JPS58106941U - Transfer molding equipment - Google Patents

Transfer molding equipment

Info

Publication number
JPS58106941U
JPS58106941U JP483682U JP483682U JPS58106941U JP S58106941 U JPS58106941 U JP S58106941U JP 483682 U JP483682 U JP 483682U JP 483682 U JP483682 U JP 483682U JP S58106941 U JPS58106941 U JP S58106941U
Authority
JP
Japan
Prior art keywords
frame
detection pin
transfer molding
molding equipment
molds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP483682U
Other languages
Japanese (ja)
Other versions
JPS629719Y2 (en
Inventor
小沼　光仁
秀次 森
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP483682U priority Critical patent/JPS58106941U/en
Publication of JPS58106941U publication Critical patent/JPS58106941U/en
Application granted granted Critical
Publication of JPS629719Y2 publication Critical patent/JPS629719Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ２つのモールド金型の間にり゜−ドフレームをセッティ
ングし、該モールド金型間に形成されるキャビイテイ内
番と樹脂を注入し成珍するトランスフ．ア歳形装置にお
いて、前記膏一ルド金型内の正規のセッティング時のリ
ード７レームのガ、イド穴に対応する位置にミスセツ９
４ング検知ピンを具備し、該ミ′ス゜セッティング検知
ピン仲゛弾袢体“により尊ガイド穴方向に押圧されるよ
うにしてなり、該ミスセッティング検出ピンの位置を検
知する挙段を具一し、該リード７レームのセッティング
状態を検知するようにしてなる二とを特徴とするトラ，
ンスファ一晟形装置。A bridge frame is set between two molds, and a cavity is formed between the molds, and a resin is injected into the transfer frame. In the molding machine, there is a misset 9 in the position corresponding to the guide hole of the lead 7 frame during the regular setting in the mold.
The present invention is equipped with a four-ring detection pin, which is pressed in the direction of the guide hole by the intermediate setting detection pin, and includes steps for detecting the position of the missetting detection pin. and detecting the setting state of the lead 7 frame.
Nsfa one year type device.
JP483682U 1982-01-18 1982-01-18 Transfer molding equipment Granted JPS58106941U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP483682U JPS58106941U (en) 1982-01-18 1982-01-18 Transfer molding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP483682U JPS58106941U (en) 1982-01-18 1982-01-18 Transfer molding equipment

Publications (2)

Publication Number Publication Date
JPS58106941U true JPS58106941U (en) 1983-07-21
JPS629719Y2 JPS629719Y2 (en) 1987-03-06

Family

ID=30017666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP483682U Granted JPS58106941U (en) 1982-01-18 1982-01-18 Transfer molding equipment

Country Status (1)

Country Link
JP (1) JPS58106941U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105538567A (en) * 2015-12-30 2016-05-04 徐盼 Plastic mold

Also Published As

Publication number Publication date
JPS629719Y2 (en) 1987-03-06

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