JPS58106777A - Connector device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connector device for connecting a motherboard and a unit board in an electronic device using a printed sheet metal.

Depending on the amount, the connector for this oyster is the first bad a.

A configuration as shown in B has been used. In the figure, 1 is a partition plate that is a part of the casing that houses the printed board;
2 is a motherboard provided below the partition plate 1 and fixed thereto (not shown); 3 is a unit board provided above the partition plate 1; the unit board is fixed to the partition plate 1 with screws 4; It has become so. Reference numeral 6 indicates a connector of the unit board, 6 indicates a through hole with a rectangular cross section provided in the partition plate 1, and 7
is fitted into the through hole 6 of the partition plate, and the partition plate 1 and the screw 8
9 is a pull-out bin for connector 7, 1o is a small filter element, 1
1 is the shield case provided below the connector 7, and the screw 1
2 to the partition plate 1. 13 is a groove provided in a band shape around the connector 7; 14 is the groove 1;
3 filled backing material with elasticity and conductivity,
Reference numeral 16 indicates an end of a printed pattern provided on the motherboard 2, and reference numeral 16 indicates a lead wire of the small filter element 1o.

In the connector configured as described above, the lead wire 15 of the small filter element 10 is connected to the end portion 15 of the printed pattern on the shimabu board 6 via the connector 7 on the unit board. The shield case 11 is provided for the purpose of preventing electromagnetic radiation from the bottle of the connector 7 or the small filter collector 10.

However, the above configuration has the disadvantage that the volume of the connector and the connecting portion connected thereto is too small, making it unsuitable for downsizing the device, and requiring a large number of connection points, resulting in a lack of mass production.

The present invention aims to provide a connector that eliminates the above-mentioned drawbacks, and will be described using an embodiment thereof with reference to the drawings.

In FIG. 2, 16 is a ring-shaped ferrite element;
Reference numeral 7 denotes a capacitor section, which forms a capacitor between the capacitor and the ground as described later. Other parts that are the same as those shown in FIG. 1 are given the same reference numerals.

In the above configuration, the ferrite element 16 can be represented isometrically as a loss resistance R and an inductance L connected in parallel with the loss resistance R by passing the lead 9 through the through hole in the center of the ring as shown in FIG. Therefore, if the lead 9 passes through the small ferrite element 16 and the rear capacitor section 17 is inserted so as to have a capacitance C between it and the ground, the inductance L and capacitance C will be generated as shown in FIG. Since a low pass filter is formed, high frequency components can be blocked.

The sth parts A to C show the detailed structure of the capacitor section 17, where 2o is a substrate made of a printed board or the like, and 21 is a ground plate made of a conductor attached to the lower part thereof.

22 is a disk-shaped electrode surface provided on the upper part of the substrate 17;
3 is a through hole provided in the center of the electrode surface 22, and a through hole 3 is provided at the center of the electrode surface 22;
It also has a structure that penetrates at the same time.

Reference numeral 23 denotes a ring-shaped insulating portion provided around the through hole 23 of the ground plate 21, with the conductive surface removed. According to the above structure, as shown in FIG.
The electrode surface 22 and the ground plate 2 are connected through a material (dielectric constant ε) of 0.
The dimensions of the electrode surfaces 22 and the distance between adjacent through holes 23 are set so that the main capacitance C1 generated between the two electrode surfaces 22 and the distance between adjacent through holes 23 is sufficiently small compared to the electrical conduction WtC1 between adjacent electrode surfaces. You can choose.

FIG. 7 shows another embodiment in which the electrode surface has a different shape. That is, 22a is a rectangular electrode surface, 22b is an elliptical electrode surface, and 22o and 22d are oval electrode surfaces. Further, the surroundings of the electrode surfaces 22.22a to 22d are also conductive surfaces 2.
1' to have a shielding effect, and
It is also possible to ground the conductive surface 21' to the ground surface 21 through through holes at a plurality of locations as shown by the x marks in such a manner that the coupling capacitance is reduced.

As explained above, according to the present invention, a low-pass filter path consisting of a ferrite ring 6 for blocking high-frequency components and a capacitor formed on a printed board is provided in the vicinity of the connector that connects the unit board and the motherboard. Since the 6/'-" filter circuit is provided, high-frequency coupling between the two boards can be removed and the adverse effects of electrical coupling can be eliminated, and the 6/'-" filter circuit can be formed in a small size.

In addition, since this device requires fewer knots to assemble, it is suitable for km, and its industrial value is great.

[Brief explanation of the drawing]

1A and 1B are a sectional view and a bottom view of a conventional 9 connector device, the second factor is a sectional view of a connector device according to an embodiment of the present invention, and FIG. 3 is an external view of a ferrite element that is a part thereof,
Figure 4 is an equivalent circuit diagram to explain its operation; Figures 5A, B, and C are top, bottom, and cross-sectional views showing the structure of the capacitor; and Figure 6 is the operation of the capacitor. 7A and 7B are a bottom view and a top view of main parts of another embodiment. 1a...Partition plate, 7...Connector, 9
...Lead, 16 ... Ferrite element, 17 ... Printed board top board %21 ...
Earth surface, 22... Electrode surface. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] an electronic device casing; a connector connected to the casing; a printed circuit board through which a pin terminal of the connector passes;
A ferrite ring provided between the connector and the printed circuit board, through which the pin terminal passes, and an electrode surface connected to the pin terminal and provided on the connector main body side surface of the printed circuit board; A connector device in which a capacitor is formed between a ground plane provided on the other surface and grounded to the casing, and a filter circuit is formed by the inductance of the ferrite ring and the capacity of the capacitor.