルム及び誘電体フィルムにコーティ
ングして使用すれば、メタリコン粒子のフィルム間隙へ
の侵入による可ンデンサの短絡や誘電正接(TANJ 
)悪化を防止でき、第4図(a)で、(イ)は本発明品
、(ロ)は従来品を示す。又外装樹脂の侵入による絶縁
抵抗(IR)の低下も防止可能となった。第4図(b)
では(イ)の本発明品、幹)は従来品を示す。空気間隙
の少ない均一的な成型が可能となるため、静電容量のバ
ラツキが少なくコロナ開始電圧(第4図(0)参照)及
び短時間破壊電圧の(第4図(d)参照)の高いコンデ
ンサを提供することができた。
As described above, if the film of the present invention coated with the adhesive that is non-tacky at room temperature and sticky at temperatures above 60°C is used as a protective film, peeling of the film will be greatly reduced, and workability in post-processing will be improved. This has greatly contributed to the appearance yield. In other words, the incidence of protective film peeling is 5.8% when using conventional film.
On the other hand, when a film whose surface was coated with the glue of the present invention was used, it was reduced to 0.02%. or,
If this adhesive, which is non-adhesive at room temperature and sticky at temperatures above 60°C, is used by coating the protective film at the beginning of winding and the dielectric film, short-circuiting of the capacitor and dielectric loss tangent due to metallicon particles entering the gaps between the films can be avoided. (TANJ
) Deterioration can be prevented. In FIG. 4(a), (a) shows the product of the present invention and (b) shows the conventional product. It is also possible to prevent the insulation resistance (IR) from decreasing due to the intrusion of the exterior resin. Figure 4(b)
Here, (a) shows the product of the present invention, and main part) shows the conventional product. Uniform molding with few air gaps is possible, resulting in less variation in capacitance and higher corona onset voltage (see Figure 4 (0)) and short-time breakdown voltage (see Figure 4 (d)). We were able to provide capacitors.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は糊の粘着性が発生する温度と、熱成型工程以前
の工程における作業性との関係を示す図、第2図は本発
明の常温非粘着で且つ60°C以上で粘着性を有する糊
を、表面にコーティングしたフィルムを捲回型コンデン
サの保護フィルムとして使用した時の巻取り状態を示す
斜視図、第3図はメタリコン時のマスキングを除去する
際に保護フィルムが剥離した状態を示す斜視図、第4図
はコンデンサーの一次特性を本発明品(イ)と従来品(
ロ)と比較して示した図で、(a)は誘電正接(TAX
IΔ)、(b)は絶縁抵抗(IR)、(e)は静電容量
、(d)はコロナ開始電圧、’ (e)は短時間破壊電
圧を示す図である0(1)・・・素子、(2)・・・保
護フィルム、(3)・・・常温非粘着糊付保護フイルム 第4 (b) (C) (d)
Figure 1 shows the relationship between the temperature at which glue becomes sticky and workability in processes before the thermoforming process, and Figure 2 shows the relationship between the temperature at which glue becomes sticky and workability in processes before the thermoforming process. A perspective view showing the state in which a film coated with adhesive on the surface is used as a protective film for a wound type capacitor. The perspective view shown in Fig. 4 shows the primary characteristics of the capacitor of the present invention (A) and the conventional product (A).
(a) is the dielectric loss tangent (TAX).
0(1)... Element, (2)... Protective film, (3)... Room temperature non-adhesive adhesive protective film No. 4 (b) (C) (d)

Claims (1)

【特許請求の範囲】[Claims] (1)  コンデンサにおける、誘電体相互間又は、保
護材料相互間の密着及び誘電体と電極の密着を目的とし
て、表面に、常温非粘着で且つ60°C以上で粘着性を
有する糊をコーティングしたプラスチックフィルム又は
、金属化プラスチックフィルム又は、絶縁紙又は、金属
化絶縁紙を使用することを特徴としたコンデンサ。
(1) For the purpose of adhesion between dielectric materials or protective materials and adhesion between dielectric materials and electrodes in a capacitor, the surface is coated with glue that is non-adhesive at room temperature and adhesive at 60°C or higher. A capacitor characterized by using a plastic film, a metalized plastic film, an insulating paper, or a metalized insulating paper.
JP10983481A 1981-07-13 1981-07-13 Condenser Granted JPS5810813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10983481A JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10983481A JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Publications (2)

Publication Number Publication Date
JPS5810813A true JPS5810813A (en) 1983-01-21
JPH0252420B2 JPH0252420B2 (en) 1990-11-13

Family

ID=14520379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10983481A Granted JPS5810813A (en) 1981-07-13 1981-07-13 Condenser

Country Status (1)

Country Link
JP (1) JPS5810813A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963713A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPS5963712A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPS61194815A (en) * 1985-02-25 1986-08-29 松下電器産業株式会社 Capacitor
JPS61194816A (en) * 1985-02-25 1986-08-29 松下電器産業株式会社 Capacitor
JPS61207009A (en) * 1985-03-12 1986-09-13 太陽通信工業株式会社 Manufacture of capacitor for high pressure

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4897045A (en) * 1972-03-24 1973-12-11
JPS4985546A (en) * 1972-12-23 1974-08-16
JPS50114566A (en) * 1974-02-26 1975-09-08
JPS50156658A (en) * 1974-06-08 1975-12-18
JPS5381942A (en) * 1976-12-20 1978-07-19 Marukon Denshi Kk Method of making capacitor
JPS53132755A (en) * 1977-04-22 1978-11-18 Matsushita Electric Ind Co Ltd Laminated capacitor
JPS5412445A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS5412444A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS54104555A (en) * 1978-02-02 1979-08-16 Matsushita Electric Ind Co Ltd Doubleeside metallized film capacitor
JPS54113061A (en) * 1978-02-22 1979-09-04 Matsushita Electric Ind Co Ltd Layerrbuilt capacitor
JPS54136648A (en) * 1978-04-14 1979-10-23 Fujitsu Ltd Method of producing film condensor
JPS56155525A (en) * 1980-05-02 1981-12-01 Unitika Ltd Plastic film capacitor
JPS5715412A (en) * 1980-06-30 1982-01-26 Unitika Ltd Plastic film capacitor

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4897045A (en) * 1972-03-24 1973-12-11
JPS4985546A (en) * 1972-12-23 1974-08-16
JPS50114566A (en) * 1974-02-26 1975-09-08
JPS50156658A (en) * 1974-06-08 1975-12-18
JPS5381942A (en) * 1976-12-20 1978-07-19 Marukon Denshi Kk Method of making capacitor
JPS53132755A (en) * 1977-04-22 1978-11-18 Matsushita Electric Ind Co Ltd Laminated capacitor
JPS5412445A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS5412444A (en) * 1977-06-30 1979-01-30 Nichicon Capacitor Ltd Film capacitor
JPS54104555A (en) * 1978-02-02 1979-08-16 Matsushita Electric Ind Co Ltd Doubleeside metallized film capacitor
JPS54113061A (en) * 1978-02-22 1979-09-04 Matsushita Electric Ind Co Ltd Layerrbuilt capacitor
JPS54136648A (en) * 1978-04-14 1979-10-23 Fujitsu Ltd Method of producing film condensor
JPS56155525A (en) * 1980-05-02 1981-12-01 Unitika Ltd Plastic film capacitor
JPS5715412A (en) * 1980-06-30 1982-01-26 Unitika Ltd Plastic film capacitor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963713A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPS5963712A (en) * 1982-10-04 1984-04-11 ニツセイ電機株式会社 Method of producing film condenser
JPH024130B2 (en) * 1982-10-04 1990-01-26 Nissei Electric
JPH024129B2 (en) * 1982-10-04 1990-01-26 Nissei Electric
JPS61194815A (en) * 1985-02-25 1986-08-29 松下電器産業株式会社 Capacitor
JPS61194816A (en) * 1985-02-25 1986-08-29 松下電器産業株式会社 Capacitor
JPS61207009A (en) * 1985-03-12 1986-09-13 太陽通信工業株式会社 Manufacture of capacitor for high pressure
JPH0572734B2 (en) * 1985-03-12 1993-10-12 Taiyo Tsushin Kogyo Kk

Also Published As

Publication number Publication date
JPH0252420B2 (en) 1990-11-13

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